A cooling arrangement for an electric machine (2) and at least one further component (4, 5) of an electric power unit: The cooling arrangement comprises an oil circuit (16), an oil pump (46) circulating oil to the electric machine (2), a first coolant circuit (6) configured to cool the further component (5) of the electric power unit, and coolant radiator arrangement (8a, 8b) in which the coolant in the first coolant circuit (6) is cooled by air, The oil circuit (16) comprises an oil radiator (46), an oil radiator fan (47) configured to provide an adjustable air flow through the oil radiator (46) and a heat exchanger (15) in which heat is transferred between the coolant in the first coolant circuit (6) and the oil in the oil circuit (16).

A cooling arrangement for an electric machine (2) and at least one further component (4, 5) of an electric power unit: The cooling arrangement comprises an oil circuit (16), an oil pump (46) circulating oil to the electric machine (2), a first coolant circuit (6) configured to cool the further component (5) of the electric power unit, and coolant radiator arrangement (8a, 8b) in which the coolant in the first coolant circuit (6) is cooled by air, The oil circuit (16) comprises an oil radiator (46), an oil radiator fan (47) configured to provide an adjustable air flow through the oil radiator (46) and a heat exchanger (15) in which heat is transferred between the coolant in the first coolant circuit (6) and the oil in the oil circuit (16).

A basic structural body for constructing heat dissipation device and a heat dissipation device are disclosed. The heat dissipation device includes a first basic structural body having a wick structure formed on one side surface thereof; and the first basic structural body and the wick structure are structural bodies formed layer by layer. Two pieces of first basic structural bodies can be correspondingly closed together to construct a heat dissipation device internally defining an airtight chamber. In this manner, the heat dissipation device can be designed in a more flexible manner.

A basic structural body for constructing heat dissipation device and a heat dissipation device are disclosed. The heat dissipation device includes a first basic structural body having a wick structure formed on one side surface thereof; and the first basic structural body and the wick structure are structural bodies formed layer by layer. Two pieces of first basic structural bodies can be correspondingly closed together to construct a heat dissipation device internally defining an airtight chamber. In this manner, the heat dissipation device can be designed in a more flexible manner.

Photonic and electronic integrated circuits can be cooled using variable conductance heat pipes containing a non-condensable gas in addition to a phase-changing working fluid. To package the heat pipe with a subassembly including the integrated circuits in a standard housing providing a heat sink contact area, the heat pipe is oriented, in some embodiments, with its axis between evaporator and condenser ends substantially perpendicular to the direction along which the integrated circuit subassembly is separated from the heat sink contact area, and a portion of the exterior surface of the heat pipe is thermally insulated, with a suitable thermal insulation structure, from the heat sink contact area.

Photonic and electronic integrated circuits can be cooled using variable conductance heat pipes containing a non-condensable gas in addition to a phase-changing working fluid. To package the heat pipe with a subassembly including the integrated circuits in a standard housing providing a heat sink contact area, the heat pipe is oriented, in some embodiments, with its axis between evaporator and condenser ends substantially perpendicular to the direction along which the integrated circuit subassembly is separated from the heat sink contact area, and a portion of the exterior surface of the heat pipe is thermally insulated, with a suitable thermal insulation structure, from the heat sink contact area.

The invention relates to a valve (1), comprising a valve housing (4) and a closing body (3) arranged in the valve housing (4) in such a way that the closing body can be moved longitudinally, wherein at least one inlet channel (5) and at least one outlet channel (6) are arranged in the valve housing (4). The closing body (3) interacts with a valve seat (8) formed on the valve housing (4) by means of the longitudinal motion of the closing body and thereby opens and closes at least one hydraulic connection between the at least one inlet channel (5) and the at least one outlet channel (6). The closing body (3) can be driven by means of a metal-bellows/piston unit (2), wherein the metal-bellows/piston unit (2) has a variable-length metal bellows (20) and a variable-volume working chamber (23) and wherein the metal bellows (20) bounds the working chamber (23) in a sealing manner.

The invention relates to a valve (1), comprising a valve housing (4) and a closing body (3) arranged in the valve housing (4) in such a way that the closing body can be moved longitudinally, wherein at least one inlet channel (5) and at least one outlet channel (6) are arranged in the valve housing (4). The closing body (3) interacts with a valve seat (8) formed on the valve housing (4) by means of the longitudinal motion of the closing body and thereby opens and closes at least one hydraulic connection between the at least one inlet channel (5) and the at least one outlet channel (6). The closing body (3) can be driven by means of a metal-bellows/piston unit (2), wherein the metal-bellows/piston unit (2) has a variable-length metal bellows (20) and a variable-volume working chamber (23) and wherein the metal bellows (20) bounds the working chamber (23) in a sealing manner.

Wire coils are distributed over the bottom surface of an inner chamber of a vapor chamber. The working fluid of the vapor chamber comprises ferromagnetic particles that are attracted to a wire coil as current passes through the wire coil. The resulting increase in the volumetric concentration of ferromagnetic particles in the vicinity of the activated wire coil increases the capacity of the working fluid to remove heat from an integrated circuit component attached to the vapor chamber in the region of the activated wire coil. The vapor chamber wire coils can be activated based on performance metrics associated with the processor units of an integrated circuit component, thereby allowing for the thermal resistance of the working fluid to be dynamically adjusted based on the workload executing on the integrated circuit component and power consumption transients.

Wire coils are distributed over the bottom surface of an inner chamber of a vapor chamber. The working fluid of the vapor chamber comprises ferromagnetic particles that are attracted to a wire coil as current passes through the wire coil. The resulting increase in the volumetric concentration of ferromagnetic particles in the vicinity of the activated wire coil increases the capacity of the working fluid to remove heat from an integrated circuit component attached to the vapor chamber in the region of the activated wire coil. The vapor chamber wire coils can be activated based on performance metrics associated with the processor units of an integrated circuit component, thereby allowing for the thermal resistance of the working fluid to be dynamically adjusted based on the workload executing on the integrated circuit component and power consumption transients.