Patent classifications
F28F2275/025
Induction welding using a heat sink and/or cooling
A heat sink for use in induction welding includes a number of tiles, wherein the tiles are electrically non-conductive and have a thermal diffusivity of greater than about 25 mm2/sec. A joint flexibly joins the tiles together.
Heat exchanger
A heat exchanger assembly: a heat exchanger with a first tube including a first flat plate and a first shaped plate connected to each other to form a first tube channel extending along a first tube extension axis. The first shaped plate includes a stamped depression forming together with the surface of the first flat plate the first tube channel. The heat exchanger assembly further includes a chassis to which the heat exchanger is attached, with the chassis including a housing. The first tube is located externally with respect to the housing. The housing has a primary slot in which the first tube is at least partially enveloped, with the first tube facing the primary slot with the first shaped plate. The first tube is connected to the primary slot by an adhesive.
Heat exchange panel
A heat exchange assembly comprising: (I) two or more panels; (II) a plurality of channels formed between the two or more panels; and (III) one or more reservoirs located adjacent to the plurality of channels and configured to at least temporarily store a temperature control material, wherein the plurality of channels are configured to direct a flow path of the temperature control material between the two or more panels and provide structural rigidity to the assembly.
Layered radiator for efficient heat rejection
A radiator assembly having a plurality of thermally conductive layers arranged in a stack of layers and a heat transfer clamping bracket operably coupled to a first end of the layers of the stack, the clamping bracket being configured to deliver heat from a heat source to the layers. Each stack of layers has a tapered overall shape in cross section due to sequentially shorter lengths of the thermally conductive layers exposing a second end of each layer to a surrounding environment for heat rejection, a total thickness of the stack diminishing with distance away from said heat transfer clamping bracket.