Certain aspects of the present disclosure generally relate to techniques for cooling electronic devices using thermosiphons having one or more micro-pumps at least partially disposed therein. A provided thermosiphon generally includes a fluid; a first evaporator configured to evaporate the fluid, wherein the first evaporator has an inlet and an outlet; a first condenser configured to condense the fluid, wherein the first condenser has an inlet and an outlet; a first channel coupled between the outlet of the first evaporator and the inlet of the first condenser; a second channel coupled between the outlet of the first condenser and the inlet of the first evaporator; and a first micro-pump located in the second channel and operable to pump the fluid in the second channel from the first condenser to the first evaporator.

Certain aspects of the present disclosure generally relate to techniques for cooling electronic devices using thermosiphons having one or more micro-pumps at least partially disposed therein. A provided thermosiphon generally includes a fluid; a first evaporator configured to evaporate the fluid, wherein the first evaporator has an inlet and an outlet; a first condenser configured to condense the fluid, wherein the first condenser has an inlet and an outlet; a first channel coupled between the outlet of the first evaporator and the inlet of the first condenser; a second channel coupled between the outlet of the first condenser and the inlet of the first evaporator; and a first micro-pump located in the second channel and operable to pump the fluid in the second channel from the first condenser to the first evaporator.

A transfer-of-mass system for increasing rotational energy output thereof includes a sealed container having a central axis and an outer wall radially spaced apart from the central axis. A liquid partially fills the container. A motor causes the container to rotate about its central axis at a speed of rotation such that the liquid is acted upon by centrifugal forces to move it to the container's outer wall. Energy is applied to the liquid to cause at least a portion of the liquid at the container's outer wall to move towards the container's central axis wherein the container rotates faster than the speed of rotation caused by the motor.

Examples of the disclosure relate to an oscillating heat pipe comprising for cooling components within a bendable electronic device. The oscillating heat pipe comprises at least one condenser region to be positioned in a first portion of the bendable electronic device and at least one evaporator region to be positioned in a second portion of the bendable electronic device. The oscillating heat pipe also comprises at least one bendable region provided between the condenser region and the evaporator region and configured to extend across a hinge of a bendable electronic device wherein at least one bendable region comprises a polymer tubing supported by a flexible helical support structure.

A radiator system uses an innovative passive control scheme in combination with dependable mechanical design features to meet or exceed the requirements for orbital applications. The disclosed radiator system is unique because we target an extremely high turndown ratio of 200:1 with an entirely passive two-phase pumped loop using ammonia as the working fluid. Sections of the radiator will selectively freeze to assist the turndown, and the mechanical design of the radiator can handle the high pressures experienced during such freezing and thawing events.

A radiator system uses an innovative passive control scheme in combination with dependable mechanical design features to meet or exceed the requirements for orbital applications. The disclosed radiator system is unique because we target an extremely high turndown ratio of 200:1 with an entirely passive two-phase pumped loop using ammonia as the working fluid. Sections of the radiator will selectively freeze to assist the turndown, and the mechanical design of the radiator can handle the high pressures experienced during such freezing and thawing events.

A liquid cooling system is provided. The liquid cooling system comprises a radiator having first and second built-in fluid tank reservoirs, a multi-fan unit, at least one heat exchanger pump, and a plurality of fluid conduits. The radiator comprises at least one first flow port and at least one second flow port for attachment of the plurality of fluid conduits thereto for actively moving a cooling fluid to and from the at least one heat exchanger pump. Heat generated from a heat generating device is transferred to cooling fluid flowing through the at least one heat exchanger pump, and then output to the radiator. The heated cooling fluid flows through the radiator having the built-in fluid tank, cooling along a plurality of heat exchanger fins, whereby the multi-fan unit expels heat therefrom. The cooling fluid flows to the heat exchanger pump to once again begin the cooling loop.

A structure includes: a heat insulating layer; an evaporator provided on one surface side of the heat insulating layer; a condenser provided on the other surface side of the heat insulating layer; a vapor flow path for guiding refrigerant vapor generated as a result of evaporation at the evaporator to the condenser; and a liquid refrigerant flow path for guiding a liquid refrigerant generated as a result of condensation at the condenser to the evaporator, in which the evaporator has a wick layer for evaporating the refrigerant stored on a lower portion side with heat from one surface side of the evaporator while suctioning up the refrigerant by capillarity and holding the refrigerant, and the evaporator and the condenser are installed so as to overlap by ½ or more in the direction in which the wick layer suctions up the refrigerant.

A cooling system can include an input channel from which a fluid enters the cooling system and an output channel from which the fluid exits the cooling system. The cooling system can include a vapor buffer and a liquid buffer, and the connections between the two buffers. Vapor buffer valves arranged in fluid channels of the cooling system can be controlled to, in a first mode, disconnect the vapor buffer from an input channel, and, in a second mode, connect the vapor buffer to the input channel and disconnect the vapor buffer from the input of the condenser or the port that is attachable to the input of the condenser.

A cooling assembly includes an evaporator containing a primary cooling medium, a passive condenser, and a heat exchanger. When a secondary cooling medium is provided to the heat exchanger, the primary cooling medium in the gas phase switches from being received by the passive condenser to the heat exchanger without operating any valves located between the evaporator and the passive condenser and between the evaporator and the heat exchanger. The primary cooling medium circulates between the evaporator and the passive condenser and between the evaporator and the heat exchanger by natural circulation and gravity without a pump in the flow path of the primary cooling medium between the heat exchanger and the evaporator and between the passive condenser and the evaporator to circulate the primary cooling medium.