A heat exchanger system is provided and includes a heat sink, fins arrayed on a central region of the heat sink to form channels between adjacent fins and an integrated blower. Each of the fins extends radially outwardly from the central region and has a height that increases with increasing distance from the central region. The integrated blower is disposed at the central region to generate flows of coolant directed into and through the channels.

A temperature plate includes a plate body and a supporting structure. The plate body has a first plate and a second plat, and a vacuum chamber is defined by the first plate and the second plate. The first plate has a first surface away from the vacuum chamber. The plate body is bent to form a bent portion with the first surface to be a compressive side, and the supporting structure is disposed corresponding to the bent portion. This configuration can prevent the deformation as bending the temperature plate and enhance the heat dissipation performance. In addition, a heat dissipation device adapting the temperature plate is also disclosed, and the heat dissipation device further includes a cooling fin assembly disposed on the first surface of the plate body.

A temperature plate includes a plate body and a supporting structure. The plate body has a first plate and a second plat, and a vacuum chamber is defined by the first plate and the second plate. The first plate has a first surface away from the vacuum chamber. The plate body is bent to form a bent portion with the first surface to be a compressive side, and the supporting structure is disposed corresponding to the bent portion. This configuration can prevent the deformation as bending the temperature plate and enhance the heat dissipation performance. In addition, a heat dissipation device adapting the temperature plate is also disclosed, and the heat dissipation device further includes a cooling fin assembly disposed on the first surface of the plate body.

A thermal bridge includes an upper bridge assembly including upper plates arranged in an upper plate stack and a lower bridge assembly including lower plates arranged in a lower plate stack. Outer ends of the lower plates face and thermally couple to an electrical component. The upper plates and the lower plates are arranged in plate pairs. A spring element forces the upper plates and the lower plates of the plate pairs apart. The upper plates include upper limit tabs and the lower plates include lower limit tabs. The upper limit tabs and the lower limit tabs operate to limit spreading apart of the upper plates and the lower plates against the opening forces of the spring element.

A heat dissipation device includes a base, fins and strip-shaped plates. The fins protrude side by side from the base, and the fins respectively include first end edges and second end edges opposite to each other. The first end edges are connected to the base. The strip-shaped plates are parallel to the base and connected to at least a part of the second end edges of the fins, and strip-shaped openings are formed between the strip-shaped plates. The base, the fins and the strip-shaped plates collectively surround chambers in a non-closed manner, and each of the strip-shaped openings is connected to the corresponding chamber. A distance between two adjacent fins of the fins is S, a width of any one of the strip-shaped openings is d, and d/S is between 0.01 and 0.4.

A heat exchanger in one aspect of the present disclosure comprises a plurality of plates and a fin. The fin comprises at least one first portion and at least one second portion. The at least one first portion is a wall surface that comprises at least one first opening. The at least one second portion, which is paired with the first portion, is a wall surface different from the first portion. The second portion comprises a second opening paired with a corresponding one of the at least one first opening. The fin comprises at least one opening pair, which is a pair of the first opening and the second opening. The at least one opening pair has a non-overlapping positional relationship in which the paired first opening and second opening are at least partially non-overlapping along a flow direction of a second fluid.

A heat exchanger in one aspect of the present disclosure comprises a plurality of plates and a fin. The fin comprises at least one first portion and at least one second portion. The at least one first portion is a wall surface that comprises at least one first opening. The at least one second portion, which is paired with the first portion, is a wall surface different from the first portion. The second portion comprises a second opening paired with a corresponding one of the at least one first opening. The fin comprises at least one opening pair, which is a pair of the first opening and the second opening. The at least one opening pair has a non-overlapping positional relationship in which the paired first opening and second opening are at least partially non-overlapping along a flow direction of a second fluid.

A semiconductor device includes a cooling jacket having an inlet for coolant and an outlet for the coolant, a base plate, a first semiconductor element provided on the base plate, a second semiconductor element provided on the base plate, a first fin provided directly under the first semiconductor element on a back surface of the base plate and placed within the cooling jacket, a second fin provided directly under the second semiconductor element on the back surface of the base plate and placed within the cooling jacket, and a separator provided within the cooling jacket to divide the coolant entering the cooling jacket through the inlet into portions respectively cooling the first fin and the second fin.

A heat dissipating structure and a water-cooling heat dissipating apparatus including the structure are disclosed. The heat dissipating structure includes a vapor chamber, plural heat pipes and a heat dissipating member, and the vapor chamber has a hollow slot penetrating through the vapor chamber, and the vapor chamber also has a cavity. Each heat pipe is vertically installed to the vapor chamber and communicated with the cavity. The heat dissipating member includes a substrate and plural fins integrally extended from the substrate and seals the hollow slot by a substrate, so as to improve the thermal conduction and dissipation of the heat dissipating structure and the water-cooling heat dissipating apparatus.

A heat dissipating structure and a water-cooling heat dissipating apparatus including the structure are disclosed. The heat dissipating structure includes a vapor chamber, plural heat pipes and a heat dissipating member, and the vapor chamber has a hollow slot penetrating through the vapor chamber, and the vapor chamber also has a cavity. Each heat pipe is vertically installed to the vapor chamber and communicated with the cavity. The heat dissipating member includes a substrate and plural fins integrally extended from the substrate and seals the hollow slot by a substrate, so as to improve the thermal conduction and dissipation of the heat dissipating structure and the water-cooling heat dissipating apparatus.