Disclosed area reinforcing thermal radiation coating and application and a radiant heat exchange apparatus using the same. The reinforcing thermal radiation coating comprises a reinforcing material component, a black material component and a binder. The reinforcing material component is silicon and/or boron. The coating can be applied to a surface of a metal material for use as a coating film. A radiant heat exchange apparatus comprises a first metal radiant plate and a heat exchange core plate formed by a second metal radiant plate and a heat transfer core plate. The coating can form a coating film on the surface of a metal material, which can greatly improve the absorptivity and emissivity of the surface of the metal material. The apparatus can be used for cooling and heating and can work for cooling in a hot and humid environment without dew condensation and also has a high cooling capacity.

A heat exchanger, a manufacturing method thereof and a thermal management system are provided. The heat exchanger includes a metal substrate having a fluid channel for circulating a heat exchange medium, and a coating layer coated on at least part of a surface of the metal substrate. The coating layer includes a rare earth conversion film containing a rare earth element-containing compound, and a hydrophobic film. The rare earth conversion coating film is arranged to directly cover at least part of a surface of the metal substrate of the heat exchanger, and at least part of the hydrophobic coating layer is further away from the metal substrate than the rare earth conversion film. The heat exchanger is provided with hydrophobicity by the coating layer, which facilitates the discharge of condensed water, and improves the corrosion resistance and prolongs the service life of the heat exchanger.

An immersion-type liquid cooling heat dissipation structure is provided. The immersion-type liquid cooling heat dissipation structure includes a metal heat dissipation substrate layer and a metal film layer. The metal film layer is formed on a surface of the metal heat dissipation substrate layer, and is configured to be immersed in an immersion-type coolant. An effective thickness of the metal film layer is less than 500 .Math.m. A surface of the metal film layer has a plurality of micropores that facilitate generation of vapor bubbles. An effective width of each of the plurality of micropores is between 1 .Math.m and 200 .Math.m, and a depth of each of the plurality of micropores is between 100 nm and 50 .Math.m.

The present application provides a heat exchanger and a manufacturing method of a heat exchanger. The heat exchange includes a metal substrate having a fluid channel for circulating a heat exchange medium. The heat exchanger includes a coating having a rare earth conversion coating and a hydrophilic coating. The rare earth conversion coating is arranged to cover at least part of a surface of the metal substrate, and the rare earth conversion coating includes a rare earth element-containing compound. At least part of the hydrophilic coating is further away from the metal substrate than the rare earth conversion coating. A surface of the heat exchanger is hydrophilic, which is conducive to the discharge of condensate water, and can improve corrosion resistance and prolong a service life of the heat exchanger.

Methods and apparatus include a hair iron having a ceramic heater between first and second arms movable relative to each other between open and closed positions. The ceramic heater has resistive traces that heat up hair during use upon being connected to a power source. On a side of the ceramic heater opposite the resistive traces, a layer of metal is formed to spread out during use the heat from the resistive traces. The metal may be formed as a single or multiple layers. The composition of the metal can be, representatively, pure or alloys of silver, copper, or aluminum with platinum or palladium. The shape of the metal varies as does its coverage on a surface area of the ceramic heater.

A heat spreader. The heat spreader includes a copper substrate layer, and at least one layer of graphene deposited on the copper substrate layer.

A composite structure includes a first layer and a second layer that are stacked, the first layer is configured to connect the second layer and a flexible display, and the second layer is configured to dissipate heat. Each of the first layer and the second layer includes a first surface and a second surface opposite to each other, where the first surface of the first layer is proximate to the flexible display, and the first surface of the second layer is proximate to the second surface of the first layer. An elastic modulus of the first layer is greater than or equal to an elastic modulus of the second layer, and a coefficient of thermal conductivity of the first layer is less than or equal to a coefficient of thermal conductivity of the second layer.

An aluminum alloy brazing sheet for a heat exchanger includes a three-layer material in which a brazing material layer, an intermediate layer, and a core material are cladded and stacked, the intermediate layer is formed of an aluminum alloy which can include Mn, Si, Fe, and Cu, with the balance being Al and inevitable impurities, the core material is formed of an aluminum alloy which can include Si, Fe, Cu, and Mn, with the balance being Al and inevitable impurities, and the brazing material layer is formed of an aluminum alloy including Si, with the balance being Al and inevitable impurities.

Provided is a heat sink having a clad structure of Co—Mo composite materials and Cu materials, satisfying high heat-sink properties required of the heat sink for use in a semiconductor package with a frame on which a high-output and small-sized semiconductor is mounted, and preventing, when applied to the semiconductor package with a frame, crack of the frame due to local stress concentration. The heat sink has three or more Cu layers and two or more Cu—Mo composite layers alternately stacked in a thickness direction so that the Cu layers are outermost layers on both sides thereof, the Cu layers as the outermost layers each having a thickness t.sub.1 of 40 μm or more, the heat sink satisfying 0.06≤t.sub.1/T≤0.27 (where T: heat sink thickness) and t.sub.2/T≤0.36/[(total number of layers−1)/2] (where t.sub.2: Cu—Mo composite layer thickness, the total number of layers: sum of numbers of Cu layers and Cu—Mo composite layers).

Improved heat exchangers and methods of manufacturing the heat exchangers are provided. The methods include modification of surface(s) of the heat exchanger in an integrated manner during manufacturing, to impart desired properties such as decreased corrosion, pressure drop, and water retention, and increased anti-frosting performance.