The present invention is related to an advanced control methodincluding a fast response methodto stabilize, optimize and or maximize the output flow of an evaporation unit via ultrasonic controlled sound or vibration applied to the said evaporation unit. The invention further provides equipment wherein said method is being implemented, such as an evaporation or separation unit.

A heat exchanger that includes a vessel, a cooler within the vessel, the cooler includes a smooth cylindrical interior wall, a cover that seals the vessel, and, a cooling medium filling a portion of the interior of the cooler, wherein the cooler includes sufficient volume to allow the cooling medium to expand during a phase change from a liquid to a solid.

A thermoacoustic device that includes a resonator, wherein the resonator includes a stack. During operation, a cold zone of the stack is configured to receive at least one fluid from a hot zone of the stack; wherein a temperature of the hot zone exceeds a temperature of the cold zone. The thermoacoustic device also includes a conveyor for conveying at least some of the at least one fluid from the cold zone of the stack to the hot zone of the stack.

A heat exchanger (10) of heat pipe configuration for transferring heat between a first and second process streams via a heat transfer fluid comprises: at least one first process stream passage (19); at least one second process stream passage (29); and a shell (11) enclosing the first and second process stream passages (19, 29) within a volume (55). The volume (55), as a result of a heat transfer process, is fully filled with both vapour and liquid phases of the heat transfer fluid. The first and second process stream passages (19, 29) are spaced by a disengagement zone (50) enabling gravitational separation of said vapour and liquid phases and limiting accumulation of liquid phase heat transfer fluid about the first process stream passage(s) (19). Such heat exchangers can be used, among other applications, to replace a flash cooling stage in a Bayer process plant.

A laser weapon system is described. Particularly, embodiments describe subsystems of a laser weapon system including those necessary for laser generation, operational control, optical emission, and heat dissipation configured to provide a lightweight unit of reduced dimensions.

A heat exchanger module including: a hollow chamber having an inner volume configured through which flows a first fluid in fluidic communication with a source of the first fluid, and a fluid outlet; a hollow enclosure extending outwardly from a surface of the hollow chamber wherein the hollow enclosure includes an inner volume through which flows a working fluid that undergoes a phase change in an operative mode of the heat exchanger module, wherein the hollow enclosure is in fluidic communication with a source of the working fluid, and an enclosure root of the hollow enclosure is inserted in the hollow chamber extending into the inner volume such that in an operative mode a working fluid flowing through the hollow chamber from the inlet to the outlet bathes the outer surface of the enclosure root.

An apparatus includes a cargo area with a heat exchanger; a thermal battery system having a phase change material (PCM) with first and second heat exchangers embedded in the PCM; fluid conduits defining fluid passageways interconnecting the cargo area heat exchanger and the first PCM-embedded heat exchanger; and a pump creating a fluid flow through the fluid conduits between the cargo area heat exchanger and the first PCM-embedded heat exchanger. The apparatus also includes external ports configured for connecting to an external charging source for charging the PCM; and fluid conduits defining fluid passageways interconnecting the external ports and the second PCM-embedded heat exchanger. The first PCM-embedded heat exchanger, pump, and cargo area heat exchanger form part of a first closed-loop circuit for transferring heat between the cargo area and the thermal battery system. The second PCM-embedded heat exchanger and external ports do not part of the first closed-loop circuit.