The present invention relates to the technical field of vehicle illumination and, in particular, relates to a vehicle lamp optical element assembly, a vehicle lamp comprising the vehicle lamp optical element assembly, and an automobile comprising the vehicle lamp. The vehicle lamp optical element assembly comprises a primary optical element assembly and a secondary optical element assembly, wherein the primary optical element assembly comprises a primary optical element and a first support for supporting the primary optical element, and the secondary optical element assembly comprises a secondary optical element and a second support for supporting the secondary optical element, wherein the first support and the second support are connected in a matching manner so as to enable the primary optical element and the secondary optical element to be relatively fixed. The primary optical element and the secondary optical element are assembled into an integral structure, such that relative positions of the primary optical element and the secondary optical element are directly determined, and direct positioning between the primary optical element and the secondary optical element is realized. The positioning precision and the mounting reliability of the primary optical element and the secondary optical element can be ensured, such that the accuracy and functional stability of a light shape of the vehicle lamp are ensured.

In a vacuum valve, as a heat dissipation structure thereof, a heat dissipation layer is provided to a part of the surface of each of a fixed conductor and a movable conductor which are a heat generation part, and a radiation heat absorption layer is provided to an insulation cylinder so as to be opposed to the heat dissipation layer. The heat dissipation layer and the radiation heat absorption layer are each formed from a ceramic having a high emissivity. Heat generated at the fixed conductor and the movable conductor is radiated by the heat dissipation layer, to be absorbed by the radiation heat absorption layer, and then radiated to the outside of the vacuum valve from the radiation heat absorption layer and a ceramic layer.

A circuit board, a light-emitting diode (LED) retrofit lamp for use with the circuit board and a method of manufacturing an LED retrofit lamp are described herein. A circuit board includes a body part and two longitudinal fingers symmetrically extending from the body part in a longitudinal direction of the LED retrofit lamp.

The present invention relates to a support for a light source of a lighting device of a motor vehicle, including a zone for positioning the light source, referencing elements with respect to three given mutually transverse axes, one of the referencing elements, termed a referencing element with two portions, a first portion extending along or parallel to a first axis of the three given axes, and a second portion extending transversely relative to this first given axis.

A method of manufacturing a light-emitting device includes: providing a first intermediate structure including a substrate, light-emitting elements arrayed in a first direction, a protective element, and light-transmissive members; forming a resin wall including first and second walls extending in the first direction, and third and fourth walls, a first distance between the first wall and the light-emitting elements being larger than a second distance between the third or fourth wall and a corresponding one of light-emitting elements; applying a first resin to a first region between the first wall and the light-emitting elements in which the protective element is disposed, resulting in forming a first recess in the first region and a second recess in a second region between the second wall and the light-emitting elements; and forming a covering member by applying a second resin to the first and second recesses and curing the first and second resins.

Provided is a light source device, including: a light-emitting chip arranged on a base plate and configured to emit first light; a light guide rod including first and second light guide portions, the first light guide portion including a light incident end surface, the first light entering the light guide rod through the light incident end surface and being transmitted to the second light guide portion after passing through the first light guide portion, and the second light guide portion including a light-outputting surface for outputting light; a first positioning member including a first groove for accommodating the light guide rod, being directly or indirectly fixed relative to the base plate; and a movable fixing assembly configured to fix, together with the groove of the first positioning member, the light guide rod along a radial direction of the light guide rod, and deforms when fixing the light guide rod.

A heatsink, a light-emitting diode (LED) module and a corresponding method of manufacture are described. A heatsink includes an electrically conductive heatsink core and an electrically insulating layer covering at least the first surface of the electrically conductive heatsink core. The electrically conductive heatsink core has a first pin that is integral with the electrically conductive heatsink core and protrudes from a first surface of the heatsink core. At least the first surface of the heatsink core is covered by an electrically insulating layer, which leaves at least portions of a lateral surface of the first pin exposed from the electrically insulating layer.

Disclosed is a light-emitting module, comprising: a circuit board, a conductive layer, a light-emitting device, and an adhesive material. The circuit board comprises a device-attachment area, the conductive layer being disposed on the device-attachment area, the light-emitting device being disposed on the conductive layer and electrically connected to the circuit board through the conductive layer, and the adhesive layer being used for connecting the light-emitting device to the circuit board, wherein a curing temperature of the adhesive layer is lower than a melting point of the conductive layer. Adopting the aforementioned technical means, the degree of offset in the position of the light-emitting device after reflow soldering can be greatly reduced. In addition, a vehicle lamp device using the light-emitting module is also provided.

A light-emitting device includes: a mounting board; a light-emitting element disposed on or above the mounting board; a plate-shaped light-transmissive member having: a first surface; and a second surface facing a light-emitting surface of the light-emitting element; a light-reflective member covering a lateral surface of the light-transmissive member; and a light-shielding frame on an upper surface of the light-reflective member around the light-transmissive member. The light-shielding frame has an opening. An inner perimeter of the opening is located apart from outer perimeters of the first surface and the second surface of the light-transmissive member in a top plan view. The light-reflective member is disposed between the inner perimeter of the opening and the outer perimeters of the light-transmissive member.

There is a self heating light comprising a body and a cover. Disposed inside of the body is a circuit board, a light element, a heat transfer device, a temperature sensor, a heating element, a power contact, and a switch. The switch is configured to switch power between the heating element and the light depending on a predetermined temperature of determined by the temperature sensor inside of the body of the light.