Patent classifications
F28F21/067
Fluid Connector Assembly
The fluid connector assembly includes a connector body with an intermediate portion that extends between opposite end portions and has a first bore. The connector body has an elongated wall that projects outwardly from the intermediate portion and that surrounds a second bore which opens to the first bore. A flat tube, which is made of a second material that is different than the first material and has at least one fluid passage, is in fluid communication with the second bore of the connector body. The flat tube has generally flat side walls and is lockingly retained with the connector body by male and female locking structures that cooperate with one another.
Heat exchanger
The present disclosure relates to a heat exchanger including a plurality of fluid guiding metal pipes (2) having pipe ends (3) arranged side by side at intervals, at least one pipe bottom (4) made of plastic and having receiving through-holes (5) in which the pipe ends (3) may be received, and a collection box (6) made of plastic and which may be connected to the pipe bottom (4) by a locking device formed between the pipe bottom and the collection box, wherein a seal (9) may be inserted between the pipe bottom (4) and the collection box (6), and the seal ensures press-fit of the pipe bottom (4) on the pipe ends (3) and seals the collection box (6) against the pipe bottom (4) and the pipe bottom (4) against the pipe ends (3).
RADIATIVE COOLING DEVICE HAVING MULTILAYER STRUCTURE
The present disclosure relates to a technical idea of reducing the surface temperature of a material or temperature under a material by emitting heat under a device to the outside by absorbing and emitting long-wavelength infrared light corresponding to the wavelength range of the atmospheric window while minimizing absorption of light of the solar spectrum. More particularly, the present disclosure relates to a technology for providing a radiative cooling device having a multilayer structure that is capable of increasing sunlight reflection through differences in the refractive indexes of the device-forming materials while performing selective emission over the wavelength range of the atmospheric window using a radiative cooling device having a multilayer structure composed of polymers and inorganic materials.
CURABLE THERMAL INTERFACE MATERIAL AND COOLING DEVICE, AND COOLING DEVICE MANUFACTURING METHOD THEREOF
A curable thermal interface material and a cooling device, and a cooling device manufacturing method thereof are provided. The curable thermal interface material includes thermal conductive material and polymeric material, which is formed from the mixture of thermal conductive material and polymeric material. The curable thermal interface material is disposed on the heat sink, so as to properly conduct heat from the heat source to the heat sink to achieve heat dissipation.
RADIATIVE COOLING STRUCTURES AND SYSTEMS
Polymer-based selective radiative cooling structures are provided which include a selectively emissive layer of a polymer or a polymer matrix composite material. Exemplary selective radiative cooling structures are in the form of a sheet, film or coating. Also provided are methods for removing heat from a body by selective thermal radiation using polymer-based selective radiative cooling structures.
Floating heat sink support with conductive sheets and LED package assembly for LED flip chip package
A floating heat sink support with copper sheets for a LED flip chip package may include least two copper sheets and a flexible polymer for fixing the copper sheets, where the copper sheets separated from each other, and where each of the copper sheets is electrically connected with a positive or negative pole of a LED flip chip. Further, a LED package assembly may comprise the floating heat sink support as mentioned above and one or more LED chips welded in a flip chip manner on the floating heat sink support. A number of copper sheets in the floating heat sink support are heated separately and expand separately to avoid the breakage of a chip substrate resulting from the thermal expansion of a whole bulk of copper sheet, thereby improving the reliability of the LED package structure and prolonging the service life of a LED light source.
Indirect-Type Air Cooler
The invention relates to an indirect-type air cooler by way of which compressed charge air for an internal-combustion engine is cooled by means of a liquid, wherein the air cooler is constructed from stacked pairs of plates having fins which are disposed therebetween, and the brazed stack is disposed in a housing into which the charge air flows, flows through the fins and exits the housing again. The charge air exchanges heat with the liquid which flows in the plate pairs and which is introducible into the plate pairs via at least one inlet and via inlet-side plate openings which are flush in the stack and is dischargeable via at least one outlet by means of flush outlet-side plate openings. In order to further improve the performance potential of the air cooler, at least one venting element which extends to the exterior through an opening of the housing is connected to a liquid space within the stack.
MANUFACTURE OF HEAT EXCHANGERS VIA HYBRID WELDING
A method for forming a hybrid heat exchanger is provided. The method includes laser-texturing a metal surface to create a plurality of microstructures and subsequently melt-bonding a plastic component to the plurality of microstructures. During melt-bonding, plastic material penetrates the plurality of microstructures and conforms to the plastic component to the metal surface. After hardening inside the microstructures, the plastic component adheres to the metal surface as a hybrid component. As a result, a fastener or snap connection is not required, and the plastic-metal joint provides a barrier to water, glycol-based fluids, air, and other fluids.
Heat exchanger and production method
A stub connection for a heat exchanger that is arranged in a housing and has a stack including plates and fins. The housing consists of housing parts which can be joined together, and at least one first stub for a first heat-exchanging medium being integrated directly into the housing. The stub connection also includes at least one second stub for a second heat-exchanging medium that extends to outside the housing. The at least one second stub is configured for the connection of a line and is integrated directly or indirectly into the housing.
Heat exchanger in a housing
A heat exchanger including a stack of tubes, a cover plate, and a housing in which the stack of tubes is arranged. The housing includes first, second, and third adjacent housing sides having a respective first, second, and third housing openings each having a edge around the respective housing opening. The second housing opening is closed by the edge of the cover plate on the edge of the second housing opening. The housing further includes first and second exposed struts. The first exposed strut is positioned between the first and the second housing openings and the second exposed strut is positioned between the second and the third housing openings, and a first side of an edge of the cover plate is fastened to the first exposed strut and a second side of the edge of the cover plate is fasted to the second exposed strut.