The invention relates to an apparatus (1) for cooling an automobile component (20) by means of a gas, the apparatus comprising a cooling box (11) with a re-closeable opening (12) for receiving an automobile component (20) to be cooled, wherein at least one heat sink (13) is provided inside the cooling box (11) for cooling of the gas, and wherein the apparatus (10) includes at least one infra sound pulsator (2, 3) arranged to provide an infra sound into said cooling box (11) to improve heat exchange of the gas both with a cooling surface of the at least one heat sink (13), and with the automobile component (20). The invention also relates to a process for cooling an automobile component in such an apparatus.

According to various, but not necessarily all, examples of the disclosure there is provided an apparatus comprising: one or more portions of material configured to vibrate at one or more ultrasonic frequencies when the material is positioned within a varying magnetic field; and wherein the one or more portions of material configured to vibrate at one or more ultrasonic frequencies are positioned so that, when a varying magnetic field is applied to the apparatus, the vibration caused by the varying magnetic field provides increased cooling within a cooling system.

An ultrasonic atomizer for maintaining a constant temperature of an ultrasonic vibration generating unit by decreasing a temperature at the periphery of the ultrasonic vibration generating unit even under an environment in which the ultrasonic vibration generating unit is exposed to a high temperature is provided. The ultrasonic atomizer includes: an ultrasonic vibration generating unit which generates ultrasonic waves and atomizes a spray material; a nozzle unit; a heat exchange unit which cools heat generated from the ultrasonic vibration generating unit; and a housing which has heat exchange chambers, where the heat exchange chambers include: a vortex chamber which is positioned in the housing at the periphery of the ultrasonic vibration generating unit and guides a vortex flow; and a thermal insulation chamber which surrounds the vortex chamber and has a separation wall which abuts the vortex chamber, and includes an internal thermal insulation space.

An ultrasonic atomizer for maintaining a constant temperature of an ultrasonic vibration generating unit by decreasing a temperature at the periphery of the ultrasonic vibration generating unit even under an environment in which the ultrasonic vibration generating unit is exposed to a high temperature is provided. The ultrasonic atomizer includes: an ultrasonic vibration generating unit which generates ultrasonic waves and atomizes a spray material; a nozzle unit; a heat exchange unit which cools heat generated from the ultrasonic vibration generating unit; and a housing which has heat exchange chambers, where the heat exchange chambers include: a vortex chamber which is positioned in the housing at the periphery of the ultrasonic vibration generating unit and guides a vortex flow; and a thermal insulation chamber which surrounds the vortex chamber and has a separation wall which abuts the vortex chamber, and includes an internal thermal insulation space.

A monolithic oscillating heat pipe (OHP) device comprising a monolithic body and an oscillating heat pipe (OHP) circuit integrally formed within the body. The OHP circuit is structured and operable to isothermally spread throughout the body heat from a heat source disposed on a heat source portion of the body and in thermally conductive contact with a portion of the OHP circuit. The monolithic OHP device further comprising a pumped fluid (PF) circuit integrally formed within the body and in thermally conductive contact with at least portion of the OHP circuit internally within the body. The PF circuit is structured and operable to remove heat from the portion of the OHP circuit in which the PF circuit is in thermally conductive contact with.

A monolithic oscillating heat pipe (OHP) device comprising a monolithic body and an oscillating heat pipe (OHP) circuit integrally formed within the body. The OHP circuit is structured and operable to isothermally spread throughout the body heat from a heat source disposed on a heat source portion of the body and in thermally conductive contact with a portion of the OHP circuit. The monolithic OHP device further comprising a pumped fluid (PF) circuit integrally formed within the body and in thermally conductive contact with at least portion of the OHP circuit internally within the body. The PF circuit is structured and operable to remove heat from the portion of the OHP circuit in which the PF circuit is in thermally conductive contact with.

Disclosed is a flat plate pulsating heat pipe (FP-PHP) serving as a power-free high efficiency heat transfer system for small electronic devices such as mobile phones and laptop computers. The FP-PHP is manufactured using MEMS technology and configured to have a single-turn loop or a multi-turn loop, each having a single diameter channel or a dual diameter channel. Further, since a working fluid used in a flat plate pulsating heat pipe exhibits different characteristics according to the main working temperature, provided is a flat plate pulsating heat pipe which includes a working fluid having optimum efficiency in the main working temperature. In addition, the flat plate pulsating heat pipe applicable at various installation angles, of the present invention which is for achieving the above purpose, includes: a silicon lower wafer plate having a rectangular shape; a capillary tube comprising a channel which has a constant depth on the upper surface of the silicon wafer lower plate and is formed in the form of a straight line along the longitudinal direction of the silicon wafer lower plate, wherein the channel forms a closed loop which is bent at both ends of the silicon wafer lower plate and is connected; a wafer upper plate which is coupled on top of the silicon wafer lower plate and seals the capillary tube; and a working fluid filled inside the capillary tube, wherein the capillary tube is made of a combination of a dual-diameter tube including a pair of channels having different widths and a single diameter tube including a pair of channels having the same width.

Disclosed is a flat plate pulsating heat pipe (FP-PHP) serving as a power-free high efficiency heat transfer system for small electronic devices such as mobile phones and laptop computers. The FP-PHP is manufactured using MEMS technology and configured to have a single-turn loop or a multi-turn loop, each having a single diameter channel or a dual diameter channel. Further, since a working fluid used in a flat plate pulsating heat pipe exhibits different characteristics according to the main working temperature, provided is a flat plate pulsating heat pipe which includes a working fluid having optimum efficiency in the main working temperature. In addition, the flat plate pulsating heat pipe applicable at various installation angles, of the present invention which is for achieving the above purpose, includes: a silicon lower wafer plate having a rectangular shape; a capillary tube comprising a channel which has a constant depth on the upper surface of the silicon wafer lower plate and is formed in the form of a straight line along the longitudinal direction of the silicon wafer lower plate, wherein the channel forms a closed loop which is bent at both ends of the silicon wafer lower plate and is connected; a wafer upper plate which is coupled on top of the silicon wafer lower plate and seals the capillary tube; and a working fluid filled inside the capillary tube, wherein the capillary tube is made of a combination of a dual-diameter tube including a pair of channels having different widths and a single diameter tube including a pair of channels having the same width.

A flow disturbance apparatus includes: a refrigerant pipe having a flow space in which refrigerant flows; and at least one disturbance member disposed inside the refrigerant pipe that is vibrated by the flow of refrigerant in the refrigerant pipe to disturb the refrigerant flowing in the refrigerant pipe.

An ultrasonic atomizer for maintaining a constant temperature of an ultrasonic vibration generating unit by decreasing a temperature at the periphery of the ultrasonic vibration generating unit even under an environment in which the ultrasonic vibration generating unit is exposed to a high temperature is provided. The ultrasonic atomizer includes: an ultrasonic vibration generating unit which generates ultrasonic waves and atomizes a spray material; a nozzle unit; a housing; and a heat exchange unit which surrounds the ultrasonic vibration generating unit, includes a separation wall which divides the heat exchange unit into heat exchange chambers, and cools heat generated from the ultrasonic vibration generating unit, in which the heat exchange chambers include: a heating chamber; and a cooling chamber which surrounds the heating chamber, and includes a cooling space by being isolated with the heat exchange unit abutting the heating chamber between the cooling chamber and the heating chamber.