A brazing sheet for flux-free brazing has an outermost surface brazing filler metal layer, consisting of an AlSi-based alloy containing 2 to 13% Si in mass %, and an intermediate brazing filler metal layer, consisting of an AlSiMg-based alloy containing 4 to 13% Si and 0.1 to 5.0% Mg in mass %, which are cladded on one or both sides of a core material. In the outermost surface brazing filler metal layer, the number of Si particles having a circle equivalent diameter of 1.75 m or more is 10% or more of the number having a circle equivalent diameter of 0.8 m or more, as observed in the direction of the surface layer. The intermediate brazing filler metal layer contains less than 3000 per 10000 m.sup.2 of Si particles having a circle equivalent diameter of 0.25 m or more, as observed in a cross section of the brazing filler metal layer.

An aluminum alloy brazing sheet has a 3XXX, 1XXX or 6XXX core, an interliner and a 4XXX brazing layer without added Mg. The interliner has Bi and Mg, the magnesium migrating to the surface of the brazing sheet during brazing and reducing the aluminum oxide to facilitate brazing without flux in a controlled inert atmosphere with reduced oxygen.

Disclosed are a flexible display screen and a flexible display device. The flexible display screen includes a flexible display panel and a driver chip, the flexible display panel includes a support portion, a first heat insulation layer, a heat dissipation layer, and a second heat insulation layer which are arranged in sequence along a direction from back to a light-emitting surface, the support portion is provided with a recess, and the driver chip is received in the recess.

[OBJECT] To provide an evaporator which can improve heat exchange performance.

[SOLVING MEANS] An evaporator including a metal wall and a porous metal film directly connected to the metal wall, wherein the porous metal film has communication holes having an average pore size of 8 m or less, and the porous metal film has a porosity of 50% or more.

The present disclosure relates to efficient heat exchanger components, such as pipe apparatuses including the same. Methods of fabricating heat exchange components are also disclosed. A condensing apparatus can include a condenser surface having a substrate and one or more layers of graphene. The substrate can be formed of nickel and a nickel-graphene surface composite layer can be formed. The substrate-graphene composite can be highly durable, hydrophobic, and resistant to fouling. Dropwise condensation can be induced.

In a mixed composition coating material for brazing, when a total mass of a solid material, an organic solvent, and water is defined as 100 mass %, the solid material are contained in an amount of 30 mass % or greater and 80 mass % or less with respect to the whole coating material, the organic solvent and the water is contained in a total amount of 20 mass % or greater and 70 mass % or less with respect to the whole coating material, and the water is contained in an amount of 0.4 mass % or greater and 2.5 mass % or less with respect to the whole coating material.

A semiconductor microcooler is fabricated by forming fins in a semiconductor substrate and forming a metal layer upon the fins. A stacked microcooler may be formed by stacking a plurality of semiconductor microcoolers. The microcoolers may be positioned such that the fins of each microcooler are aligned. One or more microcoolers may be thermally connected to a surface of a coolant conduit that is thermally connected to an electronic device heat generating device, such as an integrated circuit (IC) chip, or the like. Heat from the electronic device heat generating device may transfer to the one or more microcoolers. A flow of cooled liquid may be introduced through the conduit and heat from the one or more microcoolers may transfer to the liquid coolant.

The present application discloses two-phase cooling devices that may include at least three substrates: a metal with a wicking structure, an intermediate substrate and a backplane. The titanium thermal module may be adapted for use in a mobile device, such as a portable device or smartphone, where it may offer compelling performance advantages. The thermal module may also have a metal layer which may act as a shield for radiation or an antenna for radiation, or may add mechanical strength to the thermal module.

A heat radiating member includes: a composite portion composed of a composite material which contains particles of a satisfactorily thermally conductive material in a metal matrix; and a metal layer formed on at least one surface of the composite portion and composed of a metal. A method for producing a heat radiating member includes: a preparation step to prepare a composite material which contains particles of a satisfactorily thermally conductive material in a metal matrix; a powder arrangement step to dispose a metal powder composed of metal particles on at least one surface of the composite material; and a heating step to heat the composite material and the metal powder, with the metal powder disposed on the composite material, to form a metal layer composed of a metal of the metal powder on a composite portion composed of the composite material.

A semiconductor microcooler is fabricated by forming fins in a semiconductor substrate and forming a metal layer upon the fins. A stacked microcooler may be formed by stacking a plurality of semiconductor microcoolers. The microcoolers may be positioned such that the fins of each microcooler are aligned. One or more microcoolers may be thermally connected to a surface of a coolant conduit that is thermally connected to an electronic device heat generating device, such as an integrated circuit (IC) chip, or the like. Heat from the electronic device heat generating device may transfer to the one or more microcoolers. A flow of cooled liquid may be introduced through the conduit and heat from the one or more microcoolers may transfer to the liquid coolant.