The present invention relates to transfer of heat by thermosiphon blocks, thermosiphons or thermosiphon systems configured to be used or assembled to transfer heat. Thermosiphon block configured for a refrigerant to circulate between a first header and a second header interconnected with a fluid communicator arrangement comprising multiple MPE-tubes with fins in-between. The first header may have a receiving volume adapted to receive liquid refrigerant and to distribute the liquid refrigerant to the second header via a liquid communicator. The bock may be sealed. The invention also relates to a thermosiphon system comprising at least a first thermosiphon block. The first thermosiphon block may be configured as an evaporator with the receiving volume in the first header connected to a condenser. The thermodynamic system may have a piping between the first thermosiphon block and the condenser. The first thermosiphon block may be configured to be placed inside of a building, housing or a cabinet.

The present invention relates to transfer of heat by thermosiphon blocks, thermosiphons or thermosiphon systems configured to be used or assembled to transfer heat. Thermosiphon block configured for a refrigerant to circulate between a first header and a second header interconnected with a fluid communicator arrangement comprising multiple MPE-tubes with fins in-between. The first header may have a receiving volume adapted to receive liquid refrigerant and to distribute the liquid refrigerant to the second header via a liquid communicator. The bock may be sealed. The invention also relates to a thermosiphon system comprising at least a first thermosiphon block. The first thermosiphon block may be configured as an evaporator with the receiving volume in the first header connected to a condenser. The thermodynamic system may have a piping between the first thermosiphon block and the condenser. The first thermosiphon block may be configured to be placed inside of a building, housing or a cabinet.

A cooling system, includes: an evaporator configured to take heat from a heat source by latent heat of evaporation of liquid; an aspirator configured to suck vapor generated in the evaporator and decompress an inside of the evaporator; a liquid supplying unit configured to supply liquid to the aspirator and the evaporator; and a gas mixing unit configured to mix gas into the liquid to be supplied from the liquid supplying unit to the evaporator.

A cooling system, includes: an evaporator configured to take heat from a heat source by latent heat of evaporation of liquid; an aspirator configured to suck vapor generated in the evaporator and decompress an inside of the evaporator; a liquid supplying unit configured to supply liquid to the aspirator and the evaporator; and a gas mixing unit configured to mix gas into the liquid to be supplied from the liquid supplying unit to the evaporator.

An airstream cooling assembly includes an evaporator and a first and second condenser. The evaporator is configured to have a first airstream directed over its outer surface and to change the phase of a primary cooling medium from liquid to gas. The first condenser is configured to have a second airstream directed over its outer surface, transfer heat from the primary cooling medium, and change the phase of the primary cooling medium from gas to liquid. The second condenser is configured to accept a secondary cooling medium, and when accepting the secondary cooling medium, to receive the primary cooling medium from the evaporator, transfer heat from the primary cooling medium, and change the phase of the primary cooling medium from gas to liquid. The evaporator is configured to receive the primary cooling medium in the liquid phase from at least one of the first condenser and the second condenser.

An airstream cooling assembly includes an evaporator and a first and second condenser. The evaporator is configured to have a first airstream directed over its outer surface and to change the phase of a primary cooling medium from liquid to gas. The first condenser is configured to have a second airstream directed over its outer surface, transfer heat from the primary cooling medium, and change the phase of the primary cooling medium from gas to liquid. The second condenser is configured to accept a secondary cooling medium, and when accepting the secondary cooling medium, to receive the primary cooling medium from the evaporator, transfer heat from the primary cooling medium, and change the phase of the primary cooling medium from gas to liquid. The evaporator is configured to receive the primary cooling medium in the liquid phase from at least one of the first condenser and the second condenser.

The invention relates to a device for operating a thermodynamic cycle, in particular an ORC process, comprising: a feed pump for conveying liquid working medium to an evaporator by increasing the pressure; the evaporator for evaporating and optionally additionally superheating the working medium by supplying heat; an expansion machine for producing mechanical energy by expanding the evaporated working medium; and at least two condensers connected in parallel between the expansion machine and the feed pump for condensing and optionally subcooling the expanded working medium. The invention further relates to a corresponding method for operating a thermodynamic cycle.

A flat heat pipe with a two-phase liquid-vapor working fluid, includes a first plate receiving thermal energy from a heat source, a second plate transferring thermal energy to a cold source, an edge to form a hermetically sealed enclosed internal space, a capillary structure interposed between the first and second plates, vaporization channels adjacent to the first plate, condensation channels adjacent to the second plate, a transfer passage placing the evaporation channels in communication with the condensation channels for the transport of vapor, and a collection channel forming a reservoir, in fluid communication with each condensation channel. The collection channel is adjacent to the second plate, such that the collection channel can pump and store the excess liquid phase.

A heat dissipation module being disposed in an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator, a pipe, a magnetic field generator and a plurality of magnetic powder. The heat source is heat conducting to the evaporator. The pipe is connected to the evaporator to form a loop therewith, and a working fluid is filled in the loop. The magnetic field generator is disposed outside of the evaporator. The magnetic powder is movably disposed in the evaporator. A magnetic field generated by the magnetic field generator drives the magnetic powder to form a channel in the evaporator where the working fluid passes through. The heat generated by the heat source is transmitted to the evaporator, and the working fluid in liquid phase absorbs the heat and is phase-transited to vapor phase and flows from the evaporator towards the pipe.

The present disclosure relates to thermochemical heat storage units. The teachings thereof may be embodied in systems and methods for operating, including charging and discharging, a thermochemical heat storage unit. For example, a method for operating a thermochemical heat storage unit may include: producing a first steam and feeding it to a heat exchanger; partially condensing the steam with release of its thermal energy, in the heat exchanger; subsequently pressurizing water condensed from the steam; feeding the pressurized water to the heat exchanger; evaporating the water into a second steam; and storing at least a portion of the second steam in a steam storage unit.