The disclosure provides a manufacturing method of a flat heat exchanger. The manufacturing method includes flattening a round heat pipe to a flat heat pipe, welding a first part of the flat heat pipe, and welding a second part of the flat heat pipe. After welding the second part of the flat heat pipe, the manufacturing method further includes cutting off part(s) of the first part or the second part of the flat heat pipe and trimming the flat heat pipe. Before welding the first part or the second part of the flat heat pipe, there is no pipe shrinkage process performed on the flat heat pipe.

The apresnt disclosure adopts the thermal bonding process to process the microchannel heat sink. By placing the upper cover plate and the lower cover plate on the plates of the microchannel heat sink, the pressure is directly applied, and there is no need to add other adhesives.

A method of operating a heat exchanger involves conveying a first fluid having a first temperature along spaced apart first passages of the heat exchanger and conveying a second fluid along spaced apart second passages of the heat exchanger while the first fluid is being conveyed along the first passages to transfer heat from the second fluid to the first fluid. The method also includes conveying a fluid along the third passages when the temperature of the second fluid in at least some of the second passages is below a predetermined temperature to transfer heat from the fluid being conveyed along the third passages to the second fluid.

A printed circuit heat exchanger for use in a reactor includes a core formed from a stack of plates diffusion bonded together. The core has: a top face, a bottom face disposed opposite the top face, a first side face extending between the top face and the bottom face, and a second side face disposed opposite the first side face. The printed circuit heat exchanger includes: a plurality of primary channels defined in the core, each of the primary channels extending from a primary inlet defined in the first side face to a primary outlet defined in the second side face; and a plurality of secondary channels defined in the core, each of the secondary channels extending among at least some of the primary channels from a secondary inlet defined in the top face to a secondary outlet defined in the top face.

A printed circuit heat exchanger for use in a reactor includes a core formed from a stack of plates diffusion bonded together. The core has: a top face, a bottom face disposed opposite the top face, a first side face extending between the top face and the bottom face, and a second side face disposed opposite the first side face. The printed circuit heat exchanger includes: a plurality of primary channels defined in the core, each of the primary channels extending from a primary inlet defined in the first side face to a primary outlet defined in the second side face; and a plurality of secondary channels defined in the core, each of the secondary channels extending among at least some of the primary channels from a secondary inlet defined in the top face to a secondary outlet defined in the top face.

This stacked heat exchanger is provided with: a high temperature layer that comprises a plurality of channels into which a high temperature-side fluid is introduced; and a low temperature layer that is superposed on the high temperature layer and comprises a plurality of channels into which a low temperature-side fluid is introduced, said low temperature-side fluid being at a temperature that is lower than the temperature of the high temperature-side fluid. Each one of the plurality of channels of the low temperature layer has: an upstream-side part in which at least some of the low temperature-side fluid evaporates by being heated by the high temperature-side fluid that flows within the high temperature layer; and a downstream-side part in which the low temperature-side fluid that has evaporated in the upstream-side part is heated by the high temperature-side fluid that flows within the high temperature layer. The ratio of the areas of the plurality of upstream-side parts in a predetermined area of the low temperature layer is lower than the ratio of the areas of the plurality of downstream-side parts in the predetermined area of the low temperature layer.

A heat dissipation device includes a main body and at least one heat conduction member. The main body has a top face. A periphery of the top face has a connection section. One end of the heat conduction member is correspondingly in contact and connection with the top face or the connection section. By means of the structure design of the present invention, the horizontal heat dissipation effect is greatly enhanced and the heat dissipation effect of the entire heat dissipation device is greatly enhanced.

A heat exchanger includes an inlet for receiving bulk solids, a plurality of heat transfer plate assemblies, a plurality of spacers disposed between adjacent heat transfer plate assemblies, and supports for supporting the heat transfer plate assemblies. The heat transfer plate assemblies include a first plate having a first pair of holes extending therethrough, the first plate having channels extending along a surface thereof, for the flow of fluid through the channels, and a second plate bonded to the first plate to enclose the channels, the second plate including a second pair of holes generally aligned with the first pair of holes to form through holes to facilitate flow of the fluid through the through holes and the channels.

A heat exchanger has: an inlet manifold having an inlet port; and an outlet manifold having an outlet port. A first gas flowpath passes from the inlet port to the outlet port. A plurality of plate banks are positioned end-to-end, each plate bank having a plurality of conduits with interiors along respective branches of the first gas flowpath, a second gas flowpath extending across exteriors of the plurality of conduits. One or more docks couple adjacent ends of the plurality of plate banks.

A diffusion bonding heat exchanger includes a first heat transfer plate and a second heat transfer plate. A high-temperature flow path of the first heat transfer plate includes a connection channel portion configured such that a high-temperature fluid can flow across a plurality of channels within at least a range that overlaps a predetermined range in a stacking direction, the predetermined range being a range from a flow path inlet of the second heat transfer plate to a position downstream of the flow path inlet.