A heat exchanger includes a metal tube and a composite polymer fin in thermal contact with the metal tube. The fin is formed of a polymer and a thermally conductive filler such that the fin has a thermal conductivity greater than or equal to 0.5 Watts per meter Kelvin.

A recuperator including a number of neighbouring hexagonal sheets which are connected to each other. Flow passages are formed between neighbouring sheets. Each of the sheets, at its periphery, is at least partially surrounded by and connected to an associated connecting body. Neighbouring connecting bodies are connected to each other at at least a part of the periphery of the associated sheets and together form the wall of a housing. Passage openings are provided in the wall which are connected to the flow passages for allowing air into the flow passages via the passage openings. Neighbouring connecting bodies are provided with protruding parts and with recesses respectively on sides facing each other, wherein the forms of the protruding parts and of the recesses adjoin each other in order to connect the connecting bodies to each other by a press fit. Methods for producing a connecting body and for producing a recuperator.

A heat pipe structure includes a first plate, a second plate and a plurality of wick structures. The second plate is connected to the first plate to form a chamber. The wick structures are disposed in the chamber, and the distribution shape of the wick structures is approximately the same as the shape of a portion of the chamber. The chamber is formed by at least one coupling portion and three or more extending portions. The coupling portion communicates with the extending portions, and the contour of the connected first and second plates is different from that of the chamber.

A fluid vessel assembly is provided with a first vessel body with a first mating surface and a first adherent surface nonparallel with the first mating surface. The first vessel body forms a first portion of a fluid cavity. A second vessel body with a second mating surface is sized to engage the first mating surface. A second adherent surface is sized to cooperate with the first adherent surface. The second vessel body forms a second portion of the fluid cavity. An adhesive is applied to the first adherent surface and the second adherent surface to bond the first vessel body and the second vessel body together.

A total heat exchange element includes a stacked body that is formed by alternately stacking a first layer provided with a first passage through which a first air flow passes and a second layer provided with a second passage through which a second air flow passes. The stacked body includes a partition member between the first layer and the second layer, a spacing member provided in the first layer and the second layer and maintaining a spacing between the partition members facing each other, and a latent heat shielding member provided partly on the partition member and shielding transfer of latent heat between the first air flow and the second air flow through the partition member.

Techniques of controlling heat from a heat source in an electronic device using a heat pipe, improved techniques include placing a thermal conductor such as graphite sheet in thermal contact with a heat pipe and an external surface such as a surface of a battery in an electronic device. In some implementations, the graphite sheet covers an area encompassing an end of the heat pipe. In some implementations, the graphite sheet is attached to the heat pipe using an adhesive.

A structural panel for a satellite comprising an elongate pipe mounted thereto. The heat pipe is bonded to the panel intermediate its remote ends with a thermally conductive adhesive. The adhesive is omitted proximate at least one distal end of the heat pipe. The at least one distal end of the heat pipe without adhesive is mechanically secured to the panel by at least one bolt received in a cooperating threaded receiving element. A method of manufacturing such a panel is also provided.

A heat spreading and insulating material using densified foam is provided that has a heat spreading layer that is adhered to an insulating layer. The material is designed to be used with mobile devices that generate heat adjacent to heat sensitive components. The insulating layer is formed from a compressed layer of polyimide foam to increase its density. The polyimide foam retains a significant amount of insulating properties through the densification process. In some embodiments, an EMI shielding layer is added to improve electrical properties of the device. The heat spreading layer may be a graphite material with heat conducting properties that preferentially conduct heat in-plane but can also be metal foil or other isotropic heat conducting material. The material may also include pressure sensitive layers to permanently apply the material to the mobile device.

A heat dissipation device includes etched or other grooves for adhesive surrounding etched or other recesses for heat-dissipating fluid, these being created in a first copper sheet and a second copper sheet brought together. The first copper sheet includes first recesses and the second copper sheet includes corresponding second recesses. The second copper sheet is adhesively fixed on the first copper sheet and an airtight receiving cavity is formed by the first and second recesses being brought together. The heat-dissipating fluid in the airtight receiving cavity carries away heat generated by a heat-producing device to which the heat-dissipating device is fixed.

A heat exchanger assembly is provided which includes a coaxial heat exchanger that is formed, at least in part, of a more corrosion resistant material such as, but not limited to stainless steel, titanium and/or alloys thereof. The assembly further includes a condenser tee connected at each end of the coaxial conduit or tubing defining the heat exchanger. The assembly allows for a non-brazed connection of the condenser tee to an inner tube of the coaxial heat exchanger. In some embodiments, the compression fitting may be connected directly to the heat exchanger without the use of a tee.