Systems with indium application to heat transfer surfaces and related methods are described. A system includes a chassis, arranged inside a housing, having at least one slot for receiving a blade. The blade, arranged in a slot of the chassis, includes a first circuit board having a plurality of components mounted on a substrate. The blade further includes a first heat spreader comprising a metal. The first heat spreader including metal is arranged to transfer heat from the first circuit board to a cooling system via a first interface between a first surface of the first heat spreader and a second surface of the chassis, and where indium is permanently bonded to either the first surface of the first heat spreader, or the second surface of the chassis, or both the first surface of the first heat spreader and the second surface of the chassis.

A method of forming at least a component of a heat exchanger comprises introducing a feed material comprising a first portion including a matrix material and a second portion including a sacrificial material on a surface of a substrate, exposing at least the first portion to energy to form bonds between particles of the matrix material and form a first thickness of a structure, introducing additional feed material comprising the first portion over the first thickness of the structure, exposing the additional feed material to energy to form a second thickness of the structure, and removing the sacrificial material from the structure to form at least one channel in the structure. Related heat exchangers and components, and related methods are disclosed.

A vapor chamber that includes a housing defining an internal space, and a working medium and a wick structure in the internal space of the housing. As viewed in a plan view, the vapor chamber has a first region with a first thickness and a second region with a second thickness, the second thickness being smaller than the first thickness.

A method of manufacturing a multi material device for heat transfer, and a multi material device is disclosed comprising: depositing, by an additive manufacturing technique, a first material onto a scaffold; depositing, by an additive manufacturing technique, a second material onto at least part of the first material, wherein, one of the first or second material is a heat transfer material having first thermal conductivity, a first chemical resistance and a first erosion resistance and the other is a rugged material of a second thermal conductivity, a second chemical resistance and a second erosion resistance, such that the second thermal conductivity is lower than the first thermal conductivity and at least one of the second chemical resistance or second erosion resistance is higher that the respective first chemical resistance or first erosion resistance.

A cooling device including: a resin flow path which is provided with a space portion serving as a flow path in at least one surface; a metal cooling panel for cooling a heating element, which covers the space portion and of which at least a part is in contact with the resin flow path; and a resin bonding member for bonding the resin flow path and the metal cooling panel, in which the metal cooling panel has a fine uneven structure at least on a surface of a bonding portion with the resin bonding member, and the metal cooling panel and the resin bonding member are bonded by allowing a part of the resin bonding member to enter into the fine uneven structure.

A method of forming at least a component of a heat exchanger comprises introducing a feed material comprising a first portion including a matrix material and a second portion including a sacrificial material on a surface of a substrate, exposing at least the first portion to energy to form bonds between particles of the matrix material and form a first thickness of a structure, introducing additional feed material comprising the first portion over the first thickness of the structure, exposing the additional feed material to energy to form a second thickness of the structure, and removing the sacrificial material from the structure to form at least one channel in the structure. Related heat exchangers and components, and related methods are disclosed.

There is provided a cobalt-based alloy product comprising: in mass %, 0.08-0.25% C; 0.1% or less B; 10-30% Cr; 5% or less Fe and 30% or less Ni, the total amount of Fe and Ni being 30% or less; W and/or Mo, the total amount of W and Mo being 5-12%; at least one of Ti, Zr, Hf, V, Nb and Ta, the total amount of Ti, Zr, Hf, V, Nb and Ta being 0.5-2%; 0.5% or less Si; 0.5% or less Mn; 0.003-0.04% N; and the balance being Co and impurities. The cobalt-based alloy product is a polycrystalline body of matrix phase crystal grains, wherein MC type carbide phase grains are dispersively precipitated in the matrix phase crystal grains at an average intergrain distance of 0.13 to 2 μm and M.sub.23C.sub.6 type carbide phase grains are precipitated on grain boundaries of the matrix phase crystal grains.

A heat dissipation apparatus that is configured to provide heat dissipation from electronic devices such as but not limited to a computer. The heat dissipation apparatus of the present invention is provided in three embodiments that include a vapor chamber, a heat pipe and a heat sink. The latter embodiment includes a support plate having an upper surface to which the core member of the present invention is secured. The heat pipe and vapor chamber embodiment of the present invention include a sealed housing creating an interior volume in which the core member is disposed. The core member of the present invention is manufactured from metal and is formed by three dimensional printing in a gyroid shape.

A method of enhancing an open celled foam metal heat exchanger is presented where the structure uses fluid channels that distribute fluid and/or air across a continuous flow field. The heat exchanger not only improves heat transfer properties given a required pressure drop but also takes into consideration the need to manufacture low cost solutions that may be mass produced to meet high capacity throughput requirements for the air and space industries.

A heat exchanger in one aspect includes a longitudinal shell and a transverse shell oriented transversely thereto. A J-shaped tube bundle carrying a tube-side fluid extends through the longitudinal and transverse shells from a first tubesheet in the longitudinal shell to a second tubesheet in the transverse shell. The first and second tubesheets are oriented perpendicular to each other. In a related aspect a dual heat exchanger unit includes a first longitudinal shell, a second longitudinal shell, and a common transverse shell extending transversely between and fluidly coupled to the longitudinal shells. The longitudinal shells may be parallel to each other. The shells are fluidly coupled directly together to form a common shell-side space between pairs of inlet and outlet tubesheets. A pair of J-shaped tube bundles is disposed in the dual heat exchanger unit for heating two tube-side fluids.