A cooling system, an apparatus for producing hyperpolarized samples, where the apparatus includes the cooling system, and a method for assembling and using the cooling system are disclosed. The cooling system includes a cryogenic chamber, a cooling plate, a sample sleeve, a thermal switch, and an interposer. Also, the cryogenic chamber includes a cryogenic fluid and the cooling plate is disposed in the cryogenic chamber, in contact with the cryogenic fluid. Further, the sample sleeve is configured to receive a sample. The sample sleeve is at least partially inserted in the cryogenic chamber. The thermal switch is disposed between the cooling plate and the sample sleeve. Moreover, the interposer is disposed between at least one of (i) the thermal switch and the cooling plate and (ii) the thermal switch and the sample sleeve. The interposer includes a gallium indium tin alloy.

A thermal switch having an on-state and an off-state is provided. First and second plates are composed from a thermally conductive material. The first and second plates are connected to form an internal cavity having a channel defining a gap between the first and second plate. The first reservoir is coupled to the channel and contains a thermally conductive liquid. The actuator is coupled to the first reservoir and the channel and is moveable between a first state and a second state corresponding to the on-state and the off-state of the thermal switch, respectively. Thermally conductive liquid is allowed to flow from the first reservoir to the channel when the actuator is in the first state and allowed to flow from the channel to the first reservoir when the actuator is in the second state.

A system and method for a passive thermal diode (PTD) to be disposed on a pipeline that inhibits heat transfer from the pipeline to the environment below a threshold temperature and promotes heat transfer from the environment to the pipeline above a threshold temperature.

Method for controlling heat transfer between two objects. In one embodiment, the method includes providing a first current through a first electromagnet disposed about a container holding magnetorheological fluid to generate a first magnetic field such that particles in the magnetorheological fluid align with the first magnetic field to conductively couple a first conductive element to a second conductive element; and providing a second current through a second electromagnet disposed perpendicular to the first electromagnet to generate a second magnetic field perpendicular to the first magnetic field such that the particles in the magnetorheological fluid align with the second magnetic field to conductively uncouple the first conductive member from the second conductive member.

A thermal switch includes: a first electrode; a second electrode opposite the first electrode; and a liquid crystal layer between the first electrode and the second electrode, the liquid crystal layer containing liquid crystal molecules that are at least either in the Williams domain mode or in the dynamic scattering mode when a voltage is applied between the first electrode and the second electrode.

This thermal conduction device intended to be installed between a first heat source part and a second heat dissipation part, comprises a male element comprising a protruding part relative to a base and a female element comprising an inner wall defining a housing for receiving the protruding part. The male element is configured to exert a radial force against the inner wall when the thermal conduction device is installed between the first heat source part and the second heat dissipation part so as to improve the thermal conduction between the male element and the female element.

A variable conductance heat pipe (VCHP) is utilized as a “passive heat switch” to regulate a characteristic temperature of an integrated circuit component. The VCHP is located between an integrated circuit component and a cold plate and comprises a working fluid and a non-condensable gas in a chamber. When the component is not operational, the VCHP blocks the flow of heat from the component to the cold plate. As component power consumption increases, the working fluid pressure increases and compresses the non-condensable gas toward the cooler region of the cold plate to eventually create a low thermal resistance path between the component and the cold plate. By introducing negative feedback into the thermal management solution, the VCHP keeps the characteristic temperature within a narrow range. This can alleviate stress on package components (e.g., solder joints) due to excessive thermal cycling, which can extend the lifetime of the component.

Various aspects as described herein are directed to a radiative cooling device and method for cooling an object. As consistent with one or more embodiments, a radiative cooling device includes a solar spectrum reflecting structure configured and arranged to suppress light modes, and a thermally-emissive structure configured and arranged to facilitate thermally-generated electromagnetic emissions from the object and in mid-infrared (IR) wavelengths.

An apparatus for heat dissipation is provided comprising a heat source, a heat sink and a heat conducting element, wherein the heat conducting element conducts heat energy from the heat source to the heat sink along a heat conducting path, and wherein the heat conducting element is arranged in such a way on the heat source and the heat sink and is configured to physically change in such a way with increasing temperature of the heat conducting element that a) a first cross-sectional area between the heat source and the heat conducting element and/or a second cross-sectional area between the heat conducting element of the heat sink increases, and/or b) a length of the heat conducting path shortens. Further, a video endoscope having such an apparatus and a use of such an apparatus are disclosed.

The thermal actuator can have a housing, a moving member, a sensing portion configured to move the moving member relative the housing when receiving heat from a source of heat, and a thermal insulator between the sensing portion and the source of heat.