A thin vapor chamber is provided. The thin vapor chamber includes an upper plate, a lower plate, and a plurality of solid columns. The lower plate is opposite to the upper plate, and the upper plate and the lower plate are combined to form a closed space. The solid column is formed on the upper plate and extends to the lower plate. The solid columns are located in the closed space. The solid columns respectively have at least one capillary groove, and a first portion of an inner surface of the capillary groove faces a second portion of the inner surface.

A liquid cooling head includes a bottom plate, a heat dissipation plate, a partition plate and an upper cover plate. The bottom plate includes an opening, and the heat dissipation plate, the partition plate and the upper cover plate are fixed to the bottom plate. The partition plate divides the opening into a plurality of cooling chambers, and each cooling chamber is equipped with a cooling liquid inlet, a cooling liquid outlet, a pump and an electric control device. The cooling liquid inlet and the cooling liquid outlet are formed in the upper cover plate, the pump is fluid-connected to the cooling liquid outlet, and the electric control device drives the pump to rotate, so that the cooling liquid flows through the cooling chamber to cool one heat source below the heat dissipation plate. In addition, a liquid cooling device with the liquid cooling head is also disclosed therein.

A liquid cooling head manufacturing method includes the following steps. First, a liquid channel main body is provided. Then, a heat dissipation bottom plate and a heat sink are disposed in different recessed indentations in the liquid channel main body. The heat dissipation bottom plate and the heat sink are welded in the liquid channel main body and a cover plate is sealed on the liquid channel main body.

A joined body includes: a main body section including a wall section forming a passage along which a medium for accelerating heat exchange flows; and a cover configured to cover a surface of the main body section, the cover including: a covering section provided on a side facing the main body section and configured to cover the surface; a groove section provided on the side facing the main body section and configured to accommodate an end portion of the wall section; and a stirred joint section provided on a side opposite to a side where the covering section and the groove section are provided, the stirred joint section being at least partly frictionally stirred by a depth reaching a bottom of the groove section from a surface on a side opposite to the side facing the main body section and bonded to the end portion of the wall section.

A heat and humidity exchanger comprises panels made up of membrane sheets attached on either side of a separator. Channels extend across each panel between the separator and the membrane sheets. The panels are much stiffer than the membrane sheets. Panels are stacked in a spaced apart relationship to provide an ERV core. Spacing between adjacent panels may be smaller than a thickness of the panels,

A heat and humidity exchanger comprises panels made up of membrane sheets attached on either side of a separator. Channels extend across each panel between the separator and the membrane sheets. The panels are much stiffer than the membrane sheets. Panels are stacked in a spaced apart relationship to provide an ERV core. Spacing between adjacent panels may be smaller than a thickness of the panels.

A method for manufacturing a liquid-cooling jacket (1) where heat transfer fluid flows in a hollow part (14) defined by a jacket body (2) and a sealing body (3) includes: an overlapping process in which the sealing body (3) is placed on an end surface (11a) of a peripheral wall part (11) in such a way that the end surface (11a) and a back surface of the sealing body (3) are overlapped each other to form a first overlapped part (H1); and a primary joining process in which primary joining is performed by friction stirring in such a way that a rotary tool (FD) is moved once around a recessed part (13) along the first overlapped part (H1). In the primary joining process, in a state where a base side pin of the rotary tool (FD) is in contact with the sealing body (3), a flat surface of the base (tip) side pin is brought in contact with only the sealing body (3), and a tip of a projection projecting from the flat surface is inserted more deeply than the first overlapped part (H1) to join the first overlapped part (H1).

The disclosure provides a flat heat exchanger. The flat heat exchanger includes a flat pipe part, a first welded part, a second welded part and a capillary structure. The flat pipe part has a fluid channel. The first welded part and the second welded part are respectively located at two opposite ends of the flat pipe part to close two opposite ends of the fluid channel. At least part of the capillary is located within the fluid channel of the flat pipe part.

The invention relates to a device for heat exchange, in particular in a refrigerant circuit, with at least one first flow path and at least one second flow path, which, in a cross section perpendicular to a longitudinal direction of the device, are disposed coaxially with respect to one another, and each of which comprises at least one flow channel. The device is realized of a synthetic material.

A liquid cooling head includes a bottom plate, a heat dissipation plate, a partition plate and an upper cover plate. The bottom plate includes an opening, and the heat dissipation plate, the partition plate and the upper cover plate are fixed to the bottom plate. The partition plate divides the opening into a plurality of cooling chambers, and each cooling chamber is equipped with a cooling liquid inlet, a cooling liquid outlet, a pump and an electric control device. The cooling liquid inlet and the cooling liquid outlet are formed in the upper cover plate, the pump is fluid-connected to the cooling liquid outlet, and the electric control device drives the pump to rotate, so that the cooling liquid flows through the cooling chamber to cool one heat source below the heat dissipation plate. In addition, a liquid cooling device with the liquid cooling head is also disclosed therein.