An LED tube lamp comprises: a glass lamp tube; a light diffusion layer disposed on a surface of the glass lamp tube; an LED light strip, which comprises a fixing portion and an extending portion disposed in the glass lamp tube; a plurality of LED light sources mounted on the fixing portion of the LED light strip; a fixing structure disposed between the fixing portion and the inner circumferential surface the glass lamp tube; a power supply module disposed on the fixing structure and electrically connecting to the LED light strip and two end caps attached to two ends of the glass lamp tube respectively. The fixing structure comprises a first end fixedly connected to the inner circumferential surface of the glass lamp tube and a second end fixedly connected to the fixing portion of the LED light strip and not connected to the extending portion of the LED light strip.

The present disclosure is directed to examples of housing for a luminaire. In one example, the housing includes a bioplastic base formed to receive a light emitting diode and a driver and a lens coupled to the bioplastic base. The bioplastic base may include a bioplastic and is formed with a non-biodegradable or a biodegradable plastic.

An LED panel light includes a flexible base film, a plurality of circuits arranged on the flexible base film and a plurality of LED lamp beads arranged on the flexible base film, each circuit is connected with at least one LED lamp bead and is provided with at least two mutually parallel conductive wires. The conductive wire consists of a plurality of secondary conductive wires, and a plurality of the secondary conductive wires form a mesh. A method of making a LED panel light includes the following specific steps: S1: providing a flexible base film; S2: manufacturing a plurality of mesh-type conductive wires on the flexible base film by using a mould with circuit patterns of LED panel light; conductive wires forming a circuit, and a plurality of the circuits forming an LED panel light circuit; S3: connecting LED lamp beads with the conductive wires in the circuits.

An LED package includes a light source, a light transmissive member, and a light reflecting layer. The light source includes a resin package, a light emitting element and a wavelength conversion material. The resin package includes first and second leads and a resin member. The resin package defines a recess having a bottom face defined by portions of the first and second leads, and a portion of the resin member, and a lateral wall defined by a portion of the resin member. The light emitting element is disposed on or above the bottom face in the recess. The wavelength conversion material is disposed in the recess. The light transmissive member is disposed on or above the light source. The light reflecting layer is disposed on or above the light transmissive member at least on an upper side along an optical axis of the light emitting element.

The invention provides a method for producing a 3D item (1) by means of fused deposition modelling, the method comprising a 3D printing stage comprising layer-wise depositing an extrudate (321) from 3D printable material (201), to provide the 3D item (1) comprising 3D printed material (202), wherein the 3D item (1) comprises a plurality of layers (322) of 3D printed material (202), wherein each layer (322) has a layer height (H) and a layer width (W), wherein the 3D printing stage comprises generating a stack (1322) of the layers (322) of the 3D printed material (202), wherein at a fixed first x,y-position the layer height (H) is varied layer by layer for a subset of a total number of layers (322), wherein either (i) the layer height (H) increases for consecutive layers (322) and then the layer height (H) decreases for consecutive layers (322), or (ii) the layer height (H) decreases for consecutive layers and then the layer height (H) increases for consecutive layers (322); and wherein at least part of the 3D printable material (201) comprises light transmissive polymeric thermoplastic material (401).

To provide a semiconductor light emitting device which is capable of accomplishing a broad color reproducibility for an entire image without losing brightness of the entire image. A light source provided on a backlight for a color image display device has a semiconductor light emitting device comprising a solid light emitting device to emit light in a blue or deep blue region or in an ultraviolet region and phosphors, in combination. The phosphors comprise a green emitting phosphor and a red emitting phosphor. The green emitting phosphor and the red emitting phosphor are ones, of which the rate of change of the emission peak intensity at 100° C. to the emission intensity at 25° C., when the wavelength of the excitation light is 400 nm or 455 nm, is at most 40%.

A resistance water lamp includes: a main body, made of plastic material, and being a transparent hollow three-dimensional type, low boiling point liquid filled in an inside thereof, and an accommodation tank, fixed to one side of the main body, an inside thereof provided with an electric control unit including at least one electric heater and power source, the electric heater positioned correspondingly to the side of the main body, and power thereof provided by the power source, the electric heater producing a thermistor effect and generating heat energy when the electric heater is energized, thereby driving the liquid inside the main body to generate relative flowing with the heat energy.

A light emitting device includes a substrate, a light source, a cover member, a light transmissive member disposed on or above the light source, a light reflecting layer disposed on or above the light transmissive member, and a light transmissive cover member. The cover member is made of a resin material containing a light reflecting substance and covers a lateral face of the light source. The light transmissive cover member covers at least a lateral face of the light transmissive member and includes an annular lens part. A thickness of a portion of the light transmissive cover member disposed above a perimeter of the light reflecting layer is larger than a thickness of a portion of the light transmissive cover member disposed above a portion of the light reflecting layer where an optical axis of the light emitting element passes through.

An LED light fixture for a hazardous location includes an axially elongated enclosure fabricated from a glassfiber reinforced plastic material, at least one axially elongated linear light emitting diode (LED) module mounted in the enclosure, and an LED driver module mounted in the housing that operates the at least one linear light emitting diode. The LED driver module and the at least one axially elongated linear LED module are operable within a target peak temperature limit for the hazardous location, without utilizing heat sinks to dissipate heat in order to provide acceptable thermal management.

The invention relates to a multi-layered body comprising a transparent thermoplastic layer, a diffuser layer and a metal layer which, despite a decorative, structured visible surface, can transport information from a projection unit behind it with excellent sharpness and brightness. Corresponding elements can be used, for example, in Car-to-X communication.