The invention relates to an air heat exchanger 1 for cooling a power electronics component 2, comprising: a carrier plate 3 having an accommodating region 4 for accommodating the power electronics component 2; a heat exchanger plate 7 which is coupled to the carrier plate 3, wherein at least one hermetically sealed cavity 10 for accommodating a working medium 13 is formed and delimited by the carrier plate 3 and the heat exchanger plate 7, wherein the cavity 10 comprises an evaporator 11 and a condenser 12, wherein the evaporator 11 is arranged so as to be spaced apart from the condenser 12 in a heat transport direction 14; cooling ribs 15 which are coupled to the heat exchanger plate 7.

A heat exchanger includes a flow channel operatively connecting a channel inlet to a channel outlet to channel fluid to flow therethrough. The flow channel is defined at least partially by a shape change material. The shape change material changes the shape of the flow channel based on the temperature of the shape change material.

Embodiments of this application relate to a heat dissipator including a cover plate, an orifice plate, and a base plate that are stacked in sequence. A distribution cavity is disposed between the orifice plate and the cover plate, a heat exchange cavity is disposed between the orifice plate and the base plate, and the distribution cavity communicates with the heat exchange cavity by using through holes disposed on the orifice plate. A plurality of pin fins facing the orifice plate are disposed on a surface of the base plate in the heat exchange cavity, gaps between the plurality of pin fins constitute a fluid passage, and the pin fins include a combination pin fin in contact with the orifice plate, and a flow guiding pin fin that corresponds to the through hole and that has a gap with the through hole.

A cooling system that includes an expandable vapor chamber having a condenser side opposite an evaporator side, a condenser side wick coupled to a condenser side wall, an evaporator side wick coupled to an evaporator side wall, and a vapor core positioned between the evaporator side wick and the condenser side wick. The cooling system also includes a vapor pressure sensor communicatively coupled to a controller and a bellow actuator disposed in the vapor core and communicatively coupled to the controller. The bellow actuator is expandable based on a vapor pressure measurement of the vapor pressure sensor.

A water-cooling device with a composite heat-dissipating structure is provided, which includes a casing, a main heat-dissipating structure and a layered heat-dissipating structure. The casing is used for accommodating a working fluid, and the casing includes a heat-dissipating substrate. The main heat-dissipating structure includes a plurality of heat-dissipating fins arranged vertically and in parallel to each other that are connected to the heat-dissipating substrate. The layered heat-dissipating structure includes a plurality of horizontal heat-dissipating bodies arranged horizontally and in parallel to each other that are connected to the plurality of heat-dissipating fins arranged vertically and in parallel to each other, and a distance between the plurality of horizontal heat-dissipating bodies arranged horizontally and in parallel to each other is greater than or equal to a distance between the plurality of heat-dissipating fins arranged vertically and in parallel to each other.

A heat exchanger includes a flow channel operatively connecting a channel inlet to a channel outlet to channel fluid to flow therethrough. The flow channel is defined at least partially by a shape change material. The shape change material changes the shape of the flow channel based on the temperature of the shape change material. The shape change material can include a shape-memory alloy, for example. The shape-memory alloy can include at least one of a nickel-titanium alloy (NiTi), Cu—Al—(X), Cu—Sn, Cu—Zn—(X), In—Ti, Ni—Al, Fe—Pt, Mn—Cu, or Fe—Mn—Si.

A heat sink includes a bottom plate, a liquid barrier structure and a plurality of heat conducting fins. The liquid barrier structure is located on the periphery of the bottom plate. The heat conducting fins are arranged on the bottom plate. The heat conducting fins are located in the liquid barrier structure.

A heat exchanger includes a body defining a flow channel, and a pin extending across the flow channel, the pin including an at least partially non-cylindrical shape. The pin can be a double helix pin including two spiral branches defining a double helix shape. The two branches can include a uniform winding radius. The two branches include a non-uniform winding radius. The non-uniform winding radius can include a base radius and a midpoint radius, wherein the midpoint radius is smaller than the base radius. The two branches can be joined together by one or more cross-members.

Some embodiments are directed to a kit of parts that includes heat sink parts, each heat sink part having a contact area for contacting a surface of an electronic device. The heat sink parts are connected but are spaced apart to allow them to adjust and keep their contact areas contacting the surface of the electronic device when the surface is distorted, for example due to heating. A heat sink part includes at least two spaced apart heat sink elements which are connected.

A heat sink including a first face in contact with electronic components generating heat to be removed and a second face in contact with the medium into which to dissipate the heat generated by the electronic components, including: at least one device for enhancing the thermal conductivity including a dome-shaped surface, a pin and a lateral section of revolution about the pin, the dome-shaped surface being connected to one end of a pin and to the lateral section of revolution, the dome-shaped surface being arranged on the second-face side, the free end of the pin being arranged on the first-face side.