A method for forming an annular heat pipe wick in a controlled atmosphere includes wrapping a plurality of layers of a fine mesh screen around a mandrel to form a wick. The method also includes inserting the mandrel and the wick into a sheath, and compressing the wick between the sheath and the mandrel to form an assembly. The compressing of the wick comprises applying pressure to an exterior of the mandrel and the sheath. The method further includes diffusion bonding the assembly at a temperature sufficiently high achieving self-diffusion of the plurality of layers of the fine mesh screen used to form the wick to themselves. The method also includes cooling the diffusion bonded assembly to room temperature, and etching the mandrel and sheath from the diffusion bonded assembly, leaving the wick as a porous tube.

A straight-through structure of heat dissipation unit includes a first plate body and a second plate body correspondingly mated with each other to define a closed chamber. A hydrophilic layer is disposed on the surface of the closed chamber and a capillary structure is disposed in the closed chamber. The first plate body is formed with a first recess, a first perforation and a second recess. The first recess is connected with the capillary structure disposed on the third face of the second plate body. One end of the second recess abuts against the capillary structure. The capillary structure layer is not in contact with the first recess. The second plate body has a second perforation in alignment with the first perforation. When it is necessary to perforate the heat dissipation unit, the straight-through structure can keep the closed chamber in the vacuumed and airtight state.

A printed circuit heat exchanger for use in a reactor includes a core formed from a stack of plates diffusion bonded together. The core has: a top face, a bottom face disposed opposite the top face, a first side face extending between the top face and the bottom face, and a second side face disposed opposite the first side face. The printed circuit heat exchanger includes: a plurality of primary channels defined in the core, each of the primary channels extending from a primary inlet defined in the first side face to a primary outlet defined in the second side face; and a plurality of secondary channels defined in the core, each of the secondary channels extending among at least some of the primary channels from a secondary inlet defined in the top face to a secondary outlet defined in the top face.

A diffusion-bonded heat exchanger (100) includes a core (1) in which a first heat transfer plate (10) and a second heat transfer plate (20) are stacked and diffusion-bonded to each other, a plurality of pairs of first ports (2), and second ports (3). The first heat transfer plate (10) includes a plurality of first fluid passages (11).

An object of the present invention is to provide a diffusion bonding heat exchanger with which it is possible to reduce a thermal stress that is generated due to heat exchange between fluids significantly different from each other in temperature even in a case where the number of stacked heat transfer plates is made large. A diffusion bonding heat exchanger (100) includes a core (1) in which a plurality of heat transfer plates (HP) are stacked and diffusion-bonded to each other. The core includes a plurality of flow path blocks (40) each of which is configured to include a plurality of flow path layers (30) and a partition wall layer (50) that divides the plurality of flow path blocks. A thickness (t3) of the partition wall layer in a stacking direction is larger than an interval (t2) between flow paths arranged in the stacking direction.

A vapor chamber structure includes a first plate body, a second plate body and a tubular body. The first plate body has a first extension section perpendicularly extending from a periphery of the first plate body. The second plate body has a second extension section perpendicularly extending from a periphery of the second plate body. The second extension section is fitted around the first extension section, whereby the first and second plate bodies are correspondingly mated with each other to form a closed chamber. The tubular body penetrates through the first and second extension sections in communication with the closed chamber. By means of the first and second extension sections normal to the first and second plate bodies, when the first and second plate bodies are connected, the arrangement space occupied by the peripheral void section of the vapor chamber is reduced.

The apresnt disclosure adopts the thermal bonding process to process the microchannel heat sink. By placing the upper cover plate and the lower cover plate on the plates of the microchannel heat sink, the pressure is directly applied, and there is no need to add other adhesives.

A heat exchanger module having at least two fluid circuits, of longitudinal axis including a stack of plates, defining at least two fluid circuits, at least a part of the plates each including fluid circulation channels, the channels of at least one of the two circuits, referred to as first circuit, having at least one fluid supply and distribution zone for supplying and distributing fluid from outside the stack, forming a fluid pre-header, in which zone the channels are delimited by studs distributed over the surface of the plate; an exchange zone continuous with the pre-header and wherein the channels are each delimited by a groove separated from one another by a rib and extending along the longitudinal axis.

A heat pipe structure includes a first plate, a second plate and a plurality of wick structures. The second plate is connected to the first plate to form a chamber. The wick structures are disposed in the chamber, and the distribution shape of the wick structures is approximately the same as the shape of a portion of the chamber. The chamber is formed by at least one coupling portion and three or more extending portions. The coupling portion communicates with the extending portions, and the contour of the connected first and second plates is different from that of the chamber.

A power generation system includes a turbine having an outlet. A high temperature recuperator has an inlet and is connected to the turbine outlet. A low temperature recuperator is connected to the high temperature recuperator. Each of the high and low temperature recuperators include a plurality of matrix panels interconnected together that define hot fluid channels and cold fluid channels arranged adjacent to each other in a counterflow and stair-step configuration. A compressor is connected to the low temperature recuperator and turbine.