A heat dissipation device includes a base plate and a plurality of fins arranged on the base plate. Each fin includes a fin body including a first metal sheet and a second metal sheet coupled to each other, wherein the fin body is curved and includes a first portion and a second portion transverse to the first portion, an evaporation channel defined in the first portion, one or more connecting channels disposed in the first portion and in fluid communication with the evaporation channel, a condensation channel defined in the second portion, and one or more auxiliary channels disposed in the second portion and in fluid communication with the one or more connecting channels and the condensation channel.

A temperature plate device includes a plate body and a bent structure. The plate body includes a first plate and a second plate. A chamber is defined by the first plate and the second plate. The first plate has a first step section. The second plate has a second step section corresponding to the first step section. The bent structure is connected to and traverses the first step section between the first step section and the second step section.

A temperature plate device includes a plate body and a bent structure. The plate body includes a first plate and a second plate. A chamber is defined by the first plate and the second plate. The first plate has a first step section. The second plate has a second step section corresponding to the first step section. The bent structure is connected to and traverses the first step section between the first step section and the second step section.

A display device is disclosed. The display device includes a display panel, a vapor chamber positioned behind the display panel, a board, which is positioned behind the vapor chamber and is coupled to the vapor chamber, and an adhesive member disposed between the display panel and the vapor chamber so as to be coupled thereto, wherein the vapor chamber includes a first plate, which defines a front surface thereof and faces the display panel, a second plate, which defines a rear surface thereof and is coupled to the first plate, and fluid flowing in a space defined between the first plate and the second plate, and wherein the first plate includes a coupler, which is depressed rearwards from the first plate and to which the adhesive member is coupled.

A thermal ground plane comprises top and bottom layers that are substantially impervious to fluid and together defining an inner space, a vapour transport mesh layer having a relatively coarse mesh structure and located within said space, and at least one liquid transport mesh layer having a relatively fine mesh structure and located between said vapour transport mesh layer and one of said top and bottom layers, the two said mesh layers being in contact with one another across substantially their entire planar extents. The top and bottom layers are sealed with a substantially fluid tight seal, and said inner space contains a liquid and is partially evacuated.

A thermal ground plane comprises top and bottom layers that are substantially impervious to fluid and together defining an inner space, a vapour transport mesh layer having a relatively coarse mesh structure and located within said space, and at least one liquid transport mesh layer having a relatively fine mesh structure and located between said vapour transport mesh layer and one of said top and bottom layers, the two said mesh layers being in contact with one another across substantially their entire planar extents. The top and bottom layers are sealed with a substantially fluid tight seal, and said inner space contains a liquid and is partially evacuated.

An aerospace galley insert includes an oven defining therein an oven inner cavity for receiving food to be prepared and a fluid supply for supplying fluid comprising water or water vapour to the oven inner cavity. The galley also includes an exterior space, a heat pipe extending between the cavity and the exterior space, a first temperature sensor for detecting a first temperature in the cavity, a second temperature sensor for detecting a second temperature in the exterior space, and a third temperature sensor for detecting a third temperature of the heat pipe where it extends into the exterior space. The system also includes a control unit configured to determine an actual water vapour concentration in the oven inner cavity based on the first, second and third temperatures, and configured to control the fluid supply in order to adjust the actual water vapour concentration to a target water vapour concentration.

A evaporator of a loop heat pipe includes a liquid inlet side portion that extends in a widthwise direction crossing with a lengthwise direction from a liquid inlet side to a vapor outlet side, a plurality of portions that continue to the liquid inlet side portion and extend in the lengthwise direction, a plurality of vapor flow paths that are provided between the plurality of portions and extend in the lengthwise direction, and a vapor outlet side vapor flow path that extends in the widthwise direction and continues to the vapor flow paths. Each of the plurality of portions includes a first groove communicating two adjacent ones of the vapor flow paths.

A method for producing a heat pipe includes the steps: providing a pipe-shaped casing element having a length and an interior; filling a powder with particles into the casing element to form a capillary structure in the casing element; connecting the particles of the powder to one another, wherein the interior enclosed by the casing element is filled with the powder partially or in its entirety at least across a partial area of the length of the casing element, and subsequently the connection of the particles of the powder to one another and preferably also to the casing element in a layer lying against the casing element is established from the outside by inductive heat generation.

A method for producing a heat pipe includes the steps: providing a pipe-shaped casing element having a length and an interior; filling a powder with particles into the casing element to form a capillary structure in the casing element; connecting the particles of the powder to one another, wherein the interior enclosed by the casing element is filled with the powder partially or in its entirety at least across a partial area of the length of the casing element, and subsequently the connection of the particles of the powder to one another and preferably also to the casing element in a layer lying against the casing element is established from the outside by inductive heat generation.