The invention of the present subject matter relates to a sinter bonded projectile comprising a core component and a copper component which has been sintered in such a manner to form a solid mass over the core. More particularly, the invention of the present subject matter provides a core component to which a copper component is melted at a temperature sufficient that it penetrates into the pores and geometry of the core component under compression due to thermal shrinkage, resulting in a tightly bonded solid mass containing no voids. The invention of the present subject matter also provides a process for manufacturing the projectile.