A device includes a carrier and a plurality of semiconductor chips configured to generate radiation. The carrier includes a lead frame. The lead frame includes two connecting parts for external electrical contacting of the device. The semiconductor chips are arranged on the carrier. The carrier is surrounded by a casing at least in places along its entire circumference. The casing forms a side face of the device at least in places. The side face includes traces of material removal.

A LED strip having LED chips and a strip to which the LED chips are fixed and which also functions as a support structure of conductors coupled with the LED chips, and a tube manufactured from an elastic and at least partly light-transmitting material and surrounding the strip with the LED chips. At the outer surface of the tube there is a fixing element which is in essential parts of the same material as the tube. The LED strip includes a thermal conduction part which is of a material different from the tube and which, in the cross-section of the LED strip, is directed outwards from the inner surface of the tube for conducting waste heat generated in the LED chips out from the tube.

A light source device includes: a light source having an upper surface including a light-emitting surface, the light source comprising a plurality of light-emitting parts arranged in a two-dimensional array; a lens located above and spaced apart from the light-emitting surface of the light source, wherein the lens comprises an optically functional part, and a flange part located along an outer periphery of the optically functional part; and a support part formed of a light-shielding material and configured to support at least the flange part of the lens. A surface area of a first surface of the optically functional part is greater than a surface area of a second surface of the optically functional part. The flange part defines at least one first recess in a surface located at a same side as the second surface.

The invention provides a light generating device (1000) comprising an LED filament (100), wherein the LED filament (100) comprises a support (105), a set (107) of solid state light sources (110), and an encapsulant (160), wherein: (I) the LED filament (100) has a length axis (108) having a first length (L1); (II) the solid state light sources (110) are arranged over the first length (L1) of the LED filament (100) on the support (105), wherein the solid state light sources (110) are configured to generate light source light (111); (III) the encapsulant (160) encloses at least part of each of the solid state light sources (110) of the set (107) of solid state light sources (110), wherein the encapsulant (160) comprises a luminescent material (200) configured to convert at least part of the light source light (111) into luminescent material light (201); (IV) the light generating device (1000) is configured to generate device light (1001) comprising one or more of (i) the light source light (111) and (ii) the luminescent material light (201); (V) for each of the solid state light sources (110) of the set (107) of solid state light sources (110) applies that relative to a first virtual plane (171) parallel to the length axis (108) and intersecting with the solid state light source (110) the encapsulant (160) is asymmetrically configured relative to the first virtual plane (171).

A light emitting diode (LED) light source is disclosed. The LED light source comprises a lens structure that includes a hemispherical dome with a base. The LED light source comprises a cavity in the base. The cavity has an opening and a taper such that a cross-section area within the cavity is smaller than an area of the opening. The LED light source comprises a light emitting device comprising an LED die contacting the taper. The taper allows for easy insertion of the LED die into the lens structure. The taper serves to accurately align the LED die when the LED die is inserted.

The present disclosure provides a full-color COB device, including a substrate, where a light-emitting region is provided on an upper surface of the substrate, the light-emitting region includes a white light-emitting region and an atmosphere lighting region, the atmosphere lighting region is a closed ring-shaped structure, and the atmosphere lighting region encloses the white light-emitting region. A plurality of warm light-emitting modules and a plurality of cold light-emitting modules are disposed in the white light-emitting region, and the warm light-emitting module and the cold light-emitting module are disposed in a staggered manner. A plurality of red light-emitting modules, a plurality of green light-emitting modules, and a plurality of blue light-emitting modules are disposed in the atmosphere lighting region, and the red light-emitting modules, the green light-emitting modules, and the blue light-emitting modules are disposed in a staggered manner. This technical solution proposes a full-color COB device.

A method of manufacturing a light-emitting device includes: providing a light source having a first substrate and a light-emitting element coupled to the first substrate, and a second substrate defining one or more recesses or one or more through-holes; and positioning the second substrate above the first substrate, and adjusting a position of the second substrate such that the one or more recesses or the one or more through-holes define at least a part of one or more positioning holes respectively positioned at predetermined distances from a light-emitting part of the light source in a top plan view.

An anti-loosing structure includes a first buckle element and a second buckle element. The first buckle element has a first substrate and a clamping portion disposed on the first substrate. The second buckle element has a second substrate, an embedding portion disposed on the second substrate, and an anti-loosing block. The embedding portion is made of an elastic material, the anti-loosing block is movably disposed in the embedding portion, and is configured to cause the embedding portion to be elastically expanded. The embedding portion is configured to be inserted into the clamping portion, causing the embedding portion to connect to the clamping portion by interference fitting.

A dual in-line package (DIP) light emitting diode (LED) device includes a molded member, a positive lead passing through and fixed to the molded member, the positive lead comprising an upper end and lower end, a negative lead passing through and fixed to the molded member, the negative lead comprising an upper end and lower end, and at least one LED body connected to the top ends of the positive lead and the negative lead. The lower ends of the positive lead and the negative lead are flush with each other. The top end of the positive lead is higher than the top end of the negative lead. The positive lead and the negative lead are both bent at the top ends thereof.

The present invention relates to an optical structure for producing a decorative lighting effect in a lighting device, and a lighting device comprising at least one of the optical structure, wherein the optical structure comprises an optical element formed in one piece and comprising at least one opening; and an LED-filament comprising a substrate and a plurality of light sources arranged on the substrate, the substrate being at least partly made of a flexible material; wherein the at least one opening is adapted to receive the LED-filament such that a portion of the LED-filament extends through and is at least partly enclosed by a surrounding wall of the at least one opening such that the LED-filament is guided by and held in place by means of the at least one opening of the optical element and wherein light emitted from the LED-filament interacts with the optical element.