Patent classifications
F28F3/022
Carbon fiber radiator fin system
Systems and methods of manufacture of radiator fins. In one embodiment, a radiator fin made of carbon fiber is provided. In one aspect, the radiator fin is made of carbon fibers forming an interlaced pattern. In another aspect, the interlaced carbon fiber radiator fin is attached directly to a heat pipe, the heat pipe connected to a heat source.
REACTION DEVICE WITH HEAT EXCHANGER AND USE THEREOF
A reaction device is provided with a first wall that defines an interior in which a stirring mechanism is located. A heat exchanger is at least partly provided on the first outer wall surface facing away from the interior and/or on the stirring mechanism, wherein the heat exchanger has a grate structure, and at least two layers are provided which have a grate structure. Thus, it is possible to transfer heat in a precise and efficient manner primarily by means of thermal radiation in endothermic processes at different temperature levels, in particular pyrolysis, gassing, and reforming processes, and thereby use the exhaust heat for other processes.
Heat exchanger
A heat exchanger includes front and rear walls forming a flue gas space such that a fluid flowing through a channel formed in the front and rear walls can exchange heat with flue gas in the flue gas space, in use. An entirety of the back wall extends along a first plane, and the back wall is provided with a back fin. The front wall includes a lower portion extending upwardly along the back wall, and an upper portion extending upwardly from an upper end of the lower portion and outwardly away from the back wall to form a combustion space of a flammable gas between the upper portion and the back wall. The upper portion is provided with a front fin. The front and back fins are arranged symmetrically with respect to a virtual line along which the flammable gas is to be injected into the combustion space.
Heat dissipator and communications device
Embodiments of this application relate to a heat dissipator including a cover plate, an orifice plate, and a base plate that are stacked in sequence. A distribution cavity is disposed between the orifice plate and the cover plate, a heat exchange cavity is disposed between the orifice plate and the base plate, and the distribution cavity communicates with the heat exchange cavity by using through holes disposed on the orifice plate. A plurality of pin fins facing the orifice plate are disposed on a surface of the base plate in the heat exchange cavity, gaps between the plurality of pin fins constitute a fluid passage, and the pin fins include a combination pin fin in contact with the orifice plate, and a flow guiding pin fin that corresponds to the through hole and that has a gap with the through hole.
Method for the production of a cooling plate
In a method for producing a cooling plate, a workpiece in the form of a flat material blank with uniform material thickness is precisely centered in a tool. A substantially radially extending flat peripheral edge of the workpiece is formed by an outer punch of the tool, as the workpiece is held down by an inner punch of the tool and the outer punch is pressed against the peripheral edge to thereby reduce the material thickness of the peripheral edge. Pins are formed on a coolant-swept effective surface of a base of the workpiece by the inner punch through pressing in cooperation with pin forming openings of the tool as the outer punch is held down, such that the pins protrude approximately perpendicular beyond the base and are surrounded by the peripheral edge.
Diffusion bonding heat exchanger
A diffusion bonding heat exchanger includes a first heat transfer plate and a second heat transfer plate. A high-temperature flow path of the first heat transfer plate includes a connection channel portion configured such that a high-temperature fluid can flow across a plurality of channels within at least a range that overlaps a predetermined range in a stacking direction, the predetermined range being a range from a flow path inlet of the second heat transfer plate to a position downstream of the flow path inlet.
Heat exchange cell and method
A heat exchange cell includes a casing, a heat exchanger in which a first heat transfer fluid flows, a feeding zone, and first and second collection chambers for a second heat transfer fluid. The casing can include rear, front, and peripheral side walls. The heat exchanger can be helically-shaped, mounted in the casing, and include at least one tubular duct for the flow of the first heat transfer fluid. The tubular duct can be coiled about a longitudinal axis and define a helix. The feeding zone of the second heat transfer fluid can be defined in the casing coaxially and internally with respect to the helix. The first chamber can be defined externally with respect to the heat exchanger by a radially outer wall thereof and the peripheral side wall. The second chamber can be at least partially delimited by at least one separating element.
Heat dissipation device having anisotropic thermally conductive sections and isotropic thermally conductive sections
A heat dissipation device may be formed having at least one isotropic thermally conductive section (uniformly high thermal conductivity in all directions) and at least one anisotropic thermally conductive section (high thermal conductivity in at least one direction and low thermal conductivity in at least one other direction). The heat dissipation device may be thermally coupled to a plurality of integrated circuit devices such that at least a portion of the isotropic thermally conductive section(s) and/or the anisotropic thermally conductive section(s) is positioned over at least one integrated circuit device. The isotropic thermally conductive section(s) allows heat spreading/removal from hotspots or areas with high-power density and the anisotropic thermally conductive section(s) transfers heat away from the at least one integrated circuit device predominately in a single direction with minimum conduction resistance in areas with uniform power density distribution, while reducing heat transfer in the other directions, thereby reducing thermal cross-talk.
LOW-DRAG, HIGH-EFFICIENCY MICROCHANNEL POLYMER HEAT EXCHANGERS
The disclosed embodiments relate to a system that provides a polymer heat exchanger with internal microscale flow passages. The system includes a set of plates comprised of a polymer that includes internal microscale flow passages, which are configured to carry a liquid. The set of plates is organized into a stack, wherein consecutive plates in the stack are separated by fins to form intervening air passages. The system includes a liquid flow pathway, which flows from a liquid inlet, through the internal microscale flow passages in the stack of plates, to a liquid outlet. It also includes an airflow pathway, which flows from an airflow inlet, through the intervening air passages between the consecutive plates in the stack of plates, to an airflow outlet. The liquid flow pathway flows in a direction opposite to a direction of the airflow pathway to provide a counterflow design that optimizes heat transfer between the liquid flow pathway and the airflow pathway.
PINS FOR HEAT EXCHANGERS
A heat exchanger includes a body defining a flow channel, and a pin extending across the flow channel, the pin including an at least partially non-cylindrical shape. The pin can be a double helix pin including two spiral branches defining a double helix shape. The two branches can include a uniform winding radius. The two branches include a non-uniform winding radius.
The non-uniform winding radius can include a base radius and a midpoint radius, wherein the midpoint radius is smaller than the base radius. The two branches can be joined together by one or more cross-members.