A pump-augmented Loop Heat Pipe (LHP) includes a conventional LHP evaporator/reservoir assembly; one or more additional evaporators; a condenser; a condenser bypass; and a pump upstream of the condenser and condenser bypass and configured to pump fluid generally toward the one or more additional evaporators.

An integrated liquid cooling device with a heat-resisting structure includes an internal circulation type liquid cooling radiator, a liquid cooling head and a liquid pump. A liquid collection box of the internal circulation type liquid cooling radiator has an air heat insulation space inside, which divides the interior into a cold liquid chamber and a hot liquid chamber, so that the hot liquid flowing into the hot liquid chamber is prohibited from conducting heat to the cold liquid in the cold liquid, preventing the cold liquid from being abnormally heated and degrading the cooling effect. In addition, the two ends of the radiator pipes of the internal circulation type liquid cooling radiator form a respective trumpet pipe wall that is stuck in the liquid collection box, which can increase the strength of the connection in the liquid collection box.

A liquid-cooled plate and a heat dissipation device are disclosed. The liquid-cooled plate includes a single-phase channel and a two-phase channel. First fins are spaced apart in the single-phase channel and second fins are spaced apart in the two-phase channel. The first fins are configured to perform a heat exchange with a liquid-state coolant flowing through the single-phase channel to convert the liquid-state coolant after the heat exchange into a gas-liquid two-phase coolant, and the second fins are configured to perform a heat exchange with a gas-liquid two-phase coolant flowing through the two-phase channel to output a coolant after the heat exchange.