A method of absorbing heat from two or more devices can employ a two-phase cooling apparatus that pumps low-pressure coolant through two or more fluidly-connected and series-connected heat sink modules. A flow of subcooled single-phase liquid coolant can be provided to an inlet of a first heat sink module in thermal communication with a first device. Within the first heat sink module, the flow of subcooled single-phase liquid coolant can absorb a first amount of heat from the first device as sensible heat. The flow of subcooled single-phase liquid coolant can be transported from an outlet of the first heat sink module to an inlet of a second heat sink module. Within the second heat sink module, the flow of subcooled single-phase liquid coolant can absorb a second amount of heat from the second device partially as sensible heat and partially as latent heat and thereby transform to two-phase bubbly flow.

The disclosure is related to a heat dissipation structure. The heat dissipation structure is adapted to accommodate a fluid and thermally contact a heat source. The heat dissipation structure includes a heat conductive plate and a channel arrangement. The heat conductive plate is configured to thermally contact the heat source. The channel arrangement is located on the heat conductive plate, and the channel arrangement includes a wider channel portion and a narrower channel portion. The wider channel portion is wider than the narrower channel portion, and the wider channel portion is connected to the narrower channel portion so that the channel arrangement forms a loop. The channel arrangement is configured to accommodate the fluid and allow the fluid to absorb heat generated by the heat source through the heat conductive plate so as to at least partially change phase of the fluid.

A cooling device of an embodiment includes an evaporator, a condenser, a first connection pipe, a second connection pipe, and a third connection pipe. A refrigerant is vaporized in the evaporator by heat generated by a heating element. The condenser is located above the evaporator, and configured to condense the vaporized refrigerant by exchanging heat with an external fluid. The first connection pipe guides the refrigerant vaporized by the evaporator to the condenser. The second connection pipe guides the refrigerant condensed by the condenser to the evaporator. The third connection pipe connects a portion of the first connection pipe and a portion of the second connection pipe. A connection position between the third connection pipe and the first connection pipe is higher than a maximum liquid level height of the refrigerant in the second connection pipe during an operation.

A heat dissipation device includes: a heat spreader having a first plate and a second plate, wherein the plates are connected to form a receiving space therebetween; a first capillary material provided on the first plate, the second plate, or both; at least one heat pipe having a cavity in communication with the receiving space, wherein the heat pipe is connected to the heat spreader at one end and is outside the heat spreader and closed at the other end; a second capillary material provided on the inner wall of the heat pipe; at least one fiber bundle of an elongated shape, wherein the fiber bundle has a portion in the receiving space and in contact with the first capillary material and another portion extending into the cavity and in contact with the second capillary material; and a working fluid in the receiving space and the cavity.

A temperature regulating apparatus according to the present invention includes an accommodating member configured to accommodate a target object for temperature regulation, and an air bubble generation section configured to generate air bubbles in the liquid contained in the accommodating member.

A heat exchanger includes a core defining a first passageway and a second passageway. The core includes a plurality of unit cells coupled together. Each unit cell of the plurality of unit cells includes a first wall and a second wall. The second wall is spaced from the first wall. The first wall at least partially defines a first passageway portion and a second passageway portion. The second wall at least partially defines the second passageway portion. The second wall extends about the first wall such that the first passageway portion is nested within the second passageway portion.

A heat dissipation module used for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator, a pipe, and a working fluid. The evaporator has a recess at an exterior surface thereof, and is thermally contacted with the heat source to absorb heat generated from the heat source. The pipe is connected to an inner space of the evaporator and forms a loop. The working fluid is filled in the loop, wherein the working fluid in liquid passes through the evaporator, absorbs heat, and is transformed into vapor to flow out of the evaporator.

A manufacturing method of a heat conducting device includes following steps: providing a first plate, which includes a plate body and at least a heat conducting element, wherein the plate body has at least an inserting end disposed corresponding to the heat conducting element and defining a tube, and the heat conducting element is mounted at the tube; providing a second plate, which has a first opening end; disposing a first wick structure on an internal wall of the heat conducting element and a bottom surface of the plate body; disposing a second wick structure on an internal wall of the second plate; and connecting the plate body to the first opening end so as to connect the first plate and the second plate to form a chamber. Accordingly, the heat conducting device has a higher heat conducting efficiency.

A heat exchanger assembly including a housing with an external air inlet, an external air outlet, an internal air inlet, and an internal air outlet. The heat exchanger assembly further includes a heat exchanger with an angled condenser panel, an angled evaporator panel, and a working fluid. The heat exchanger assembly further includes a first fan positioned at the internal air inlet configured to create an internal airflow through the housing from the internal air inlet to the internal air outlet, and a second fan positioned at the external air inlet configured to create an external airflow through the housing from the external air inlet to the external air outlet. The external airflow is isolated from the internal airflow.

An electronic device connected to external heat dissipation device and including chassis, heat source, and heat dissipation assembly. Heat dissipation assembly includes evaporator, tubing, and liquid-cooling plate. Evaporator is in thermal contact with heat source. Tubing includes evaporation portion and condensation portion. Evaporation portion is in fluid communication with condensation portion and in thermal contact with evaporator. Liquid-cooling plate is disposed on chassis and spaced apart from heat source. Liquid-cooling plate includes liquid-cooling accommodation space and is configured to be in fluid communication with external heat dissipation device. Condensation portion is located in liquid-cooling accommodation space. Condensation portion includes first tube part, second tube part and connecting tube parts. Two opposite ends of each connecting tube part are respectively in fluid communication with first and second tube parts. Connecting tube parts are connected in parallel. First and second tube parts are in fluid communication with evaporation portion.