A flat tube for a header-plateless heat exchanger has an inner plate and an outer plate that are each press-molded from a metal plate and are curved/folded into a groove shape comprising a groove bottom section and two side wall sections. Both plates are such that the outer plate is fitted to the outside of the inner plate in a manner such that the groove bottom sections oppose each other, and an expanded opening in the thickness direction is formed at both ends of the plates.

A flat tube for a header-plateless heat exchanger has an inner plate and an outer plate that are each press-molded from a metal plate and are curved/folded into a groove shape comprising a groove bottom section and two side wall sections. Both plates are such that the outer plate is fitted to the outside of the inner plate in a manner such that the groove bottom sections oppose each other, and an expanded opening in the thickness direction is formed at both ends of the plates.

A device and a method for assessing a gasket pressure of a gasket arrangement between two adjacent heat transfer plates of a plate heat exchanger is provided. The gasket arrangement seals between adjacent heat transfer plates to define a flow channel between adjacent heat transfer plates, and the gasket arrangement is arranged to be exposed to a fluid passing through the flow channel. The device comprises a test object and a holder which are adapted to be arranged in a flow path of the fluid. The holder is arranged to hold the test object and the test object is arranged to be exposed to the fluid. The device is adapted to be arranged outside a space delimited by the adjacent heat transfer plates. The test object is arranged to be evaluated for an indirect assessment of the gasket pressure of the gasket arrangement.

A device and a method for assessing a gasket pressure of a gasket arrangement between two adjacent heat transfer plates of a plate heat exchanger is provided. The gasket arrangement seals between adjacent heat transfer plates to define a flow channel between adjacent heat transfer plates, and the gasket arrangement is arranged to be exposed to a fluid passing through the flow channel. The device comprises a test object and a holder which are adapted to be arranged in a flow path of the fluid. The holder is arranged to hold the test object and the test object is arranged to be exposed to the fluid. The device is adapted to be arranged outside a space delimited by the adjacent heat transfer plates. The test object is arranged to be evaluated for an indirect assessment of the gasket pressure of the gasket arrangement.

The plate heat exchanger and method for manufacturing a plate heat exchanger comprise a stack of heat transfer plates, with first and second flow channels arranged between the plates. Pairs of heat transfer plates form cells. A cell comprises inner spacing elements arranged between the heat transfer plates leaving open a first inlet opening and a first outlet opening for the one of the fluids. The cell also comprises outer spacing elements welded to the heat transfer plates on the sides of the heat transfer plates facing away from each other. The cells are stacked against each other and joined together by welding via the outer spacing elements. The plate heat exchanger further comprises cover plates for covering sides of the stack of heat transfer plates with interruption for an inlet port section formed by the first inlet openings and an outlet port section formed by the first outlet openings. The two first sides of the cell comprising the first inlet opening or the first outlet opening comprise leakage passageways provided between the heat transfer plates for the one of the fluids, in addition to the passages provided by the first inlet opening and the first outlet opening.

A method for manufacturing a heat dissipation device that includes stamping a composite plate including a welding material to form a first plate having a plurality of angled grooves, depositing powder in the plurality of angled grooves of the first plate, contacting the first plate to a second plate, and welding the first plate and the second plate together, and sintering powder to obtain a capillary structure.

Embodiments of this application provide a heat exchanger, a modular indirect evaporation cooling system, and a method for controlling a modular indirect evaporation cooling system, and relate to the field of indirect cooling technologies, to improve cooling efficiency of the modular indirect evaporation cooling system. The heat exchanger includes a first heat exchange core and a second heat exchange core. The first heat exchange core includes a first heat exchange fin and a first seal, where two first seals are disposed opposite to each other and are separately connected to the first heat exchange fin in an intersected manner. The second heat exchange core includes a second heat exchange fin, a second seal, and a heat exchange medium permeability channel, where two second seals are opposite to each other and are separately connected to the second heat exchange fin in an intersected manner.

A plate package for a heat exchanger device includes a plurality of heat exchanger plates of a first type and a plurality of heat exchanger plates of a second type. At least the heat exchanger plates of the first type include, along at least a section of the opposing side portions, a draining channel flange. The draining channel flanges are oriented in one and the same direction such that a draining channel flange of a first heat exchanger plate of the first type abuts or overlaps a draining channel flange of a subsequent heat exchanger plate. The draining channel flanges form outer walls to the outer draining portions thereby transforming the outer draining portions into draining channels. A method of using such plate package in a heat exchanger device and also a heat exchanger device as such are also disclosed.

The present application relates to a stencil device (150) for simultaneous stencil printing of brazing material onto elevations, areas surrounding port openings, and a circumferential skirt (210) of a heat exchanger plate (200) wherein the stencil device (150) comprises an upper stencil having openings for applying brazing material to elevations and areas surrounding port openings of the heat exchanger plate (200) and a lower stencil printing stencil (150) having a large opening (190) for receiving the heat exchanger plate (200) and contacting an outer perimeter of the circumferential skirt (210) of the heat exchanger plate (200), wherein an inner surface (195) of the large opening (190) comprises brazing material exits (160) for applying brazing material to the circumferential skirts (195). Disclosed is also a method of such stencil printing and also the use of a stencil device for applying heat exchanger plates (200) with a brazing material.

The present application relates to a stencil device (150) for simultaneous stencil printing of brazing material onto elevations, areas surrounding port openings, and a circumferential skirt (210) of a heat exchanger plate (200) wherein the stencil device (150) comprises an upper stencil having openings for applying brazing material to elevations and areas surrounding port openings of the heat exchanger plate (200) and a lower stencil printing stencil (150) having a large opening (190) for receiving the heat exchanger plate (200) and contacting an outer perimeter of the circumferential skirt (210) of the heat exchanger plate (200), wherein an inner surface (195) of the large opening (190) comprises brazing material exits (160) for applying brazing material to the circumferential skirts (195). Disclosed is also a method of such stencil printing and also the use of a stencil device for applying heat exchanger plates (200) with a brazing material.