A two-phase immersion cooling device includes a tank, heating elements, a first condenser, and a lid. An accommodating cavity of the tank bottom accommodates a coolant. The heating elements are disposed in the accommodating cavity and immersed in the coolant. The first condenser is received in the accommodating cavity, located above the coolant and the heating elements, and disposed along sidewalls of the tank. At least one movable second condenser is fixed on the lid or a rear door and disposed in a cavity surrounded by the first condenser. The two-phase immersion cooling device increases the capacity of condensation heat transfer, and the condensation rate and the evaporation rate of the coolant in the tank are balanced, a pressure difference between an inside and an outside of the tank is reduced, a loss of coolant vapor is decreased, and a volume of the two-phase immersion cooling device is reduced.

The application relates to a charging apparatus for inductively charging a separate, mobile apparatus. The charging apparatus includes a cooling system which is configured to enable additional phase change cooling of the mobile apparatus during inductive charging. The charging apparatus includes a flow path for providing a flow path for a phase-change cooling fluid to an interface with the mobile apparatus. The flow path enables cooling of, at least part of, the mobile apparatus when the mobile apparatus is being inductively charged by the charging apparatus. The flow path also includes wick structures that enable the phase-change fluid to be transported via capillary action.

Provided is a heat exchanger to perform heat exchange with a predetermined apparatus, the heat exchanger including a heat exchange channel construction configured to form a heat exchange area for heat exchange with the apparatus and to perform heat exchange through a flow of a heat transfer medium. The heat exchange channel construction includes a plurality of heat exchange channels each in a spiral shape, and the heat exchange channel construction includes an independent channel heat exchange area in which one of a first heat exchange channel and a second heat exchange channel included in the plurality of heat exchange channels independently performs heat exchange in a structure that includes at least one of a single channel structure and a branch channel structure and an interlocked heat exchange area in which the first heat exchange channel and the second heat exchange channel perform heat exchange through interlocking.

A heat exchanger system may have a base, a mounting apparatus for attaching the base to a device, a gasket shelf for placing a gasket, a dissipation member for dissipating heat, and heat generator attachment sites for absorbing heat. A mounting apparatus may have finger-like extensions which flex and draw the base into contact with an underlying electronic device from which the system conducts heat. A base may also have an integrated heat pipe clamp attachment forming an aperture in the base into which a heat pipe may extend and may be clamped in thermal communication. The dissipation device may be a series of fins and troughs and a fan may direct air over the dissipation device to cool the apparatus.

The disclosure is related to a heat dissipation structure. The heat dissipation structure is adapted to accommodate a fluid and thermally contact a heat source. The heat dissipation structure includes a heat conductive plate and a channel arrangement. The heat conductive plate is configured to thermally contact the heat source. The channel arrangement is located on the heat conductive plate, and the channel arrangement includes a wider channel portion and a narrower channel portion. The wider channel portion is wider than the narrower channel portion, and the wider channel portion is connected to the narrower channel portion so that the channel arrangement forms a loop. The channel arrangement is configured to accommodate the fluid and allow the fluid to absorb heat generated by the heat source through the heat conductive plate so as to at least partially change phase of the fluid.

A coldplate assembly includes a plurality of leak-tight conduit modules provided between a base and a cover to couple a first manifold cavity to a second manifold cavity. Each leak-tight conduit module includes a heat conducting structure and is pre-constructed and pre-tested prior to integration into the coldplate assembly. Each leak-tight conduit module is sealed only near the ends of the module that are disposed in the respective manifold cavity.

A heat dissipation device includes: a heat spreader having a first plate and a second plate, wherein the plates are connected to form a receiving space therebetween; a first capillary material provided on the first plate, the second plate, or both; at least one heat pipe having a cavity in communication with the receiving space, wherein the heat pipe is connected to the heat spreader at one end and is outside the heat spreader and closed at the other end; a second capillary material provided on the inner wall of the heat pipe; at least one fiber bundle of an elongated shape, wherein the fiber bundle has a portion in the receiving space and in contact with the first capillary material and another portion extending into the cavity and in contact with the second capillary material; and a working fluid in the receiving space and the cavity.

A water-cooling device includes a pump case, at least one winding, a driver and a heat exchange member. The pump case has a top section, a bottom section and a peripheral section together defining a pump chamber. The winding is disposed on a circuit board. The circuit board is disposed on any of the top section, the bottom section and the peripheral section. The driver is disposed in the pump chamber. At least one magnetic member is disposed on the driver in a position corresponding to the winding, whereby the magnetic member can induce and magnetize the winding on the circuit board. The heat exchange member is connected with the pump case. By means of the structural design of the water-cooling device, the volume of the water-cooling device is greatly minified and the structure of the water-cooling device is thinned.

A thermal-interface-material (TIM)-free thermal management apparatus includes a thermally-conductive unitary structure having an integrated circuit (IC) side and cooling system side, the thermally-conductive unitary structure including a plurality of high aspect ratio micro-pillars or porous structures extending from the IC side and a cooling system extending from the cooling system side. The cooling system may be selected from the group consisting of: a vapor chamber, micro-channel cooler, jet-impingement chamber, and air-cooled heat sink. The cooling system and the plurality of high aspect ratio micro-pillars form part of the same homogenous and thermally-conductive unitary structure.

A heat dissipation module used for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator, a pipe, and a working fluid. The evaporator has a recess at an exterior surface thereof, and is thermally contacted with the heat source to absorb heat generated from the heat source. The pipe is connected to an inner space of the evaporator and forms a loop. The working fluid is filled in the loop, wherein the working fluid in liquid passes through the evaporator, absorbs heat, and is transformed into vapor to flow out of the evaporator.