A cooling array for cooling of an electronic component includes the electronic component, a housing which at least partially enclosing the electronic component, a heat sink support connected to the housing in a fluid-tight manner, and a heat sink which is accommodated in the heat sink support. The heat sink is thermally coupled to the electronic component in order to disperse heat generated by the electronic component.

The invention relates to a manufacturing process for a heat dissipation heat sink composite having heat dissipation function and a manufacturing method for a finished product thereof. It comprises the steps of rolling a first heat conductive material and a substrate to adhere the first heat conductive material to the substrate for fixation; adhering a second heat conductive material to the substrate for combination; and rolling the second heat conductive material and the substrate for firmly combination and fixation to complete the manufacturing of a composite material.

A thermal conductor includes a plurality of thermal conducting portions; and joint portions made of a material having flexibility and configured to join the respective thermal conducting portions with each other, having voids where neither the thermal conducting portion nor the joint portion is present, and satisfying a condition of 0.5 ≤ [(S1 -S0)/ S0] x 100 ≤ 20 when an area of the thermal conductor in a planar view in a first direction is expressed by SO [cm.sup.2] and an area of the thermal conductor in the planar view in the first direction in a pressed state that the thermal conductor is pressed by 0.2 MPa in the first direction is expressed by S1 [cm.sup.2]. Accordingly, the thermal conductor satisfies both ensuring adhesiveness to a member in contact with the thermal conductor in use and suppressing excessive deformation of the thermal conductor in a compressed state.

A heat exchanger having an outer packaging body having an inlet, an outlet, a pair of opposing walls, and a corrugated inner fin disposed between the opposing walls and provided alternately and continuously with a concave portion and a convex portion. The outer packaging body is formed of an outer packaging laminate material in which a resin heat-fusible layer is provided on an inner surface side of a metal heat transfer layer. The inner fin is formed of an inner core laminate material in which a heat-fusible layer is provided on both surface sides of a metal heat transfer layer. The inner fin has a rectangular wave shape in which a concave bottom wall and a convex top wall are arranged parallel to the opposing walls, and a rising wall connecting the concave bottom wall and the convex top wall is arranged perpendicular to the opposing walls.

A cooling system for a photovoltaic panel including micro flat heat pipes (HP) integrated with thermoelectric generators (TEG) and a cooled water reservoir for cooling the working fluid in heat pipes. The cooled water in the reservoir is pumped from the condensate pan of an air conditioner. Experimental results show that cooling system reduced the average temperature of the panel by as much as 19° C. or 25%. Further, the output power of the photovoltaic panel increased by 44% when the photovoltaic panel was used in a very hot climate (30-40° C.). An additional two watts of power was generated by the TEGs.

A cooling system for a photovoltaic panel including micro flat heat pipes (HP) integrated with thermoelectric generators (TEG) and a cooled water reservoir for cooling the working fluid in heat pipes. The cooled water in the reservoir is pumped from the condensate pan of an air conditioner. Experimental results show that cooling system reduced the average temperature of the panel by as much as 19° C. or 25%. Further, the output power of the photovoltaic panel increased by 44% when the photovoltaic panel was used in a very hot climate (30-40° C.). An additional two watts of power was generated by the TEGs.

The invention relates to a method of manufacturing a heat and humidity exchange plate of an air-to-air counterflow enthalpy heat exchanger, which comprises a supporting member (101) and at least one polymeric vapour-permeable membrane (102), characterized in that it comprises the following successive steps: a - continuous formation of a semi-finished product for the supporting member (101) in the form of an expanded metal structure (1010) from a strip of thin metal foil (1011), whereby the operations of slitting in the transverse direction, stretching in the longitudinal direction and rolling over the entire width of the strip are successively performed; b - providing the expanded metal structure (1010) according to the preceding step with a thin vapour-permeable polymeric membrane (102); c - on the expanded metal structure (1010) provided with the vapour-permeable polymeric membrane (102), formation of corrugated and embossed shape elements of the future heat and humidity exchange plate (10) of the counterflow enthalpy heat exchanger (1) by means of omnidirectional deformation; d - creating a circumferential shape of the heat and humidity exchange plate of the counterflow enthalpy heat exchanger (1) by removing excess edges.

In addition, the invention relates to a heat and humidity exchange plate (10) of an air-to-air counterflow enthalpy heat exchanger and to an air-to-air counterflow enthalpy heat exchanger with this plate (10).

A heat sink for use in induction welding includes a number of tiles, wherein the tiles are electrically non-conductive and have a thermal diffusivity of greater than about 25 mm2/sec. A joint flexibly joins the tiles together.

An intermediate product for the production of a surface heat exchanger, in particular for building room air conditioning, including a support plate, on one side of which a tube system for conducting a medium is attached and on the other side of which a prefabricated adhesive tape having a manually removable outer protective layer is arranged, wherein the adhesive tape is free of any support.

A cooling device includes a heat-receiving block, a heat conductor, and first heat pipes. The heat-receiving block has a first main surface to which a heating element is fixed. The heat conductor extends along the first main surface and is fixed to the heat-receiving block. The first heat pipes are arranged in a direction in which the heat conductor extends and are fixed to the heat-receiving block at positions farther from the first main surface than the heat conductor is.