Cryostat systems for magnetic resonance imaging system are provided. The cryostat system may include a tank containing a cavity to accommodate a cooling medium and a superconducting coil. The system may also include a cold head assembly configured to cool the cooling medium to maintain the superconducting coil in a superconducting state. The cold head assembly may be mounted on the tank. The cold assembly may include at least a first cold head and a second cold head. The second cold head may include a taper shape with a first end surface close to the first cold head and a second end surface away from the first cold head. A diameter of the first circular end is greater than a diameter of the second circular end.

A cryostat for operation with liquid helium, may comprise a primary chamber with a main region and a pot region for containing a bath of liquid helium-4, primary inlet means for introducing liquid helium-4 and primary outlet means for releasing gaseous helium-4, the primary inlet means comprising a transfer line extending into the primary region. The cryostat may be configured for operation under a continuous supply of liquid helium-4 and at a reduced helium-4 pressure, whereby gaseous helium-4 is pumped off through the outlet means. The primary chamber may comprise a baffle structure arranged between the pot region and the main region, the baffle structure defining at least one flowpath for the flow of gaseous helium-4, each flowpath forming a detoured connection between the pot region and the main region.

Variable temperature analytical instruments are provided that can include: a mobile component comprising a cold source; a substantially fixed analysis component; and an interface configured to couple the mobile component with the analysis component. Variable temperature analytical instruments are also provided that can include: a mobile analysis component; a substantially fixed component comprising a cold source; and an interface configured to couple the mobile component with the analysis component. Variable temperature analytical instruments are also provided that can include: a cold source in thermal communication with an analysis component; and at least one pressure barrier defining a plurality of discrete masses maintained at different temperatures between the cold source and the analysis component. Variable temperature analytical instruments are provided that can include: a cold source in thermal communication with an analysis component; and a plurality of discrete masses maintained at different temperatures about a single thermal communication between the cold source and the analysis component. Variable temperature analytical instruments are also provided that can include: a cold source in fluid communication with at least one analysis component; a pump assembly operably coupled to the cold source and the analysis component; at least a pair of conduits extending between the cold source and the analysis component; and another conduit extending between the analysis component and the pump assembly. Variable temperature analytical instruments are also provided that can include: a cold source in fluid communication with at least one analysis component; a pump assembly operably coupled to the cold source and the analysis component; at least a pair of conduits extending between the cold source and the analysis component; and another conduit extending between the analysis component and the pump assembly.

A cryostat includes a room temperature vessel, a low temperature vessel, and a refrigeration mechanism. The room temperature vessel includes a room temperature tank, an outer neck tube and a sealing head. The low temperature vessel includes a low temperature tank, an inner neck tube and a liquefaction chamber. The liquefaction chamber corresponds to the first opening and passes through the first opening. The refrigeration mechanism includes a device panel and a refrigeration device. The device panel is disposed on the sealing head. The refrigeration device includes a body and a cold finger. The body is disposed at the device panel. The cold finger is connected with the body and extends into the liquefaction chamber.

Techniques facilitating electrical coupling within cryogenic environments are provided. In one example, an electrical coupling device for a cryogenic electronics system can comprise a flexible wiring strip that includes non-superconducting wiring and a thermal break that includes superconducting wiring. The superconducting wiring can be coupled with the flexible wiring strip to bridge a gap defined, in part, by the flexible wiring strip. The superconducting wiring comprises higher electrical conductivity and lower thermal conductivity than the non-superconducting wiring.

The cryostat may include an inner vessel configured to accommodate one or more superconducting coils, an outer vessel encompassing the inner vessel, and a thermal shield configured between the outer vessel and the inner vessel. The thermal shield may include an internal cylinder having a first end and an external cylinder encompassing the internal cylinder, the external cylinder having a second end. The thermal shield may also include a seal head configured between the internal cylinder and the external cylinder, the seal head having a first edge and a second edge. The thermal shield may further include a connecting component including a plurality of connectors. Each of the plurality of connectors may be configured to connect the first end of the internal cylinder with the first edge of the seal head and/or the second end of the external cylinder with the second edge of the seal head.

A cryostat assembly with an outer container for a storage tank with a first cryogenic fluid and a coil tank for a superconducting magnet coil system. The magnet coil system is cooled by a second cryogenic fluid colder than the first cryogenic fluid, the coil tank being mechanically connected to the outer container and/or to radiation shields surrounding the coil tank via a mounting structure. Liquid helium at an operating temperature of approximately 4.2 K is the first cryogenic, fluid and helium at an operating temperature of <3.5 K is the second cryogenic fluid in the coil tank. The mounting structure has mounting elements with thermally conductive contact points thermally coupled to heat sinks having a temperature at or below that of the storage tank, via thermal conductor elements. This ensures long times to quench if malfunctions occur.

Techniques facilitating efficient thermal profile management within cryogenic environments are provided. In one example, a cryostat can comprise a plurality of thermal stages intervening between a 4-Kelvin (K) stage and a Cold Plate stage. The plurality of thermal stages can include a Still stage and an intermediate thermal stage that provides additional cooling capacity for the cryostat. The intermediate thermal stage can be directly coupled mechanically to the Still stage via a support rod.

A cryostat assembly comprises an outer container that houses a coil tank with a superconducting magnet coil system and a first cryogenic fluid, and a storage tank with a second cryogenic fluid. The coil tank is secured to the outer container by a first suspension element and the storage tank is secured to the outer container by a second suspension element. The storage tank is thermally connected to a cover element having a mechanical and thermally-conductive connection to a tube element and to the first suspension element. The cover element connects to the storage tank via a resilient, heat-conducting connection that is in thermal contact with the cover element and the storage tank. This allows thermal coupling between the storage tank and cover element, and independent relative movements between the storage tank and cover element, while suppressing relative movements between the tube element and the superconducting magnet coil system.

Techniques facilitating multiple cryogenic systems sectioned within a common vacuum space are provided. In one example, a cryostat can comprise a plurality of thermal stages and a thermal switch. The plurality of thermal stages can intervene between a 4-Kelvin (K) stage and a Cold Plate stage. The plurality of thermal stages can include a Still stage and an intermediate thermal stage that can be directly coupled mechanically to the Still stage via a support rod. The thermal switch can be coupled to the intermediate thermal stage and an adjacent thermal stage. The thermal switch can facilitate modifying a thermal profile of the cryostat by providing a switchable thermal path between the intermediate thermal stage and the adjacent thermal stage.