Patent classifications
F16L53/38
Connection assembly, in particular for conducting aqueous urea solutions
A connector arrangement for conducting liquid urea solutions. The connector arrangement includes a distributor, with at least three connecting elements, and a connecting component, located between the connecting elements, with inner channels running within the connecting component. Three individual lines having connecting means are connected to the connecting elements of the distributor by the connecting means, and a housing surrounds the distributor and at least a part of the individual line. The distributor is disposed in the housing together with end sections of the connected individual lines. A channel line inner diameter of the inner channels and a total length of the inner channels and a wall thickness of the distributor in the connecting component are dimensioned such that ice pressure on the distributor, which occurs as a result of the freezing of a liquid within the distributor, does not result in any destruction.
METHODS AND APPARATUS FOR HEATING A LIQUID
An apparatus capable of heating a liquid may provide a valve assembly configured to receive an incoming liquid from a bulk source. The valve assembly may control the flow of the liquid to a source vessel via a pipe system. The pipe system includes a first pipe directly connected to the valve assembly and a second pipe downstream from the first pipe and connected between the first pipe and the source valve. The second pipe is heated with a heating system that surrounds the second pipe, and the second pipe has a larger diameter than that of the first pipe.
METHODS AND APPARATUS FOR HEATING A LIQUID
An apparatus capable of heating a liquid may provide a valve assembly configured to receive an incoming liquid from a bulk source. The valve assembly may control the flow of the liquid to a source vessel via a pipe system. The pipe system includes a first pipe directly connected to the valve assembly and a second pipe downstream from the first pipe and connected between the first pipe and the source valve. The second pipe is heated with a heating system that surrounds the second pipe, and the second pipe has a larger diameter than that of the first pipe.
Passive thermal diode for transportation pipelines using contact switch based on polymer thermal expansion (PTE-PTD)
An apparatus includes a Polymer Thermal Expansion Based Passive Thermal Diode (PTE-PTD) that includes layers and is configured to provide passive heating and cooling of a pipeline. A polyurethane (PU) layer is provided that is configured to contact at least an upper portion along a length of a pipe. A polyethylene terephthalate (PET) layer is provided that is configured to surround the PU layer and the length of the pipe. A graphene layer is provided that is configured to surround an epoxy layer. An epoxy shell is provided that is configured to surround the graphene layer. An air gap on a first side of the PTE-PTD is provided. The air gap is formed by a void in the PET layer and is configured to provide additional air space between the PET layer and the PU layer. The air gap provides an upward movement of the PET layer using opposite forces of alternate sides of the PET layer. The PTE-PTD is installed on the pipeline.
Passive thermal diode for transportation pipelines using contact switch based on polymer thermal expansion (PTE-PTD)
An apparatus includes a Polymer Thermal Expansion Based Passive Thermal Diode (PTE-PTD) that includes layers and is configured to provide passive heating and cooling of a pipeline. A polyurethane (PU) layer is provided that is configured to contact at least an upper portion along a length of a pipe. A polyethylene terephthalate (PET) layer is provided that is configured to surround the PU layer and the length of the pipe. A graphene layer is provided that is configured to surround an epoxy layer. An epoxy shell is provided that is configured to surround the graphene layer. An air gap on a first side of the PTE-PTD is provided. The air gap is formed by a void in the PET layer and is configured to provide additional air space between the PET layer and the PU layer. The air gap provides an upward movement of the PET layer using opposite forces of alternate sides of the PET layer. The PTE-PTD is installed on the pipeline.
Heated media line
A heat conductor and a heated media line having an inner tubular fluid line and at least one heat conductor arranged on the periphery thereof. The heat conductor is formed by a braid made of twisted individual wires and, in particular, an outer protective sheath surrounding the heat conductor and the fluid line. The braid is formed by at least six individual wires surrounding a support element, of which at least one individual wire is made of a copper-nickel (CuNi) alloy, and the remaining individual wires are produced from copper (Cu) or from a nickel-chromium (NiCr) alloy. All of the individual wires have the same diameter.
Heated media line
A heat conductor and a heated media line having an inner tubular fluid line and at least one heat conductor arranged on the periphery thereof. The heat conductor is formed by a braid made of twisted individual wires and, in particular, an outer protective sheath surrounding the heat conductor and the fluid line. The braid is formed by at least six individual wires surrounding a support element, of which at least one individual wire is made of a copper-nickel (CuNi) alloy, and the remaining individual wires are produced from copper (Cu) or from a nickel-chromium (NiCr) alloy. All of the individual wires have the same diameter.
Triple pipe heating device of easy installation for heating exhaust gas in semiconductor and LCD manufacturing process
The present invention relates to a triple pipe heating device for heating an exhaust gas in a semiconductor and LCD manufacturing process, which has a triple pipe structure capable of effectively heating an exhaust gas with only a small amount of heat without using nitrogen gas, is expandable and bendable so as to be easily installed, and is capable of quickly detecting exhaust gas leakage and overheating.
Triple pipe heating device of easy installation for heating exhaust gas in semiconductor and LCD manufacturing process
The present invention relates to a triple pipe heating device for heating an exhaust gas in a semiconductor and LCD manufacturing process, which has a triple pipe structure capable of effectively heating an exhaust gas with only a small amount of heat without using nitrogen gas, is expandable and bendable so as to be easily installed, and is capable of quickly detecting exhaust gas leakage and overheating.
INDEPENDENT HEATED HOSE
A plural component dispensing system includes a first heated hose, a second heated hose, a controller, and a dispensing device. The first heated hose and the second heated hose include electrical wires that supply heat to the first and second heated hoses to heat fluid components within the first and second heated hoses. The first and second heated hoses are electrically coupled to the controller and are fluidly coupled to the dispensing device. The controller is configured to control and alternate the electrical power supplied to the first heated hose and the second heated hose to heat the first heated hose independent of the second heated hose.