A heat transfer system includes a first vapor chamber, a second vapor chamber spaced from the first vapor chamber, and a flexible thermal strap disposed between and coupled to both the first vapor chamber and the second vapor chamber. The flexible thermal strap permits the second vapor chamber to rotate relative to the first vapor chamber.

A device in a utility distribution system may comprise a housing, a heat source, a first heat sink, a second heat sink, a heat pipe, and a flexible directional thermal interface material (“DTIM”) with a high-conductivity orientation. The first heat sink may be thermally coupled to the heat source. The second heat sink may be attached to the first heat sink, and the flexible DTIM and the heat pipe may be arranged between the first and second heat sinks. The flexible DTIM may be thermally coupled with the first heat sink and the heat pipe. The heat pipe may be capable of movements with respect to the flexible DTIM. During the movements, the heat pipe may maintain the thermal coupling with the flexible DTIM, such that heat present in the first heat sink may be transferred to the heat pipe via the high-conductivity orientation of the flexible DTIM.

A novel heat transfer system is herein proposed involving a coupler which, when attached to a heat sink, defines at least a part of a vapor chamber inside the heat transfer system. The coupler attaches component heat source to the header to a thermally transferring connection with the heat sink.

A thermosiphon includes a condenser; an evaporator that includes a fluid channel and a heat transfer surface, the heat transfer surface defining a plurality of fluid pathways in the fluid channel that extend through the fluid channel, the evaporator configured to thermally couple to one or more heat-generating electronic devices; and a transport member that fluidly couples the condenser and the evaporator, the transport member including a liquid conduit that extends through the transport member to deliver a liquid phase of a working fluid into the fluid pathways, the transport member further including a surface to vertically enclose the plurality of fluid pathways.

A heat exchanger includes a vapor collection pipe, a liquid collection pipe, and an exchange pipeline. The exchange pipeline includes a condensing section, an evaporation section, and a transition section. An upper end of the condensing section is connected to the vapor collection pipe. A lower end of the condensing section is connected to a first end of the transition section. An upper end of the evaporation section is connected to a second end of the transition section. A lower end of the evaporation section is connected to the liquid collection pipe. The evaporation section and the condensing section respectively extend in directions opposite to each other.

A heat sink is provided. The heat sink includes a base board and a rib board. The base board includes a base board cavity, and the rib board includes a rib board cavity. The base board includes a first board face and a second board face. A groove is disposed on the second board face. The base board cavity is filled with a liquid working medium. The rib board includes at least one partition board. The at least one partition board separates the rib board cavity into at least two chambers. The at least two chambers are separately connected to the base board cavity. One end of the rib board is inserted in the base board through the groove. One end of the partition board is located in the base board.

A hybrid heat sink includes a solid heat dissipation module and a TS heat dissipation module. The solid heat dissipation module includes a solid substrate and solid fins. The solid substrate has a first side surface and a second side surface opposite to each other. The first side surface is for contacting a heat source, and the solid fins are connected to the second side surface. The TS heat dissipation module includes a TS substrate and TS fins fixed to the TS substrate. A receiving cavity for receiving a phase-change working medium is formed in the TS substrate, condensation reflux cavities are formed in the TS fins and are communicated with the receiving cavity. The TS substrate is fixed at a mounting opening of the solid substrate with a side surface of the TS substrate being exposed to the first side surface for contacting the heat source.

A process for liquefying a process gas that includes introducing a heat transfer fluid into an active magnetic regenerative refrigerator apparatus that comprises a single stage comprising dual multilayer regenerators located axially opposite to each other.

Photonic and electronic integrated circuits can be cooled using variable conductance heat pipes containing a non-condensable gas in addition to a phase-changing working fluid. To package the heat pipe with a subassembly including the integrated circuits in a standard housing providing a heat sink contact area, the heat pipe is oriented, in some embodiments, with its axis between evaporator and condenser ends substantially perpendicular to the direction along which the integrated circuit subassembly is separated from the heat sink contact area, and a portion of the exterior surface of the heat pipe is thermally insulated, with a suitable thermal insulation structure, from the heat sink contact area.

A heat dissipation structure includes a heat dissipation portion and a heat storage portion. The heat dissipation portion has the heat receiving surface including the contact surface in contact with the semiconductor generating the heat, and dissipates the heat of the semiconductor in contact with the contact surface. The heat storage portion is arranged to sandwich the semiconductor. The heat storage portion has, for example, the heat storage opening portion in which the semiconductor is positioned, and surrounds the semiconductor. The heat storage portion is provided to he in contact with the heat receiving surface, and stores the heat of the semiconductor conducted through the heat dissipation portion.