An air duct for cooling dual socket information handling systems divides airflow into two parallel paths. Inner walls, a chassis divider and a top surface form a main channel. An intermediate divider and intermediate wall are positioned between the sockets, wherein airflow exiting the first socket is prevented from flowing through the second socket. Lower lateral channels and upper lateral channels are formed between each inner wall and a corresponding outer wall, wherein lower lateral channels allow airflow to bypass the first socket to cool the second socket and the upper lateral channels allow heated airflow exiting the first socket to bypass the second socket.

A cyclone cooler device includes a housing that defines an interior channel elongated along a center axis. One or more of the fluid passage or configuration of an inlet end of the channel is shaped to induce a swirling flow of a cooling fluid within the channel while the channel is thermally coupled with one or more heat sources. The swirling flow of the cooling fluid removes thermal energy from and cools the one or more heat sources. During the swirling flow, the cooling fluid rotates around the center axis of the channel while also moving along the length of the center axis. The cooling fluid changes phases during the swirling flow to cool the heat source(s).

A flow-guiding rod includes a cooling channel provided in a rod portion of the flow-guiding rod, and a coolant inlet pipe and a coolant outlet pipe provided on end(s) of the flow-guiding rod. The coolant inlet pipe and the coolant outlet pipe are communicated with the cooling channel.

A heat exchanger has a structure in which a heat exchanger main body through which coolant flows is obliquely installed in a box-shaped enclosure, the heat exchanger main body is constituted by a header pipe and a plurality of heat transfer pipes connected to the header pipe and disposed at predetermined intervals along a surface of a part of the header pipe, the header pipe has an area adjacent to an inner surface of the enclosure, and a seal section is provided between the inner surface of the enclosure and the area of the header pipe adjacent to the enclosure.

Disclosed is a device (2) for regulating the temperature of an electrical element liable to heat up. The device (2) comprises a dielectric fluid circuit comprising sprinkling means (8) for sprinkling the surface of the element with the dielectric fluid and a tank (10) of dielectric fluid. The tank comprises a main volume (12). The main volume is intended to contain the electrical element liable to heat up, and a secondary volume (14) for storing dielectric fluid. The secondary volume is fluidically connected to the sprinkling means. The secondary volume is at least partially peripheral relative to the main volume.

A cooling system is disclosed. The cooling system may comprise a first cooling unit installed at a cooling target, the first cooling unit including a first cooling pipe forming a flow path of a first refrigerant; and a second cooling unit installed at the cooling target, the second cooling unit including a second cooling pipe forming a flow path of a second refrigerant, wherein the first cooling pipe includes a first cooling pipe first end adjacent to a first side of the cooling target, the first refrigerant being introduced into the first cooling pipe first end; and a first cooling pipe second end adjacent to a second side of the cooling target, the first refrigerant being discharged from the first cooling pipe second end, wherein the second cooling pipe includes a second cooling pipe first end adjacent to the first side of the cooling target, the second refrigerant being discharged from the second cooling pipe first end; and a second cooling pipe second end adjacent to the second side of the cooling target, the second refrigerant being introduced into the second cooling pipe second end.

A heat exchanger includes a heat transfer portion configured as a heat exchange flow path and an inlet/outlet formation portion provided with an inlet/outlet. The heat transfer portion includes a hollow interior portion. An interior of the inlet/outlet formation portion is connected to the heat exchange flow path. Heat exchange is performed between the medium passing through the heat exchange flow path and a heat exchange target member arranged on an outer surface of the heat transfer portion. At least a part of the outer surface of the heat transfer portion is configured by a coating sheet formed of a laminate material in which a resin coating layer is provided on at least one surface side of a metal heat transfer layer. An external thickness of the inlet/outlet formation portion is formed to be thicker than an external thickness of the heat transfer portion.

A heat dissipation module used for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator, a pipe, and a working fluid. The evaporator has a recess at an exterior surface of the evaporator, and the heat source is thermally contacted with the recess to transfer a heat generated from the heat source to the recess of the evaporator. The pipe is connected to an inner space of the evaporator and forms a loop. The working fluid is filled in the loop, wherein the working fluid in liquid passing through a portion of the inner space of the evaporator corresponding to the recess absorbs the heat and is transformed into vapor.

A cooling system for a data center includes an evaporative condenser, a pump cabinet and a heat exchange terminal. The pump cabinet has a first branch and a second branch, the first branch including a liquid storage tank and a fluorine pump. An input end of the liquid storage tank is connected to an output end of the evaporative condenser, an output end of the liquid storage tank is connected to an input end of the fluorine pump, and an output end of the fluorine pump is connected to an input end of the heat exchange terminal. The second branch includes a compressor with an input end connected to an output end of the heat exchange terminal and an output end connected to an input end of the evaporative condenser.

A cooling system includes a tank, a heat exchanger, a separation tank, a first tube, a second tube, a third tube, a gas storage device, a fourth tube, a first valve, a second valve and a third valve. A heating element is immersed in a dielectric liquid in the tank. The heat exchanger condenses dielectric vapor of the dielectric liquid. The separation tank is used for a separation operation. The first tube is connected to the tank and the heat exchanger. The second tube is connected to the heat exchanger and the separation tank. The third tube is connected to the separation tank and the tank. The gas storage device stores the dielectric vapor. The fourth tube is connected to the gas storage device and the separation tank.