F28F2013/006

THERMAL CONTROLLER, THERMAL CONTROL SYSTEM AND THERMAL CONTROL METHOD FOR HARDWARE DEVICES
20220163273 · 2022-05-26 ·

Embodiments of the disclosure relate generally to thermal control and management in hardware devices. A thermal control system includes a thermal node, a thermal bridge, and a thermal controller. The thermal node is configured to receive heat generated in a device. The thermal controller is configured to in response to an environment temperature of the thermal controller being greater than a first threshold temperature, cause heat transfer from the thermal node to a first heat sink and prevent heat transfer from the thermal node to a second heat sink. The thermal controller is also configured to, in response to the environment temperature of the thermal controller being greater than a second threshold temperature, cause heat transfer from the thermal node to the second heat sink and prevent heat transfer from the thermal node to the first heat sink.

Thermal switch
11740037 · 2023-08-29 · ·

A thermal switch having an on-state and an off-state is provided. First and second plates are composed from a thermally conductive material. The first and second plates are connected to form an internal cavity having a channel defining a gap between the first and second plate. The first reservoir is coupled to the channel and contains a thermally conductive liquid. The actuator is coupled to the first reservoir and the channel and is moveable between a first state and a second state corresponding to the on-state and the off-state of the thermal switch, respectively. Thermally conductive liquid is allowed to flow from the first reservoir to the channel when the actuator is in the first state and allowed to flow from the channel to the first reservoir when the actuator is in the second state.

Heat storage matertal

The invention relates to a material including a support consisting of a porous composite material including at least one polymer phase forming a binder based on at least one polymer selected from thermoplastic polymers, elastomers, and elastomer thermoplastics, and at least one filler selected from thermally conductive fillers, the pores of the support consisting of the porous composite material being partially or entirely filled with at least one phase-change material. The invention also relates to a method for producing said material.

HEAT DISSIPATION MODULE WITH SHOCK RESISTING EFFECT
20230254998 · 2023-08-10 ·

A heat dissipation module with a shock resisting effect is provided. The heat dissipation module includes a heat absorbing unit, a heat dissipating unit and at least one flexible heat conducting bundle. The heat absorbing unit has a first installing surface. The heat dissipating unit is disposed corresponding to the heat absorbing unit and has a second installing surface facing the first installing surface. The flexible heat conducting bundle is connected between the first installing surface and the second installing surface, and used for transferring heat of the heat absorbing unit to the heat dissipating unit to dissipate the heat. Accordingly, the heat dissipation module is provided with a flexible stretching function and a shock resisting effect.

HEAT EXCHANGER
20230243593 · 2023-08-03 ·

A heat exchanger. The heat exchanger comprises a plurality of primary fluid tubes configured to carry a primary fluid, a plurality of secondary fluid tubes configured to carry a secondary fluid, and a plurality of intervening layers, each intervening layer being thermally conductive and impermeable to both the primary and secondary fluids. Each intervening layer has one or more of the primary fluid tubes on a first side, and one or more of the secondary fluid tubes on a second side opposite the first side, such that the region between each pair of neighbouring intervening layers contains either primary fluid tubes or secondary fluid tubes, but not both primary and secondary fluid tubes.

Heat exchanger

A heat exchanger (1; 1*; 100) includes a bundle of tubes (8), each extending in a respective elongation direction (X1) and defining a flow path for a working fluid that extends in the elongation direction, wherein each tube (8) of the bundle of tubes can be supplied with a working fluid; a matrix (6) of thermally conductive material that houses the tubes (8) of the bundle and that is configured, in use, for promoting heat exchange between working fluids that run through corresponding tubes (8) of the bundle; and a shell (4) made of thermally insulating material arranged around the matrix (6), wherein: the matrix (6) is made up of a plurality of sections (10; 10*) arranged aligned in the elongation direction (X1) and alternated by thermal interruptions (12) that extending transversely to the elongation direction (X1).

Thermal Switch
20210356220 · 2021-11-18 · ·

A thermal switch having an on-state and an off-state is provided. First and second plates are composed from a thermally conductive material. The first and second plates are connected to form an internal cavity having a channel defining a gap between the first and second plate. The first reservoir is coupled to the channel and contains a thermally conductive liquid. The actuator is coupled to the first reservoir and the channel and is moveable between a first state and a second state corresponding to the on-state and the off-state of the thermal switch, respectively. Thermally conductive liquid is allowed to flow from the first reservoir to the channel when the actuator is in the first state and allowed to flow from the channel to the first reservoir when the actuator is in the second state.

Sensor thermal management and stabilization utilizing variable conductance

A system for sensor thermal management and stabilization comprises a sensor block, one or more sensors mounted on the sensor block, one or more heaters mounted on the sensor block, a chassis coupled to the sensor block, a thermal conductor moveably coupled between the sensor block and the chassis, and a thermal control actuation mechanism operatively connected to the thermal conductor. The thermal control actuation mechanism is operative to cause the thermal conductor to vary a total thermal conductance from the sensor block to the chassis by moving the thermal conductor toward the chassis or away from the chassis. The total thermal conductance is varied to provide an optimized thermal stability and optimized environmental range of applicability for the one or more sensors.

FIN APPARATUS FOR ENHANCING HEAT TRANSFER SURFACES
20230280106 · 2023-09-07 ·

A system includes a fin apparatus that is installed on a heat transfer medium pipe using thermally conductive mastic (heat transfer compound) and bands for holding the components in place. The system further includes a tank containing material of high viscosity, primarily Polymer Modified or Ground Tire Rubber Asphalts (PMAs and GTRs), that requires heating. The fin apparatus increases the surface area of the heat transfer medium piping and increases the effectiveness of the heat transfer that takes place between the medium and the high viscosity material. There is a need for the fin apparatus because to date, traditional fin designs are prone to fouling and decreased performance when used with high viscosity materials like PMAs and GTRs.

Thermal controller, thermal control system and thermal control method for hardware devices
11619457 · 2023-04-04 · ·

Embodiments of the disclosure relate generally to thermal control and management in hardware devices. A thermal control system includes a thermal node, a thermal bridge, and a thermal controller. The thermal node is configured to receive heat generated in a device. The thermal controller is configured to in response to an environment temperature of the thermal controller being greater than a first threshold temperature, cause heat transfer from the thermal node to a first heat sink and prevent heat transfer from the thermal node to a second heat sink. The thermal controller is also configured to, in response to the environment temperature of the thermal controller being greater than a second threshold temperature, cause heat transfer from the thermal node to the second heat sink and prevent heat transfer from the thermal node to the first heat sink.