Techniques for fabricating and using arrays of violet-emitting LEDs coated with densely-packed-luminescent-material layers together with apparatus and method embodiments thereto are disclosed.

A semiconductor lamp (1) comprises a housing (2) in which a driver (3) is accommodated and at least one contact pin (6) protruding from the housing (2) outwards, wherein the contact pin (6) is tubular and riveted to the housing (2) and the driver (3) is connected to the contact pin (6) via an electrically conductive connection element (12) which is inserted into a cavity (13) of the contact pin (6). A method serves for producing a semiconductor lamp (1), wherein at least one tubular contact pin (6) is inserted into a feedthrough (5) of a housing (2) from outside till the contact pin (6) abuts the housing (2), the contact pin (6) is next riveted with the housing (2) on the inside and a driver (3) is inserted into the housing (2), whereby an electrically conductive connection element (12) is inserted into the contact pin (6). The invention is particularly applicable to LED retrofit lamps for replacing bipin halogen lamps, in particular MR16 lamps.

A semiconductor lamp (1) comprises a housing (2) in which a driver (3) is accommodated and at least one contact pin (6) protruding from the housing (2) outwards, wherein the contact pin (6) is tubular and riveted to the housing (2) and the driver (3) is connected to the contact pin (6) via an electrically conductive connection element (12) which is inserted into a cavity (13) of the contact pin (6). A method serves for producing a semiconductor lamp (1), wherein at least one tubular contact pin (6) is inserted into a feedthrough (5) of a housing (2) from outside till the contact pin (6) abuts the housing (2), the contact pin (6) is next riveted with the housing (2) on the inside and a driver (3) is inserted into the housing (2), whereby an electrically conductive connection element (12) is inserted into the contact pin (6). The invention is particularly applicable to LED retrofit lamps for replacing bipin halogen lamps, in particular MR16 lamps.

A light module (1) serves for inserting into a housing (23) of a semiconductor lamp (24) and comprises: a driver (2), a cooling element (10), a light generator (15), abutting the cooling element, with at least one semiconductor light source (17), which is electrically connected with the driver (2), and an optical refraction element (18) covering the at least one semiconductor light source, wherein the refraction element is fastened on the cooling element and presses the light generator (15) onto the cooling element. A semiconductor lamp (24) comprises a housing open at the front into which the light module is inserted from the front side and on which the light module is fastened. A method serves for producing a semiconductor lamp, wherein at least the driver, the cooling element, the light generator and the refraction element are assembled into an individually manageable light module and the light module is then inserted into a housing. The invention is also applicable to replacement or retrofit lamps, in particular with a pin base, particularly a bipin base, e.g. to retrofit lamps for replacing halogen lamps, for example of the type MR16.

A lighting device, such as a light-emitting diode (LED) light source, may operate in an interim operable state to avoid and/or prevent undesirable characteristics in the light emitted by the lighting device (e.g., strobing and/or flickering of a brightness of the light and/or shifting or change of a color of the light). When operating in a normal state, the control circuit may determine if a measured value of a first operational characteristic (e.g., a forward voltage of an emitter of the lighting device) is outside of a range and operate in the interim operable state if the measured value of the first operational characteristic is outside of the range. When operating in the interim operable state, the control circuit may adjust a drive current for the emitter in response to a measured value of a second operational characteristic (e.g., a forward voltage of a detector of the lighting device).

A lighting device, such as a light-emitting diode (LED) light source, may operate in an interim operable state to avoid and/or prevent undesirable characteristics in the light emitted by the lighting device (e.g., strobing and/or flickering of a brightness of the light and/or shifting or change of a color of the light). When operating in a normal state, the control circuit may determine if a measured value of a first operational characteristic (e.g., a forward voltage of an emitter of the lighting device) is outside of a range and operate in the interim operable state if the measured value of the first operational characteristic is outside of the range. When operating in the interim operable state, the control circuit may adjust a drive current for the emitter in response to a measured value of a second operational characteristic (e.g., a forward voltage of a detector of the lighting device).

A variable resistance power adjustment device and lamp. The variable resistance power adjustment device includes a mounting base, keycap and resistance adjustment module. The mounting base connecting to the lamp body, working with the lamp body to form a mounting cavity in an enclosure way and provided with a through-hole connecting to the mounting cavity; a keycap connecting to the mounting base flexibly and stretching into the through-hole partially; the resistance adjustment module provided in the mounting cavity, the adjustment part of the resistance adjustment module connecting to the keycap, the resistance adjustment module connects to the driving power supply of the lamp body; the keycap moves to drive the adjustment part of the resistance adjustment module to move, so that the corresponding resistance can be switched into the driving power supply from the resistance adjustment module and the resistance adjustment module adjusts the power of the whole lamp body.

A variable resistance power adjustment device and lamp. The variable resistance power adjustment device includes a mounting base, keycap and resistance adjustment module. The mounting base connecting to the lamp body, working with the lamp body to form a mounting cavity in an enclosure way and provided with a through-hole connecting to the mounting cavity; a keycap connecting to the mounting base flexibly and stretching into the through-hole partially; the resistance adjustment module provided in the mounting cavity, the adjustment part of the resistance adjustment module connecting to the keycap, the resistance adjustment module connects to the driving power supply of the lamp body; the keycap moves to drive the adjustment part of the resistance adjustment module to move, so that the corresponding resistance can be switched into the driving power supply from the resistance adjustment module and the resistance adjustment module adjusts the power of the whole lamp body.

An LED lamp includes: a lamp shell; a passive heat dissipating element having a heat sink connected to the lamp shell; a power source disposed in the lamp shell; and a light emitting surface connected to the heat sink of the passive heat dissipating element and comprising LED chips electrically connected to the power source. The power source comprises a power board and a plurality of electronic components mounted thereon. The power board is divided into a first mounting zone and a second mounting zone by an axis, total weight of the electronic components on the second mounting zone is greater than total weight of the electronic components on the first mounting zone, and a heat dissipating element is provided on the first mounting zone to balance the two zones of the power board in weight.

An LED lamp includes: a lamp shell; a passive heat dissipating element having a heat sink connected to the lamp shell; a power source disposed in the lamp shell; and a light emitting surface connected to the heat sink of the passive heat dissipating element and comprising LED chips electrically connected to the power source. The power source comprises a power board and a plurality of electronic components mounted thereon. The power board is divided into a first mounting zone and a second mounting zone by an axis, total weight of the electronic components on the second mounting zone is greater than total weight of the electronic components on the first mounting zone, and a heat dissipating element is provided on the first mounting zone to balance the two zones of the power board in weight.