The present invention relates to a heat dissipating module which comprises a first flat shell body and a plurality of second flat shell bodies. The first flat shell body has a first chamber and a first wick structure formed on an inner wall of the first chamber. Each of the second flat shell bodies defines a second chamber which is provided with a working fluid and a second wick structure therein. Each of the second flat shell bodies has a heat pipe plugged and connected to the first flat shell body. Therefore, the working fluid in each of the second chambers flows into the first chamber through the corresponding heat pipes to perform heat dissipation by liquid-vapor circulation.

A system includes a matrix material to remove heat from an object. The matrix material includes a plurality of vascular structures. Each of the vascular structures are filled with a fluid. At least one transducer generates field-induced forces into the fluid within the vascular structures of the matrix material. At least one controller pulses the transducer to generate the field-induced forces into the fluid within the vascular structures. The field-induced forces generate fluid flow within the vascular structures to remove the heat from the object.

A heat dissipation device includes a first and a second housing, at least one pipe, and a working fluid. The first and the second housing internally respectively defines a first and a second chamber, in which a first and a second wick structure is respectively formed, and has at least one first and second opening communicated with the first and the second chamber respectively. The pipe has a pipe body, and a first and second extended portion, which respectively has a first and a second open end, and a first and a second through opening, and is inserted into and connected to the first and the second chamber via the first and the second opening respectively. The pipe internally defines a pipe chamber, in which a pipe wick structure is formed. The working fluid is provided in the first and the second, and the pipe chamber.

In a heat spreading module, a plurality of hollow paths is formed in a thin plate-shaped main body so as to pass though the heating portion, and the hollow paths communicate with each other in a heating portion, a working fluid is enclosed in the hollow paths, a wick is disposed in each of the hollow paths such that a vapor flow path in which vapor of the working fluid flows is formed in each of the hollow paths, a part of each wick is positioned at the heating portion, and the vapor flow paths formed in the hollow paths communicate with each other in the heating portion.

A server including a chassis, a motherboard, a heat source and a heat exchanger. The motherboard is disposed in the chassis. The heat source is disposed on and electrically connected to the motherboard. The heat exchanger includes a first chamber body, a plurality of heat dissipation plates and a plurality of heat dissipation fins. The first chamber body is in thermal contact with the heat source and has a first channel. The plurality of heat dissipation plates are in thermal contact with and inserted into the first chamber body. The plurality of heat dissipation plates each have a second channel. The first channel of the first chamber body is in fluid communication with the second channels of the plurality of heat dissipation plates. The plurality of heat dissipation fins are in thermal contact with the plurality of heat dissipation plates.

An electronics cooling system for an aircraft includes a heat exchanger comprising a coolant circuit, an air circuit, and a fuel circuit such that each of the circuits is in thermal communication with at least one of the other circuits. The coolant circuit is in thermal communication with one or more aircraft electronics. The air circuit is in fluid communication with at least one air source. The fuel circuit is in fluid communication with a fuel tank between the fuel tank and an engine of the aircraft.

Provided are a phase change cooler with enhanced cooling performance and enhanced pressure resistance performance, and an electronic device using such a phase change cooler. The phase change cooler includes a heat receiving unit, a heat dissipating unit, a vapor pipe and a liquid pipe that interconnect the heat receiving unit and the heat dissipating unit to form a loop, and refrigerant encapsulated inside the phase change cooler. The heat receiving unit has an approximately semicircular cross section, and the vapor pipe is coupled to an inclined face of the heat receiving unit.

An embodiment of a reaction chamber is described that comprises a block of a material comprising a heat source positioned in a central location and a continuous channel comprising an inlet positioned at a first peripheral area of the block and an outlet positioned at a second peripheral area of the block, wherein the channel comprises a serpentine path from the inlet past the centrally located heat source to the outlet.

In one example, a portion of a shell includes a shell wall portion that has an interior wall portion and an exterior wall portion located near the interior wall portion. In addition, fluid passageways are disposed between the interior wall portion and the exterior wall portion. One or more of the fluid passageways are defined in part by one or both of the interior wall portion and the exterior wall portion. The fluid passageways form part of heat exchanger that is integrated in the shell.

A refrigerant heat dissipation apparatus has an evaporator, a condenser having a first condensing tube and a second condensing tube, a first refrigerant tube, two second refrigerant tubes, and a refrigerant. The first refrigerant tube is connected between the top of the evaporator and an upper part of a first condensing tube. The second refrigerant tubes are respectively connected with a lower part of the first condensing tube and a lower part of the second condensing tube, so as to form a multi-flow closed-loop cycle. The refrigerant is filled into the multi-flow closed-loop cycle. The controlling of cycling direction of the refrigerant achieves the efficiency in heat dissipating of the refrigerant heat dissipation apparatus.