A heat dissipation device is provided and includes: a temperature equalizing plate unit; at least one first vapor chamber unit and at least one second vapor chamber unit disposed on an outer surface of the temperature equalizing plate unit; at least one first tower fin set disposed on the outer surface of the temperature equalizing plate unit to sleeve the first and second vapor chamber units and partially expose the second vapor chamber unit; and at least one second tower fin set disposed on a part of a surface of the first tower fin set to sleeve the exposed part of the second vapor chamber unit.

A filling pipe for use in high-temperature heat pipe filling operation includes an alkali metal filling unit, metallic pipe fixing unit, hermetic seal cover and stopping net. The alkali metal filling unit has a filling body, a receiving space disposed in the filling body. A feed inlet and a feeding pipe are disposed at the top and bottom of the filling body, respectively. A vacuum-generating component is disposed at the filling body laterally. The metallic pipe fixing unit has a fixing body and a taper opening disposed thereon and adapted to limit the metallic pipe. When the fixing body gets connected to the filling body, the feeding pipe is inserted into metallic pipe. The hermetic seal cover covers separably the feed inlet. The stopping net is movably disposed in the receiving space. Therefore, solid alkali metals are filled into a metallic pipe easily and safely.

A heat dissipating device includes a first casing includes a recessed portion, and a second casing coupled to the first casing. The recessed portion at least partially defines an evaporator section of the heat dissipating device, a condenser section of the heat dissipating device is disposed surrounding the recessed portion, and the first casing and the second casing enclose an internal space of the heat dissipating device. The heat dissipating device further includes a plurality of first support structures arranged in the recessed portion, a plurality of second support structures arranged in the condenser section, and a plurality of heat transfer structures arranged in the recessed portion.

In some examples, a method for additively manufacturing a heat pipe, the method including depositing, via a filament delivery device, a filament to form a heat pipe preform, wherein the filament includes a binder and a metal or alloy powder; and sintering the heat pipe preform to form the heat pipe, the heat pipe including an outer shell, a wicking region, and a vapor transport region defined by the metal or alloy.

In a heat spreading module, a plurality of hollow paths is formed in a thin plate-shaped main body so as to pass though the heating portion, and the hollow paths communicate with each other in a heating portion, a working fluid is enclosed in the hollow paths, a wick is disposed in each of the hollow paths such that a vapor flow path in which vapor of the working fluid flows is formed in each of the hollow paths, a part of each wick is positioned at the heating portion, and the vapor flow paths formed in the hollow paths communicate with each other in the heating portion.

The present disclosure is related to a vapor chamber lid. The vapor chamber lid includes a base plate and a top plate. The base plate includes a plate body, a frame, a plurality of supporting pillars and a chip accommodating portion. The frame surrounds the plate body to define a cooling space. The cooling space is configured to accommodate a working fluid. The supporting pillars are located in the cooling space. The chip accommodating portion is located on the plate body of the base plate and is facing away from the cooling space. The top plate is located on the frame of the base plate to seal the cooling space. An external sidewall of the frame of the base plate is coplanar with an external sidewall of the top plate.

A system and method for providing and using wickless capillary driven constrained vapor bubble heat pipes for application in electronic devices with various system platforms are disclosed. An example embodiment includes: a substrate; and a plurality of wickless capillary driven constrained vapor bubble heat pipes embedded in the substrate, each wickless capillary driven constrained vapor bubble heat pipe including a body having a capillary therein with generally square corners and a high energy interior surface, and a highly wettable liquid partially filling the capillary to dissipate heat between an evaporator region and a condenser region.

An assembly structure of a heat pipe and a vapor chamber and an assembly method thereof are provided. The structure includes a vapor chamber, a heat pipe, a porous sintered structure, and a working fluid. The vapor chamber includes a lower housing and an upper housing, a cavity is formed between the upper housing and the lower housing, and the upper housing includes a through hole and a circular wall. The heat pipe includes an opening. The open end of the heat pipe is disposed perpendicularly corresponding to the circular wall and communicates with the through hole. A block portion is formed on the heat pipe close to the opening. The porous sintered structure is formed between the through hole and the block portion. The working fluid is filled into the cavity.

A heat dissipating structure and a water-cooling heat dissipating apparatus including the structure are disclosed. The heat dissipating structure includes a vapor chamber, plural heat pipes and a heat dissipating member, and the vapor chamber has a hollow slot penetrating through the vapor chamber, and the vapor chamber also has a cavity. Each heat pipe is vertically installed to the vapor chamber and communicated with the cavity. The heat dissipating member includes a substrate and plural fins integrally extended from the substrate and seals the hollow slot by a substrate, so as to improve the thermal conduction and dissipation of the heat dissipating structure and the water-cooling heat dissipating apparatus.

A vapor chamber includes a first cover, a second cover, a sealing ring and a sealing plug. The first cover has a thermal contact surface. The second cover is coupled with the first cover so as to form an interior space together, and the second cover has a vent hole. The sealing ring has a channel and at least one opening. The opening is in fluid communication with the channel, the sealing ring is clamped between the first cover and the second cover, and the vent hole is in fluid communication with the interior space via the channel and the opening. The vent hole and the channel are plugged with the sealing plug so as to seal the interior space.