A heat dissipation module used for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator, a pipe, and a working fluid. The evaporator has a recess at an exterior surface of the evaporator, and the heat source is thermally contacted with the recess to transfer a heat generated from the heat source to the recess of the evaporator. The pipe is connected to an inner space of the evaporator and forms a loop. The working fluid is filled in the loop, wherein the working fluid in liquid passing through a portion of the inner space of the evaporator corresponding to the recess absorbs the heat and is transformed into vapor.

A heat dissipation module used for an electronic device is provided. The electronic device has a heat source. The heat dissipation module includes an evaporator, a pipe, and a working fluid. The evaporator has a recess at an exterior surface of the evaporator, and the heat source is thermally contacted with the recess to transfer a heat generated from the heat source to the recess of the evaporator. The pipe is connected to an inner space of the evaporator and forms a loop. The working fluid is filled in the loop, wherein the working fluid in liquid passing through a portion of the inner space of the evaporator corresponding to the recess absorbs the heat and is transformed into vapor.

A cooling device includes: a container in which a refrigerant is sealed; an evaporation circuit that evaporates the refrigerant in a liquid phase inside the container by heat reception; a condensation circuit that condenses the refrigerant in a gas phase inside the container by heat radiation; a transport circuit that transports the refrigerant in the liquid phase inside the container to the evaporation circuit by a capillary phenomenon; a heat radiation member that includes fins, and includes a narrow portion that has a width in a direction orthogonal to a flow direction of cooling air that is narrow on a downstream side in the flow direction, and a wide portion that has the width that is wide on an upstream side in the flow direction; and an air guide member that is provided on the downstream side of the wide portion and on the upstream side of the narrow portion.

A cooling device includes: a container in which a refrigerant is sealed; an evaporation circuit that evaporates the refrigerant in a liquid phase inside the container by heat reception; a condensation circuit that condenses the refrigerant in a gas phase inside the container by heat radiation; a transport circuit that transports the refrigerant in the liquid phase inside the container to the evaporation circuit by a capillary phenomenon; a heat radiation member that includes fins, and includes a narrow portion that has a width in a direction orthogonal to a flow direction of cooling air that is narrow on a downstream side in the flow direction, and a wide portion that has the width that is wide on an upstream side in the flow direction; and an air guide member that is provided on the downstream side of the wide portion and on the upstream side of the narrow portion.

A heat exchanger includes a first fluid pathway enclosed in a heat exchanger body to convey a first fluid through the heat exchanger body and a second fluid pathway enclosed in the heat exchanger body to convey a second fluid through the heat exchanger body and facilitate thermal energy exchange between the first fluid and the second fluid. The first fluid pathway and the second fluid pathway together are arranged in a spiral arrangement extending along a central axis of the heat exchanger.

A power electronics assembly includes one or more power electronics devices, and a heat exchanger to which the one or more power electronics devices are mounted. The heat exchanger includes an inlet manifold and an outlet manifold, and one or more fluid pathways extending connecting the inlet manifold and the outlet manifold, the heat exchanger configured to transfer thermal energy from the one or more power electronics devices into a flow of fluid passing through the one or more fluid pathways. Thee one or more fluid pathways include one or more internal enhancements and channel configurations to enhance thermal energy transfer by promoting boiling of the flow of fluid and to reduce the pressure drop in the pathways under a two-phase flow condition. The flow of fluid is a flow of liquid refrigerant diverted from a condenser of a heating, ventilation, and air conditioning (HVAC) system.

A method for fabricating heat exchangers using additive manufacturing technologies. Additive manufacturing enables the manufacture of heat exchangers with complex geometries and/or with internal and external integral surface features. Additive manufacture also facilitates the manufacture of heat exchangers with regional variations, such as changes in size, shape and surface features. In one embodiment, the present invention provides a heat exchanger with a helicoidal shape that provides axial elastic compliance. In one embodiment, the internal channel of the heat exchanger varies along its length. The internal channel may have a cross-sectional area that increases progressively from one end to the other. In one embodiment, the external shape of the tubular structure may be non-circular to optimize heat transfer with an external heat transfer fluid. In one embodiment, the present invention provides a heat pipe with an internal wicking structure formed as an integral part of the additive manufacturing process.

A gas furnace is provided. The gas furnace includes a combustion part in which a fuel gas is burnt to generate a combustion gas, a heat exchanger having a gas flow path through which the combustion gas flows, a blower configured to blow air around the heat exchanger, and an inducer configured to discharge the combustion gas from the heat exchanger. The heat exchanger includes at least one single path in which a single gas flow path is formed a single-multiple return bend configured to communicate with the single path and convert a flow direction of the combustion gas, and at least one multiple path having a plurality of paths that communicate with the single-multiple return bend and form multiple gas flow paths.

A gas furnace is provided. The gas furnace includes a combustion part in which a fuel gas is burnt to generate a combustion gas, a heat exchanger having a gas flow path through which the combustion gas flows, a blower configured to blow air around the heat exchanger, and an inducer configured to discharge the combustion gas from the heat exchanger. The heat exchanger includes at least one single path in which a single gas flow path is formed a single-multiple return bend configured to communicate with the single path and convert a flow direction of the combustion gas, and at least one multiple path having a plurality of paths that communicate with the single-multiple return bend and form multiple gas flow paths.

The disclosure relates to a heat transfer assembly for a rotary regenerative heat exchanger. The assembly includes a rotor arranged between at least two separated fluid flow passages passing flow axially through the rotor, where each flow passage is connected to a sector part of the rotor. The assembly further includes a plurality of channels in the rotor for flowing a fluid through the rotor, each of the channels is enclosed by heat transfer and heat accumulating surfaces in the rotor, and the heat transfer and heat accumulating surfaces of the channels are made in a material providing an average axial thermal conductivity less than 100 W/mK arranged to reduce the Longitudinal Heat Conductivity of the rotor.