The disclosure relates to a pulsating heat pipe including channel plate. The channel plate includes first surface, second surface, first channels, second channels, first passages, second passages, at least one chamber, and at least one third passage. The first channels and the chamber are formed on the first surface, the channels are formed on the second surface, and the first passages, the second passages, and the third passage penetrate through the first and second surfaces. The chamber has a closed end located opposite to the third passage and connected to at least one of the second channels via the third passage. The first and second channels are connected via the first and second passages. The chamber has a hydraulic diameter of D.sub.h which satisfies the following condition: $D_h>2\sqrt{\frac{\sigma }{\mathrm{\Delta \rho }g}},$
wherein σ is surface tension, Δρ is difference in density between liquid and vapor, and g is gravitational acceleration.

The disclosure relates to a pulsating heat pipe including channel plate. The channel plate includes first surface, second surface, first channels, second channels, first passages, second passages, at least one chamber, and at least one third passage. The first channels and the chamber are formed on the first surface, the channels are formed on the second surface, and the first passages, the second passages, and the third passage penetrate through the first and second surfaces. The chamber has a closed end located opposite to the third passage and connected to at least one of the second channels via the third passage. The first and second channels are connected via the first and second passages. The chamber has a hydraulic diameter of D.sub.h which satisfies the following condition: $D_h>2\sqrt{\frac{\sigma }{\mathrm{\Delta \rho }g}},$
wherein σ is surface tension, Δρ is difference in density between liquid and vapor, and g is gravitational acceleration.

A three dimensional pulsating heat pipe includes a three dimensional pipe coil structure and a heat exchange chamber. The three dimensional pipe coil structure is formed by winding at least one metal pipe to surround repeatedly a central axis and stack by extending along the central axis. Two opposite sides of the three dimensional pipe coil structure are arranged as a heating section and a condensation section, respectively. The heat exchange chamber is disposed at the heating section. Two opposite ends of the at least one metal pipe are connected with an interior of the heat exchange chamber.

A three dimensional pulsating heat pipe includes a three dimensional pipe coil structure and a heat exchange chamber. The three dimensional pipe coil structure is formed by winding at least one metal pipe to surround repeatedly a central axis and stack by extending along the central axis. Two opposite sides of the three dimensional pipe coil structure are arranged as a heating section and a condensation section, respectively. The heat exchange chamber is disposed at the heating section. Two opposite ends of the at least one metal pipe are connected with an interior of the heat exchange chamber.

A system including a cooling element and a support structure is described. The cooling element has a first side and a second side opposite to the first side. The cooling element is configured to undergo vibrational motion when actuated to drive a fluid from the first side to the second side. The support structure thermally couples the cooling element to a heat-generating structure via thermal conduction.

A system including a cooling element and a support structure is described. The cooling element has a first side and a second side opposite to the first side. The cooling element is configured to undergo vibrational motion when actuated to drive a fluid from the first side to the second side. The support structure thermally couples the cooling element to a heat-generating structure via thermal conduction.

A cooling module for an electronic device includes a body having formed therein a plurality of channels, a micro-structured boiling surface, a piezoelectric transducer, an inlet header, and an outlet header. Each channel of the plurality of channels is defined by a first channel surface and opposing lateral channel surfaces cooperatively defining a rectangular cross section normal to a channel axis. The micro-structured boiling surface is positioned adjacent the first channel surface of each channel The piezoelectric transducer is in acoustic communication with one of the opposing lateral channel surfaces of each channel and configured to direct acoustic waves on the micro-structured boiling surface. The inlet header is in fluid communication with each channel of the plurality of channels. The outlet header is in fluid communication with each channel of the plurality of channels.

A cooling module for an electronic device includes a body having formed therein a plurality of channels, a micro-structured boiling surface, a piezoelectric transducer, an inlet header, and an outlet header. Each channel of the plurality of channels is defined by a first channel surface and opposing lateral channel surfaces cooperatively defining a rectangular cross section normal to a channel axis. The micro-structured boiling surface is positioned adjacent the first channel surface of each channel The piezoelectric transducer is in acoustic communication with one of the opposing lateral channel surfaces of each channel and configured to direct acoustic waves on the micro-structured boiling surface. The inlet header is in fluid communication with each channel of the plurality of channels. The outlet header is in fluid communication with each channel of the plurality of channels.

The present disclosure provides a heat dissipation system, including: a coolant and a convection accelerator. The coolant is configured to contact at least a portion of the heat generating device; the convection accelerator is disposed in a predetermined region surrounding the heat generating device, configured to accelerate a flow of the coolant surrounding the heat generating device.

The present disclosure provides a heat dissipation system, including: a coolant and a convection accelerator. The coolant is configured to contact at least a portion of the heat generating device; the convection accelerator is disposed in a predetermined region surrounding the heat generating device, configured to accelerate a flow of the coolant surrounding the heat generating device.