A thermal switch having an on-state and an off-state is provided. First and second plates are composed from a thermally conductive material. The first and second plates are connected to form an internal cavity having a channel defining a gap between the first and second plate. The first reservoir is coupled to the channel and contains a thermally conductive liquid. The actuator is coupled to the first reservoir and the channel and is moveable between a first state and a second state corresponding to the on-state and the off-state of the thermal switch, respectively. Thermally conductive liquid is allowed to flow from the first reservoir to the channel when the actuator is in the first state and allowed to flow from the channel to the first reservoir when the actuator is in the second state.

Various aspects as described herein are directed to a radiative cooling apparatuses and methods for cooling an object. As consistent with one or more embodiments, a radiative cooling apparatus includes an arrangement of a plurality of different material located at different depths along a depth dimension relative to the object. The plurality of different material includes a solar spectrum reflecting portion configured and arranged to suppress light modes, thereby inhibiting coupling of the incoming electromagnetic radiation, of at least some wavelengths in the solar spectrum, to the object at a range of angles of incidence relative to the depth dimension. Further, the plurality of material includes a thermally-emissive arrangement configured and arranged to facilitate, simultaneously with the inhibiting coupling of the incoming electromagnetic radiation, the thermally-generated electromagnetic emissions from the object at the range of angles of incidence and in mid-IR wavelengths.

A system for sensor thermal management and stabilization comprises a sensor block, one or more sensors mounted on the sensor block, one or more heaters mounted on the sensor block, a chassis coupled to the sensor block, a thermal conductor moveably coupled between the sensor block and the chassis, and a thermal control actuation mechanism operatively connected to the thermal conductor. The thermal control actuation mechanism is operative to cause the thermal conductor to vary a total thermal conductance from the sensor block to the chassis by moving the thermal conductor toward the chassis or away from the chassis. The total thermal conductance is varied to provide an optimized thermal stability and optimized environmental range of applicability for the one or more sensors.

Embodiments described herein relate a tunable heat transfer system. The tunable heat transfer system includes a controller, a first body, and a second body. The first body is communicatively coupled to the controller. The second body is communicatively coupled to the controller and spaced apart from the first body. The second body has a plurality of semimetal layers and a dielectric portion positioned between each of the plurality of semimetal layers. Each of the dielectric portions has a thickness to define a gap between each the plurality of semimetal layers in an expanded state and permitting each of the plurality of semimetal layers to abut each other in a contracted state. The controller is configured to change a near-field radiative heat transfer between the first body and the second body by changing the thickness of each of the dielectric portions between the expanded state and the contracted state.

A heat storage and transfer system that incorporates a primary heat storage chamber or body that is thermally insulated and which in use contains a heat storing liquid or solid; and a secondary chamber external to and adjacent the primary heat storage chamber or body through which a liquid, heat transfer fluid or steam to be heated is passed in use, the system having a heat transfer mechanism to selectively transfer thermal energy from the heat storing liquid or solid of the primary heating chamber or body to the liquid or steam to be heated in the secondary chamber. The heat transfer mechanism has a drive that moves the secondary chamber from a first position that is thermally separated from the primary chamber into a second position that is substantially inserted in a void or recess within the primary chamber or body.

Embodiments of the disclosure relate generally to thermal control and management in hardware devices. A thermal control system includes a thermal node, a thermal bridge, and a thermal controller. The thermal node is configured to receive heat generated in a device. The thermal controller is configured to in response to an environment temperature of the thermal controller being greater than a first threshold temperature, cause heat transfer from the thermal node to a first heat sink and prevent heat transfer from the thermal node to a second heat sink. The thermal controller is also configured to, in response to the environment temperature of the thermal controller being greater than a second threshold temperature, cause heat transfer from the thermal node to the second heat sink and prevent heat transfer from the thermal node to the first heat sink.

An electronic device includes a loop type heat pipe including a loop-shaped flow path in which a working fluid is enclosed, a first magnet provided to the loop type heat pipe, a heat dissipation plate thermally connectable to the loop type heat pipe, a second magnet provided to the heat dissipation plate and provided to face the first magnet, and a support member that supports the heat dissipation plate movably between a position in which the heat dissipation plate is thermally connected to the loop type heat pipe and a position in which the heat dissipation plate is not thermally connected to the loop type heat pipe.

Embodiments described herein relate to a bi-functional thermal cooling system. The bi-functional thermal cooling system includes a first body, a second body, and a third body. The second body has a first plurality of Weyl semimetal nanostructures. The second body is spaced apart from the first body. The third body has a second plurality of Weyl semimetal nanostructures. The third body is spaced apart from the second body. The second body and the third body are each configured to independently rotate with respect to the first body to change an optical property of the first plurality of Weyl semimetal nanostructures of the second body and an optical property of the second plurality of Weyl semimetal nanostructures of the third body.

Various aspects as described herein are directed to a radiative cooling device and method for cooling an object. As consistent with one or more embodiments, a radiative cooling device includes a solar spectrum reflecting structure configured and arranged to suppress light modes, and a thermally-emissive structure configured and arranged to facilitate thermally-generated electromagnetic emissions from the object and in mid-infrared (IR) wavelengths.

A thermal metamaterial device comprises at least one MEMS thermal switch, comprising a substrate layer including a first material having a first thermal conductivity, and a thermal bus over a first portion of the substrate layer. The thermal bus includes a second material having a second thermal conductivity higher than the first thermal conductivity. An insulator layer is over a second portion of the substrate layer and includes a third material that is different from the first and second materials. A thermal pad is supported by a first portion of the insulator layer, the thermal pad including the second material and having an overhang portion located over a portion of the thermal bus. When a voltage is applied to the thermal pad, an electrostatic interaction occurs to cause a deflection of the overhang portion toward the thermal bus, thereby providing thermal conductivity between the thermal pad and the thermal bus.