A heat-dissipation substrate having a gradient sputtered structure includes at least two layers. A first layer is a heat-dissipation base layer, and a second layer is a gradient sputtered layer that is bonded onto the heat-dissipation base layer by gradient sputtering. An outermost surface layer of the gradient sputtered layer is a functional layer, and the gradient sputtered layer contains a main component of the heat-dissipation base layer and that of the functional layer. A percentage of the main component of the functional layer contained in the gradient sputtered layer monotonically increases or strictly monotonically increases along a direction from the heat-dissipation base layer toward the functional layer, and a percentage of the main component of the heat-dissipation base layer contained in the gradient sputtered layer monotonically increases or strictly monotonically increases along a direction from the functional layer toward the heat-dissipation base layer.

One variation of a method for fabricating a dermal heatsink includes: fabricating a substrate defining an interior surface, an exterior surface opposite the interior surface, and an open network of pores extending between the interior surface and the exterior surface; activating surfaces of the substrate and walls of the open network of pores; applying a coating over the substrate to form a heatsink, the coating comprising a porous, hydrophilic material and defining a void network; removing an excess of the coating from the substrate to clear blockages within the open network of pores by the coating; hydrating the heatsink during a curing period; heating the heatsink during the curing period to increase porosity of the coating applied over surfaces of the substrate; and rinsing the heatsink with an acid to decarbonate the coating along walls of the open network of pores in the substrate.

An immersion heat dissipation structure having a macroscopic fin structure and an immersion heat dissipation structure having a fin structure are provided. The immersion heat dissipation structure having a macroscopic fin structure includes a surface having at least two contact angles. At least one part of the surface has one of the at least two contact angles between an immersion cooling liquid that is greater than 90 degrees, and at least another part of the surface has another one of the at least two contact angles between the immersion cooling liquid that is from 0 degrees to 90 degrees.

A two-phase immersion type heat dissipation fin composite structure is provided. The two-phase immersion type heat dissipation fin composite structure includes a heat dissipation base layer, a bubble activation layer, and a fin structure. The fin structure and the bubble activation layer are both formed on the heat dissipation base layer, or the fin structure is formed on the bubble activation layer. The bubble activation layer is immersed in a two-phase coolant for increasing an amount of bubbles that is generated.

According to certain embodiments, an adsorption heat exchanger (AdHEX) part is provided. The AdHEX part comprises a linear guiding element, and a plurality of planar structures that include fins. Each of the planar structures is: mounted on the linear guiding element via a joint element, the joint element configured to cooperate with the linear guiding element to form a slider joint, coated with an adsorbent coating, and fixed on the linear guiding element, at a respective position, by a fixing means that restricts linear sliding movement of each of the planar structures to form an arrangement of coated planar structures that are stacked along the linear guiding element.

An electronics cooling system includes a printed circuit board (PCB) assembly having a heat generating component connected to a base. A plurality of thermally conductive microtubes are connected to the PCB assembly with a first spatial density. The plurality of thermally conductive microtubes are connected to a heat plate of a cooling system with a second spatial density to evenly spread the heat flux of the PCB assembly over the heat plate.

A heat transfer device for transferring heat energy to or from a gas or fluid flowing radially across a plurality of posts or tubes includes a plate having a plate surface. A plurality of posts or tubes are disposed on and protrude substantially perpendicular to the plate surface. At least about 50% of the plurality of posts or tubes are disposed according to a phyllotaxis layout. Each arc of a plurality of phyllotaxis spiral arcs of the phyllotaxis layout terminates at different locations along an arc radius on the plate at a phyllotaxis arc termination radius less than a perimeter radius.

A composite material for passive radiative cooling including a base layer, and at least one emissive layer located adjacent to a surface of the base layer, wherein the at least one emissive layer is affixed to the surface of the base layer via a binding agent. Also disclosed are methods of applying passive coolers to articles and surfaces to be adapted for passive radiative cooling.

Reverse flow microstructure water cooling unit for cooling of an electrical or electronic component which already includes an electrical pump which is placed above the middle of the bottom plate sucking the water out of the bottom micro fin cross structure and thereby generates micro turbulences which improve the cooling capability of the whole water cooling unit.

Flow paths and boundary layer restart features are provided. For example, a flow path comprises a flow path wall defining an inner flow path surface and an asymmetric notch defined in the flow path wall. The asymmetric notch comprises a first surface and a second surface and is asymmetric about a first line extending through an intersection of the first and second surfaces. Further, a flow boundary layer restart feature comprises a first surface extending inward with respect to a flow path surface of a flow path and a second surface extending inward with respect to the flow path surface. The second surface is asymmetric with respect to the first surface such that the first and second surfaces define an asymmetric notch. Additionally, a flow path wall may comprise an asymmetric notch that includes a flow expansion angle and a flow contraction angle that are unequal.