A plate-type heat exchanger and a method for manufacturing same are provided. A plate-type heat exchanger includes a first plate and a second plate which have flange parts vertically adhered by an adhesive, respectively. The flange parts are formed in a stepped shape and may thus increase an area adhered to the first plate and the second plate.

A radiator which rejects heat to its surrounding environment through radiation, comprising layers of thermally conductive material in a tapered geometry. As well, a radiator which incorporates structural support to maintain rigidity in the out-of-plane directions for its thermally conductive layers. The radiator is used by incorporating a source of heat to the layers, having a lower temperature in the surrounding environment, and structurally attaching to an assigned location.

A cooling system for a photovoltaic panel including micro flat heat pipes (HP) integrated with thermoelectric generators (TEG) and a cooled water reservoir for cooling the working fluid in heat pipes. The cooled water in the reservoir is pumped from the condensate pan of an air conditioner. Experimental results show that cooling system reduced the average temperature of the panel by as much as 19? C. or 25%. Further, the output power of the photovoltaic panel increased by 44% when the photovoltaic panel was used in a very hot climate (30-40? C.). An additional two watts of power was generated by the TEGs.

A radiator assembly having a plurality of thermally conductive layers arranged in a stack of layers and a heat transfer clamping bracket operably coupled to a first end of the layers of the stack, the clamping bracket being configured to deliver heat from a heat source to the layers. Each stack of layers has a tapered overall shape in cross section due to sequentially shorter lengths of the thermally conductive layers exposing a second end of each layer to a surrounding environment for heat rejection, a total thickness of the stack diminishing with distance away from said heat transfer clamping bracket.

The invention relates to an apparatus for conducting a fluid, in particular a cooling fluid for cooling components to be cooled, in particular for cooling electronics components and/or battery cells and/or battery modules, having a first covering plate and a second covering plate and having a structural mesh between the two covering plates for defining a spatial region, through which flow can pass, a division being provided by reshaping of the structural mesh and/or by introduction of a sealant for at least partially sealing the spatial region with respect to an outer space and/or for dividing the spatial region into definable flow channels.

The disclosure is related to an identity recognition device. The identity recognition device includes a thermal conductive casing, an identity recognition module, a heat dissipation assembly, and a heat dissipation coating. The heat dissipation assembly includes a plurality of heat pipes, a heat absorbing block and a first heat sink. The heat pipes are disposed on the thermal conductive casing, and are in thermal contacts with the thermal conductive casing. The heat absorbing block is in thermal contacts with the identity recognition module, and two opposite sides of the first heat sink respectively are in thermal contacts with the heat pipes and the heat absorbing block. The heat dissipation coating is coated on the thermal conductive casing and the heat pipes, wherein the thermal conductivity of the heat dissipation coating is larger than the thermal conductivities of the thermal conductive casing and the heat pipes.

A cooling device for cooling power electronics may include a heat-dissipating cooling plate and a contacting surface arranged thereon. The contacting surface may include multiple conductors arranged thereon configured to fix and contact a power electronics. The contacting surface may be electrically insulated from the heat-dissipating cooling plate. Between the heat-dissipating cooling plate and the contacting surface at least one organic intermediate layer may be arranged. The at least one organic intermediate layer may be fixed to the heat-dissipating cooling plate in a firmly bonded manner.

An apparatus includes a core configured for use in an energy exchanger. The core includes a plurality of stacked and spaced planar plate pairs including a top plate and a bottom plate to support fluid flow of a first fluid flow and a second fluid flow. A plurality of dimples is provided by instances of the plate pairs. The plurality of dimples are arranged to generate substantially counter current flow between the first fluid flow and the second fluid flow.

A mechanically conformable micro-heat exchanger for use in managing temperature of a subject component. The exchanger includes a flexible fluid tube. In various embodiments, the tube is connected to a flexible substrate, such as by a flexible polymer. The exchanger can be changed manually from an initial shape to a first shape to conform to a shape of the subject component. The flexible fluid tube is configured to channel heat-transfer fluid through a heat-transfer tube section of the tube. The heat-transfer fluid is configured to cool or heat the subject component when, in operation of the mechanically conformable micro-heat exchanger, the heat-transfer fluid is channeled through the heat-transfer tube section.

Heat exchanger, comprising a series of interconnected modules, each module comprising at least part of a water duct and part of a flue duct, wherein at least the parts of the water ducts of successive modules are interconnected, forming at least one continuous water duct through and/or along a number of said modules, wherein water duct parts of two adjacent modules are interconnected by a connector inserted into an opening in at least one of the modules forming a sealing connection.