The apresnt disclosure adopts the thermal bonding process to process the microchannel heat sink. By placing the upper cover plate and the lower cover plate on the plates of the microchannel heat sink, the pressure is directly applied, and there is no need to add other adhesives.

A plate for a heat exchanger, which comprises a plurality of unit cells, each one of the unit cells comprising a first face and a second face which is opposite the first face, the first face and the second face having a plurality of spacers which are arranged so as to produce mutually perpendicular directions of flow between the first face and the second face.

The spacers differ between the first face and the second face in terms of number and/or shape and/or size.

An electronic device includes an integrated circuit and a heat exchanger. The heat exchanger includes a heat pipe and a first plurality of cooling fins and a second plurality of cooling fins. The heat pipe is thermally coupled to the integrated circuit and has an evaporator portion and a condenser portion, where the condenser portion extends away from the evaporator portion. The first plurality of cooling fins are attached to the condenser portion and proximate to the evaporation portion and form a plenum having a first associated pressure drop when a cooling fluid flows across the first plurality of cooling fins at a first velocity. The second plurality of cooling fins are attached to the condenser portion and distal from the evaporation portion and form a flow path having a second associated pressure drop when the cooling fluid flows across the second plurality of cooling fins at the first velocity.

A vapor chamber that includes a housing having a first sheet and a second sheet opposing each other and having outer edges bonded to each other along a sealing portion; a working fluid sealed in the housing; and a wick disposed on an internal main surface of the first sheet opposing the second sheet. At least one of the first sheet and the second sheet includes at least one groove between the wick and the sealing portion when viewed in a cross section of the housing taken in a direction perpendicular to a direction in which the first sheet and the second sheet oppose each other.

A plate heat exchanger has two metal plates brought into abutment, with a solder material between the plates. The plates are heated up to a first temperature. The plates are placed into a mold, the mold surfaces of which have cavities for envisaged channel structures. Channel structures are formed by local internal pressure forming of at least one plate under pressurization by the tool. The plates are heated up to a second temperature. The plates are solder bonded at the abuted surfaces. A plate heat exchanger has two metal plates, wherein channel structures have been formed in at least one plate and the plates are bonded to one another by soldering away from the channel structures. Eutectic microstructures having a longest extent of less than 50 micrometers are formed in the solder layer.

A loop heat pipe includes: an evaporator; a condenser; a liquid pipe; a vapor pipe; and a loop-like flow channel through which the working fluid flows. At least one of the evaporator, the condenser, the liquid pipe, and the vapor pipe includes a first outer metal layer, a second outer metal layer, and an inner metal layer. The inner metal layer includes a porous body. The porous body includes: a first bottomed hole formed in one face of the inner metal layer; a second bottomed hole formed in the other face of the inner metal layer; a pore, wherein the first bottomed hole and the second bottomed hole partially communicates with each other through the pore; and a first column portion provided inside the first bottomed hole. The first column portion is bonded to the first outer metal layer.

A heat exchanger is provided with a unitary, single-piece structure that can be formed via 3D printing, for example. The heat exchanger includes a main body a plurality of plates stacked and integrally formed with the body. First fluid channels are defined by gaps in the material of the main body, and second fluid channels are defined by gaps in the material of the main body and are stacked with the first fluid channels in alternating fashion, separated by the plates. Each of the first fluid channels are fluidly coupled to two manifolds, and each of the second fluid channels are fluidly coupled to two more manifolds. One of the manifolds has a reduced interior volume to control and normalize fluid flow through the heat exchanger.

A plate heat exchanger has two metal plates brought into abutment, with a solder material between the plates. The plates are heated up to a first temperature. The plates are placed into a mold, the mold surfaces of which have cavities for envisaged channel structures. Channel structures are formed by local internal pressure forming of at least one plate under pressurization by the tool. The plates are heated up to a second temperature. The plates are solder bonded at the abuted surfaces. A plate heat exchanger has two metal plates, wherein channel structures have been formed in at least one plate and the plates are bonded to one another by soldering away from the channel structures. Eutectic microstructures having a longest extent of less than 50 micrometers are formed in the solder layer.

A plate-type heat exchanger formed by stacking a plurality of heat exchange units on top of each other, wherein adjacent heat exchange units are stacked such that the internal space in one heat exchange unit and the internal space in another heat exchange unit communicate with each other through a first opening in the one heat exchange unit and a second opening in the other heat exchange unit, the one heat exchange unit includes an insertion wall disposed on a peripheral edge of the first opening and inserted in the second opening when the adjacent heat exchange units are stacked, and the insertion wall has a distal end with a circumferentially discontinuous protrusion height.

A block style heat exchanger for a heat pipe reactor having a plurality of heat pipes extending from a reactor core. The heat exchanger includes a plurality of primary channels, each for receiving heat transferred from the core via one of the heat pipes. The primary channels extending within a block of one or more materials. The heat exchanger also includes a plurality of secondary channels defined within the block for transmitting a flow of the secondary heat transfer medium through the heat exchanger from an inlet to an outlet. The block is formed from one or both of: a plurality of plates bonded together, with each plate defining at least a portion of one or more of the plurality of primary channels and/or the plurality of secondary channels, and/or a unitary piece of material formed from an additive manufacturing process.