Thermal management devices and methods are making are described herein. In one example, the thermal management device includes a heat spreader having a first surface and a second surface, wherein the first surface of the heat spreader is configured to be positioned adjacent to a heat source of an electronic device. The thermal management device also includes a heat dissipation device configured to dissipate heat from the heat source, wherein at least a portion of the second surface of the heat spreader is metallurgically bonded with at least a portion of a surface of the heat dissipation device.

A method for manufacturing a thermoplastic heat exchanger for a battery module is provided. The method includes extruding a battery interface portion comprising a first thermoplastic composition and having a battery interface surface and a chamber surface opposite the battery interface surface; injection molding a base portion comprising a second thermoplastic composition having a channeled surface defining a plurality of channels and an outer surface opposite the channeled surface. The battery interface portion and the base portion are melt-bonded such that the chamber surface cooperates with the plurality of channels of the channeled surface to define a flow chamber for circulation of a thermal cooling fluid within the thermoplastic heat exchanger.

A device and method that allows bipolar plates to be welded in a rotating transport device in a vertical position at high speed, thereby fulfilling the high requirements for loading, fixing, welding and unloading the components to a high degree. Overall, a high level of productivity is achieved with the device and method.

The present application discloses two-phase cooling devices that may include at least three substrates, a metal with a wicking structure, an intermediate substrate, and a backplane. A fluid may be contained within the wicking structure and vapor cavity for transporting thermal energy from one region of the thermal ground plane to another region of the thermal ground plane, wherein the fluid may be driven by capillary forces within the wicking structure. The titanium thermal ground plane may be adapted for use in a mobile device, such as a portable device or smartphone, where it may offer compelling performance advantages.

A heat pipe structure includes a first plate, a second plate and a plurality of wick structures. The second plate is connected to the first plate to form a chamber. The wick structures are disposed in the chamber, and the distribution shape of the wick structures is approximately the same as the shape of a portion of the chamber. The chamber is formed by at least one coupling portion and three or more extending portions. The coupling portion communicates with the extending portions, and the contour of the connected first and second plates is different from that of the chamber.

A heat exchanger is provided that includes a housing and an exchanger region which is arranged in the housing and has tubes and at least one base, wherein the tubes are connected to the at least one base, wherein the housing is manufactured from a plastic and has a housing inner surface, wherein the housing inner surface is covered at least in regions or in sections by at least one metallic element for protecting the housing from a thermal load. The invention further relates to a method for producing a heat exchanger.

A combination structure of an Exhaust Gas Recirculation (EGR) cooler may include a housing open at both sides thereof, a plurality of headers inserted in both of the sides of the housing and having a circumference forming a layer with the housing, and a plurality of diffusers each including a coupling portion, which is inserted in the headers to form a layer with the housing and the headers, at a first side and having a hole for receiving and discharging exhaust gas at a second side, in which sides of the housing and the headers may be welded, and the housing, the circumference of the headers, and coupling portions of the diffusers may be welded.

An exhaust gas heat exchanger includes at least one diffuser for feeding and/or discharging an exhaust gas flow, an exchanging region including exchanging tubes which extend in an axial direction and which are connected to a base at one end, and a housing through which a cooling agent can flow and which is made of a material that is non-resistant to high temperatures. A connecting element is partly embedded in the housing in order to secure the connecting element to the housing. The connecting element is bonded to the base in a first bonding region and the base is bonded to the diffuser in a second bonding region.

A planar heat pipe including a container having a protruded portion provided at a central part thereof, the protruded portion having a hollow portion formed by two plate-shaped bodies opposing each other, and a working fluid enclosed in the hollow portion. The hollow portion is provided with a wick structure. A peripheral portion surrounding the protruded portion is sealed by welding by applying heat. A groove is provided around the protruded portion between the protruded portion and a welded portion welded by the welding by applying heat.

Disclosed are a heat exchange reactor and a method of manufacturing the same, and a method of manufacturing a heat exchange reactor includes: preparing lateral plates provided with a plurality of slits formed in parallel in a longitudinal direction; disposing two lateral plates to be spaced apart from each other while facing each other in a vertical direction; forming a plurality of flow path channels by inserting flow path partition plates into one or more slits of the two lateral plates in a horizontal direction; forming a plurality of flow path channels by inserting printed circuit heat exchange plates, which autonomously include one or more heat exchange flow paths therein, into one or more slits of the two lateral plates in a horizontal direction; and bonding the lateral plates, the flow path partition plates, and the printed circuit heat exchange plates.