A heatsink assembly, a method of producing a heat sink assembly and an electrical device. The heatsink assembly including a heatsink having a surface for receiving a heat source, a copper insert and a layer of low density pyrolytic graphite. The copper insert and the layer of low density pyrolytic graphite are arranged on the surface of the heatsink in layers to form a heat transferring assembly, and the heat transferring assembly is adapted to receive a heat source for transferring the heat from the heat source to the heatsink.

The present application discloses two-phase cooling devices that may include at least three substrates: a metal with a wicking structure, an intermediate substrate and a backplane. The titanium thermal module may be adapted for use in a mobile device, such as a portable device or smartphone, where it may offer compelling performance advantages. The thermal module may also have a metal layer which may act as a shield for radiation or an antenna for radiation, or may add mechanical strength to the thermal module.

A space system including a layered structure on an outer surface of the space system, the layered structure including a conductive veil or nonwoven comprising conductive fibers, and a non-conductive sheet arranged on a surface of the conductive veil or nonwoven.

A metal matrix (2) for a heat exchanger (1), comprising a stack of components (4, 5, 6), in particular etched plates or corrugations (4), separator sheets (5) and bars (6), or a combination of the two types of stack, said components (4, 5, 6) being held relative to one another by layers of braze material (3), thereby ensuring the mechanical integrity of the matrix, the matrix including fluid circulation passages (10) within it, each fluid circulation passage (10) having an inner wall provided to fully contain said fluid radially, characterized in that each inner wall is fully covered with a corrosion-resistant coating (7). Preferred application to heat exchangers based on carbon steel or stainless steel.

An aluminum alloy clad material includes a core material, one side being clad with cladding material 1, the other side being clad with cladding material 2, the core material including an aluminum alloy that includes 0.5 to 1.8% of Mn, and limited to 0.05% or less of Cu, with the balance being Al and unavoidable impurities, the cladding material 1 including an aluminum alloy that includes 3 to 10% of Si, and 1 to 10% of Zn, with the balance being Al and unavoidable impurities, and the cladding material 2 including an aluminum alloy that includes 3 to 13% of Si, and limited to 0.05% or less of Cu, with the balance being Al and unavoidable impurities, wherein the Si content X (%) in the cladding material 1 and the Si content Y (%) in the cladding material 2 satisfy the value (YX) is 1.5 to 9%.

A process for producing an amorphous ductile brazing foil is provided. According to one example embodiment, the method includes providing a molten mass, and rapidly solidifying the molten mass on a moving cooling surface with a cooling speed of more than approximately 10.sup.5 C./sec to produce an amorphous ductile brazing foil. A process for joining two or more parts is also provided. The process includes inserting a brazing foil between two or more parts to be joined, wherein the parts to be joined have a higher melting temperature than that the brazing foil to form a solder joint and the brazing foil comprises an amorphous, ductile Ni-based brazing foil; heating the solder joint to a temperature above the liquidus temperature of the brazing foil to form a heated solder joint; and cooling the heated solder joint, thereby forming a brazed joint between the parts to be joined.

According to an aspect of the present disclosure, a porous plate is provided. The porous plate includes a body having an upper surface, a lower surface opposite the upper surface and sidewalls extending between respective entireties of the upper surface and the lower surface, the body being formed of porous material, and a metallic coating, which is thermally deposited onto an entirety of the sidewalls to form a high-strength mechanical bond with the entirety of the sidewalls.

Use of an aluminium composite material in a thermal joining method, said material consisting of at least one aluminium core alloy and at least one external brazing layer consisting of an aluminium brazing alloy provided on one or both sides of the aluminium core alloy, wherein the aluminium brazing layer has a pickled surface. Reduced costs and a lower environmental impact is achieved by using an aluminium composite material in which the pickled surface of the aluminium brazing layer had been pickled by pickling with an acid, aqueous pickling solution containing at least one mineral acid and at least one complex-forming agent or a complexing mineral acid, wherein the removal of material in the pickling is between 0.05 g/m.sup.2 and 6 g/m.sup.2, the aluminium composite material is used in a flux-free, thermal joining method, and the joining method is carried out in the presence of a protective gas.

A multipart lid is provided. The multipart lid may include a formed upper lid designed for maximum heat dissipation, a coined lower lid joined to the formed upper lid, where the coined lower lid comprises a coefficient of thermal expansion (CTE) substantially equal to a CTE of a first semiconductor component. A structure is provided. The structure may include a substrate, a first semiconductor component electrically connected and mounted on the substrate, one or more discrete components electrically connected and mounted on the substrate, a substrate mounted multipart lid covering both the semiconductor component and the one or more discrete components, where the multipart lid comprises a heat dissipating upper lid and a lower lid, where a coefficient of thermal expansion (CTE) of the lower lid substantially matches a CTE of the first semiconductor component.

An apparatus is provided which comprises: a die comprising an integrated circuit, a first material layer comprising a first metal, the first material layer on a surface of the die, and extending at least between opposite lateral sides of the die, a second material layer comprising a second metal over the first material layer, and a third material layer comprising silver particles and having a porosity greater than that of the second material layer, the third material layer between the first material layer and the second material layer. Other embodiments are also disclosed and claimed.