Patent classifications
F28F2275/045
HEAT EXCHANGER AND HEAT EXCHANGER MANUFACTURING METHOD
The present disclosure relates to a heat exchanger. The heat exchanger includes: a plurality of tube panels including a tube elongated in one direction; a pair of header modules coupled to both ends of the plurality of tube panels; and a pair of header cases having an open side, providing a space therein, and having the header module inserted in the space such that the tube panels communicate with the spaces, in which the header modules is composed of a plurality of header blocks stacked and coupled to each other, and an insertion hole in which the tube panel is inserted is formed at each of the plurality of header blocks. Accordingly, it is possible to increase the efficiency of manufacturing a heat exchanger, manufacture a heat exchanger flexibly in a custom-made type in accordance with the size of a product having the heat exchanger, reduce tolerance due to brazing, and improve stability of a product.
Aluminum alloy for brazing and aluminum brazing sheet
An aluminum alloy for flux-free brazing provided for brazing performed via an Al—Si-based brazing material without a flux in a non-oxidizing atmosphere without depressurization, includes: by mass %, 0.01% to 2.0% of Mg; and 0.005% to 1.5% of Bi, wherein in the aluminum alloy, there are more than 10 Mg—Bi-based compounds having a diameter of 0.01 μm or more and less than 5.0 μm in terms of equivalent circle diameter per 10,000-μm.sup.2 visual field and there are less than 2 Mg—Bi-based compounds having a diameter of 5.0 μm or more per 10,000-μm.sup.2 visual field in a cross section parallel to a rolling direction, and in the aluminum alloy, there are less than 5 Bi particles having a diameter of 5.0 μm or more in terms of equivalent circle diameter per 10,000-μm.sup.2 visual field in the cross section parallel to the rolling direction.
Brazing sheet for flux-free brazing, method for flux-free brazing and method for manufacturing heat exchanger
A brazing sheet for flux-free brazing has an outermost surface brazing filler metal layer, consisting of an Al—Si-based alloy containing 2 to 13% Si in mass %, and an intermediate brazing filler metal layer, consisting of an Al—Si—Mg-based alloy containing 4 to 13% Si and 0.1 to 5.0% Mg in mass %, which are cladded on one or both sides of a core material. In the outermost surface brazing filler metal layer, the number of Si particles having a circle equivalent diameter of 1.75 μm or more is 10% or more of the number having a circle equivalent diameter of 0.8 μm or more, as observed in the direction of the surface layer. The intermediate brazing filler metal layer contains less than 3000 per 10000 μm.sup.2 of Si particles having a circle equivalent diameter of 0.25 μm or more, as observed in a cross section of the brazing filler metal layer.
METHOD FOR MANUFACTURING A HEAT EXCHANGER HAVING A TEMPERATURE PROBE
The invention relates to a method for manufacturing a heat exchanger including stacking a set of plates parallel to one another and to a longitudinal direction so as to define a plurality of passages suitable for the flow in the longitudinal direction of a first fluid to be brought into a heat-exchange relationship with at least a second fluid, said plates being delimited by a pair of longitudinal edges extending in the longitudinal direction and a pair of lateral edges extending in a lateral direction perpendicular to the longitudinal direction, and forming at least one of the plates by superposing at least a first flat product and a second flat product on top of one another, having at least one groove that extends parallel to the plates and leads towards the outside of the stack through at least one opening in a lateral or longitudinal edge.
Method for manufacturing a heat exchanger having a temperature probe
The invention relates to a method for manufacturing a heat exchanger including stacking a set of plates parallel to one another and to a longitudinal direction so as to define a plurality of passages suitable for the flow in the longitudinal direction of a first fluid to be brought into a heat-exchange relationship with at least a second fluid, said plates being delimited by a pair of longitudinal edges extending in the longitudinal direction and a pair of lateral edges extending in a lateral direction perpendicular to the longitudinal direction, and forming at least one of the plates by superposing at least a first flat product and a second flat product on top of one another, having at least one groove that extends parallel to the plates and leads towards the outside of the stack through at least one opening in a lateral or longitudinal edge.
Brazing by expansion using a spacer
A heat exchanger brazing fixture including a baseplate including a first surface and a second surface located opposite the first surface and a first post including a first end and a second end located opposite the first end. The first post is operably associated with the first surface of the baseplate at the first end. The A heat exchanger brazing fixture further including a top plate operably connected to the first post and separated from the first surface of the baseplate by a selected distance. The top plate being configured to move in a first direction along the first post when a heat exchanger resting upon the first surface of the baseplate expands during a brazing process.
Combinational heatsink tube for intercooler
A method for forming heatsink tube includes cutting a base sheet plate into a first molded frame and a second molded frame, applying a flux on an inner face of the first molded frame and the second molded frame, mounting the first molded frame on a heatsink fin module, and mounting the second molded frame on the first molded frame, to assemble the first molded frame, the heatsink fin module, and the second molded frame, and to form a heatsink tube. The first molded frame has a first end faceplate and two first connecting portions. The second molded frame has a second end faceplate and two second connecting portions. Each of the two first connecting portions is formed with a first abutting section, and each of the two second connecting portions is formed with a second abutting section.
Heat Exchangers and Systems Thereof
Improved heat exchangers and methods of manufacturing the heat exchangers are provided. The methods include modification of surface(s) of the heat exchanger in an integrated manner during manufacturing, to impart desired properties such as decreased corrosion, pressure drop, and water retention, and increased anti-frosting performance.
Method of making a heat exchanger
A method of making a heat exchanger that includes sealing tubes to header slots and brazing the tubes to the header slots. The method further includes coupling a cover to the header to cover a liquid-side surface of the header and to cover ends of the tubes, and applying flux to an air-side surface of the header and to the tubes. Coupling the cover to the header is performed after sealing the tubes to the header slots and coupling the cover to the header is performed before applying flux to the air-side surface of the header and to the tubes. Applying flux is performed before brazing each of the tubes to the header slots and sealing each of the tubes to the header slot includes sealing a perimeter of each of the tubes to the header slot.
Process for producing a plate heat exchanger and plate heat exchanger
A plate heat exchanger has two metal plates brought into abutment, with a solder material between the plates. The plates are heated up to a first temperature. The plates are placed into a mold, the mold surfaces of which have cavities for envisaged channel structures. Channel structures are formed by local internal pressure forming of at least one plate under pressurization by the tool. The plates are heated up to a second temperature. The plates are solder bonded at the abuted surfaces. A plate heat exchanger has two metal plates, wherein channel structures have been formed in at least one plate and the plates are bonded to one another by soldering away from the channel structures. Eutectic microstructures having a longest extent of less than 50 micrometers are formed in the solder layer.