A copper-alloy heat-dissipation structure with a milled surface includes a heat-dissipation main body. The heat-dissipation main body has a first milled surface and a second milled surface that are opposite to each other, where heat-dissipation fins are formed on the first milled surface, and the maximum height roughness Rz of the second milled surface ranges from 2.5 μm to 5.4 μm.

A heatsink assembly, a method of producing a heat sink assembly and an electrical device. The heatsink assembly including a heatsink having a surface for receiving a heat source, a copper insert and a layer of low density pyrolytic graphite. The copper insert and the layer of low density pyrolytic graphite are arranged on the surface of the heatsink in layers to form a heat transferring assembly, and the heat transferring assembly is adapted to receive a heat source for transferring the heat from the heat source to the heatsink.

A brazing sheet for flux-free brazing has an outermost surface brazing filler metal layer, consisting of an Al—Si-based alloy containing 2 to 13% Si in mass %, and an intermediate brazing filler metal layer, consisting of an Al—Si—Mg-based alloy containing 4 to 13% Si and 0.1 to 5.0% Mg in mass %, which are cladded on one or both sides of a core material. In the outermost surface brazing filler metal layer, the number of Si particles having a circle equivalent diameter of 1.75 μm or more is 10% or more of the number having a circle equivalent diameter of 0.8 μm or more, as observed in the direction of the surface layer. The intermediate brazing filler metal layer contains less than 3000 per 10000 μm.sup.2 of Si particles having a circle equivalent diameter of 0.25 μm or more, as observed in a cross section of the brazing filler metal layer.

A manufacturing method of middle member structure includes steps of applying an external force to a plate body to shape the plate body and form multiple recessed/raised structures and perforating the plate body to form multiple perforations misaligned from the recessed/raised structures so as to achieve a plate body with recessed/raised structures. The middle member structure is applicable to a vapor chamber to enhance the vapor-liquid circulation effect and the support for the internal chamber.

An aluminum alloy brazing sheet may include a sacrificial material having a function of a brazing material on at least one surface of a core material, wherein the sacrificial material has a composition containing: in a mass %, 2% to 5% of Si; 3% to 5% of Zn; and an Al balance with inevitable impurities the core material is made of an Al—Mn-based alloy, an in the core material before brazing, Al—Mn based secondary particles having an equivalent circle diameter of 100 to 400 nm are distributed with a number density of 0.3 to 5 particles/μm.sup.2.

A device which includes a heat generator, a resinous housing covering the heat generator, and a heat radiation material disposed on at least some of the surfaces of the heat generator, wherein the heat radiation material includes metal particles and a resin and has a region where the metal particles arranged along the surface direction are present at a relatively high density.

A radiator structure is provided. The radiator structure includes a substrate, a first metal coating layer and a second metal coating layer. The first metal coating layer and the second metal coating layer are made of materials different from one another, and are formed on the substrate by different processes. The first metal coating layer is a non-first masking area formed on the substrate by wet processing. The second metal coating layer is a non-second masking area correspondingly formed on the first metal coating layer and the substrate by sputtering. A first masking area and a second masking area are not necessarily the same.

Methods and apparatus include a hair iron having a ceramic heater between first and second arms movable relative to each other between open and closed positions. The ceramic heater has resistive traces that heat up hair during use upon being connected to a power source. On a side of the ceramic heater opposite the resistive traces, a layer of metal is formed to spread out during use the heat from the resistive traces. The metal may be formed as a single or multiple layers. The composition of the metal can be, representatively, pure or alloys of silver, copper, or aluminum with platinum or palladium. The shape of the metal varies as does its coverage on a surface area of the ceramic heater.

A heat exchanger, a processing method of a heat exchanger and a composite material, wherein the heat exchanger includes a collecting pipe, a fin and a numnber of heat exchange tubes. Each of the heat exchange tubes is fixed to the collecting pipe, and an inner cavity of the heat exchange tube is communicated with an inner cavity of the collecting pipe. The fin is retained between two adjacent heat exchange tubes. The heat exchanger further includes a coating layer which is coated on an outer surface of at least one of the collecting pipe, the heat exchange tube and the fin. The coating layer includes micro-nano particles and a polymer obtained by polymerizing monomers including allylic monomers with hydrophilic groups. The micro-nano particles include silicon dioxide and/or titanium dioxide. The coating layer of the heat exchanger has excellent hydrophilic durability.

A thermal radiation heat dissipation device for an electronic component includes a heat dissipation substrate including a heat dissipation surface having a heat dissipation surface emissivity; and an emissivity modulation layer disposed on the heat dissipation surface including an emissivity modulation layer surface having an emissivity modulation layer surface emissivity. The emissivity modulation layer surface emissivity is greater the heat dissipation surface emissivity.