In a dual material vapor chamber and an upper shell thereof, the dual material vapor chamber includes an upper shell, a copper lower shell, and a working fluid. The upper shell includes an aluminum substrate and plural aluminum fins. The aluminum substrate has an outer surface and an inner wall. The aluminum fins individually extend from the outer surface and are formed integrally. A copper deposition layer is coated on the inner wall. The copper lower shell is sealed to the upper shell correspondingly. A chamber is formed between the upper shell and the copper lower shell. The working fluid is filled in the chamber. Therefore, the weight and material cost of the whole vapor chamber can be reduced, and the packing combination between the upper shell and the copper lower shell can be simplified.

Disclosed is a heat exchanger comprising a first flow path with an inlet, an outlet and a first surface and a second flow path with an inlet, an outlet and a second surface wherein at least one of the first surface and the second surface has a portion consisting of a shape memory alloy which has a first shape at a first temperature, a second shape at a second temperature different than the first temperature, and returns to the first shape in response to a return to the first temperature.

Heat exchanger, in particular for cooling power electronics, comprising an insulating element which separates a first fluid medium, which is in contact with a heat source, from a second fluid medium, which differs in at least one property from the first fluid medium and which is in fluid connection with a heat sink or is itself a heat sink, and a heat transfer element which has a higher thermal conductivity than the insulating element, wherein the insulating element comprises at least a first passage opening in which a first heat transfer element is arranged, wherein the heat transfer element is thermally connected both to the first fluid medium and/or the heat source, and to the second fluid medium and is fluidically sealed with respect to the insulating element by means of a sealing element.

Systems with indium application to heat transfer surfaces and related methods are described. A system includes a chassis, arranged inside a housing, having at least one slot for receiving a blade. The blade, arranged in a slot of the chassis, includes a first circuit board having a plurality of components mounted on a substrate. The blade further includes a first heat spreader comprising a metal. The first heat spreader including metal is arranged to transfer heat from the first circuit board to a cooling system via a first interface between a first surface of the first heat spreader and a second surface of the chassis, and where indium is permanently bonded to either the first surface of the first heat spreader, or the second surface of the chassis, or both the first surface of the first heat spreader and the second surface of the chassis.

A heat exchanger can include a monolithically formed body defining at least two channels configured to allow fluid to flow therethrough, at least one of the at least two channels at least partially wrapping around or within at least one other of the at least two channels. In certain embodiments, the at least two channels can include a first channel and a second channel, wherein the first channel is at least partially wound around or within the second channel.

A method for manufacturing a roll mantle or roll body for a roll line of a continuous casting apparatus that has a shaft includes casting a metal to form the roll mantle or roll body such that the roll mantle or roll body includes at least one internal channel. The roll mantle or roll body has a first end region, a second end region and a central region between the first end region and the second end region, the central region extending along at least 50% of a length of the roll mantle or roll body, and the internal channel may be formed in the central region. The internal channel may also include a pattern or projection.

A heat dissipation device, includes a vapor chamber including a heat conduction chamber and a first wick structure, the heat conduction chamber having a recessed portion, and the first wick structure disposed in the heat conduction chamber; and a heat pipe including a pipe body and a second wick structure disposed in the pipe body, the pipe body positioned in the recessed portion of the heat conduction chamber. The first wick structure and the second wick structure are metallically bonded.

Hybrid additive featured plates used to form an overall microchannel heat exchanger and corresponding method of manufacture are disclosed. Various additive manufacturing (AM) techniques may be used to form walls defining microchannel features on a plate substrate. The manufacturing method is a hybrid process in that leverages both additive and conventional manufacturing techniques to minimize both cost and fabrication time.

A heat exchanger element includes a body and at least one deformable surface feature disposed at an outer body surface of the body. A cross-section of the heat exchanger element is oriented parallel to a cross-sectional plane of the heat exchanger element. At least one of the body and the at least one surface feature is configured to selectively respond to a temperature change such that a physical characteristic of the heat exchanger element changes in response to a temperature change. The physical characteristic is selected from the group consisting of: a shape of the heat exchanger element, a surface area of the heat exchanger element, a surface roughness of the heat exchanger element, and combinations thereof.

A cooling device, satisfying at least one of following (1) or (2): (1) comprising a casing and a flow channel that is disposed inside the casing, the casing comprising a metal portion and a resin portion that is bonded to at least a portion of the metal portion. (2) comprising a casing that comprises a metal, a flow channel that is disposed inside the casing, and a component that comprises a resin and is bonded to a surface of the casing.