Patent classifications
F04B43/095
TWO-DIMENSIONAL ADDESSABLE ARRAY OF PIEZOELECTRIC MEMS-BASED ACTIVE COOLING DEVICES
A cooling system and method for using the cooling system are described. The cooling system includes a plurality of individual piezoelectric cooling elements spatially arranged in an array extending in at least two dimensions, a communications interface and driving circuitry. The communications interface is associated with the individual piezoelectric cooling elements such that selected individual piezoelectric cooling elements within the array can be activated based at least in part on heat energy generated in the vicinity of the selected individual piezoelectric cooling elements. The driving circuitry is associated with the individual piezoelectric cooling elements and is configured to drive the selected individual piezoelectric cooling elements.
COMBINED ARCHITECTURE FOR COOLING DEVICES
A piezoelectric cooling system and method for driving the cooling system are described. The piezoelectric cooling system includes a first piezoelectric cooling element and a second piezoelectric cooling element. The first piezoelectric cooling element is configured to direct a fluid toward a surface of a heat-generating structure. The second piezoelectric cooling element is configured to direct the fluid to an outlet area after heat has been transferred to the fluid by the heat-generating structure.
METHOD AND SYSTEM FOR DRIVING PIEZOELECTRIC MEMS-BASED ACTIVE COOLING DEVICES
A cooling system and method for using the cooling system are described. The cooling system includes an array of cooling elements and a controller. The array of cooling elements corresponds to regions of the heat-generating structure where heat is generated in response to operation of the semiconductor. The controller is configured to activate portions of the array of cooling elements based on a determination that operation of the heat-generating structure is likely to generate heat in a given region of the heat-generating structure.
PIEZOELECTRIC MEMS-BASED ACTIVE COOLING FOR HEAT DISSIPATION IN COMPUTE DEVICES
An active cooling system and method for using the active cooling system are described. The active cooling system includes a cooling element having a first side and a second side. The first side of the cooling element is distal to a heat-generating structure and in communication with a fluid. The second side of the cooling element is proximal to the heat-generating structure. The cooling element is configured to direct the fluid using a vibrational motion from the first side of the cooling element to the second side such that the fluid moves in a direction that is incident on a surface of the heat-generating structure at a substantially perpendicular angle and then is deflected to move along the surface of the heat-generating structure to extract heat from the heat-generating structure.
MOBILE PHONE AND OTHER COMPUTE DEVICE COOLING ARCHITECTURE
A system for cooling a mobile phone and method for using the system are described. The system includes an active piezoelectric cooling system, a controller and an interface. The active piezoelectric cooling system is configured to be disposed in a rear portion of the mobile phone distal from a front screen of the mobile phone. The controller is configured to activate the active piezoelectric cooling system in response to heat generated by heat-generating structures of the mobile phone. The interface is configured to receive power from a mobile phone power source when the active piezoelectric cooling system is activated.
Peristaltic pump and method of transporting material with a peristaltic pump
A peristaltic pump comprises a tube to transport a material in a transport direction and one or more piezoelements, which are configured to cause a squeezing of the tube. Furthermore, a method of transporting material comprises the step of successively actuating the piezoelements along the transport direction of the material and thereby causing a squeezing of the tube.
Piezoelectric actuator, stacked actuator, piezoelectric motor, robot, hand, and liquid transport pump
A piezoelectric actuator includes two substrates, piezoelectric elements that are arranged between the two substrates, and a cladding portion that covers at least a part of a surrounding area of the piezoelectric elements.
Electric device, piezoelectric motor, robot, hand, and liquid transport pump
An electric device includes an electric component that includes an electrode terminal which includes a projection portion, and a circuit substrate that includes a connected portion which is electrically connected to the projection portion, in which the connected portion includes a recess portion that is in contact with the projection portion.
Microfluidic chip
A microfluidic chip orients and isolates components in a sample fluid mixture by two-step focusing, where sheath fluids compress the sample fluid mixture in a sample input channel in one direction, such that the sample fluid mixture becomes a narrower stream bounded by the sheath fluids, and by having the sheath fluids compress the sample fluid mixture in a second direction further downstream, such that the components are compressed and oriented in a selected direction to pass through an interrogation chamber in single file formation for identification and separation by various methods. The isolation mechanism utilizes external, stacked piezoelectric actuator assemblies disposed on a microfluidic chip holder, or piezoelectric actuator assemblies on-chip, so that the actuator assemblies are triggered by an electronic signal to actuate jet chambers on either side of the sample input channel, to jet selected components in the sample input channel into one of the output channels.
MICROMECHANICAL DEVICES WITH MECHANICAL ACTUATORS
A planar micromechanical actuator suspended on opposing suspension zones including a neutral axis between the opposing suspension zones, first to fourth segments into which the planar micromechanical actuator is segmented between the opposing suspension zones, each including a first electrode and a second electrode which form a capacitor and are isolatedly affixed to each other at opposite ends of the respective segment along a direction between the opposing suspension zones so as to form a gap between the first and second electrode along a thickness direction, the gap being offset to the neutral axis along the thickness direction, and wherein the first to fourth segments are configured such that the planar micromechanical actuator deflects into the thickness direction by the first and fourth segment bending into the thickness direction and the second and third segments bending contrary to the thickness direction upon a voltage being applied to the first and second electrodes of the first to fourth segments.