An electronic product with a light emitting function is provided. The electronic product includes a supporting structure, a light emitting structure and a cavity. The light emitting structure is bonded on the supporting structure. The light emitting structure includes a film, a conductive circuit and a light emitting device. The conductive circuit is formed on the film. The conductive circuit is enclosed between the supporting structure and the film. The light emitting device is disposed on the conductive circuit. The cavity is formed between the supporting structure and the light emitting structure, and the light emitting device is received in the cavity.

A lamp holder for an LED string light includes a lamp housing, an LED lighting module, a plug, and a socket. An open end of the lamp housing is pre-sintered with an encapsulation layer. The LED lighting module is disposed in the lamp housing, and has a cathode pin and an anode pin extending out from the encapsulation layer. Because the LED lighting module is pre-encapsulated in the lamp housing, when installed, only the LED lighting module and the plug need to be assembled so as to complete the assembly of the lamp housing, the LED lighting module and the plug. This reduces the assembly steps for production.

An automotive luminous signaling glazing for example forming a laminated vehicle front windshield, includes a first exterior glazing, with a first main face and a second main face; a lamination interlayer made of polymeric material and a set of electrically conductive wires anchored on an anchoring face of the lamination interlayer, which is either the fifth main face or the sixth main main of the lamination interlayer; an interior second glazing, with a third main face and a fourth main face, the second main face and the third main face being the internal faces of the laminated glazing; and a set of diodes emitting in the direction of the interior glass. For each of the diodes, the lamination interlayer comprises a blind aperture on the opposite face to the anchoring face.

Optics over a light source, such as, but not limited to, an LED on a circuit board. The optic does not entirely encapsulate the LED but rather includes an inner surface such that an air gap exists between the optic and the LED. The optic may include a lens and may conform to the shape of the circuit board.

A light-emitting module according to an embodiment includes a first insulating film with light transmissive property, a plurality of mesh patterns including a plurality of first line patterns and a plurality of second line patterns, a light-emitting element, and a resin layer. The first line patterns are formed on the first insulating film and are parallel to one another. The second line patterns intersect with the first line patterns and are parallel to one another. The light-emitting element is connected to any two of a plurality of the mesh patterns. The resin layer holds the light-emitting element to the first insulating film. A first mesh pattern and a second mesh pattern adjacent to one another among the plurality of mesh patterns have a boundary. Line patterns projecting from the first mesh pattern to the boundary and line patterns projecting from the second mesh pattern to the boundary are collocated along the boundary in a state of being adjacent to one another.

A light emitting diode (LED) light source is disclosed. The LED light source comprises a lens structure that includes a hemispherical dome with a base. The LED light source comprises a cavity in the base. The cavity has an opening and a taper such that a cross-section area within the cavity is smaller than an area of the opening. The LED light source comprises a light emitting device comprising an LED die contacting the taper. The taper allows for easy insertion of the LED die into the lens structure. The taper serves to accurately align the LED die when the LED die is inserted.

A method of manufacturing a light-emitting device includes: providing a light source having a first substrate and a light-emitting element coupled to the first substrate, and a second substrate defining one or more recesses or one or more through-holes; and positioning the second substrate above the first substrate, and adjusting a position of the second substrate such that the one or more recesses or the one or more through-holes define at least a part of one or more positioning holes respectively positioned at predetermined distances from a light-emitting part of the light source in a top plan view.

A downlight lighting assembly comprising a plurality of notches and engaging members to ease the alignment and assembly of the components. The downlight lighting assembly comprises an LED chip removably connected to a heatsink with a mixing chamber secured to the heatsink, where securing the mixing chamber to the heatsink provides the compressive force for an LED connector to engage and provide the electrical connection to the LED chip. The heatsink also has a plurality of protrusions on its upper edge to engage a lower wall of a reflector to secure the reflector to the lighting assembly.

Optics over a light source, such as, but not limited to, an LED on a circuit board. The optic does not entirely encapsulate the LED but rather includes an inner surface such that an air gap exists between the optic and the LED. The optic may include a lens and may conform to the shape of the circuit board.

A light-emitting module according to an embodiment includes a first insulating film with light transmissive property, a plurality of mesh patterns including a plurality of first line patterns and a plurality of second line patterns, a light-emitting element, and a resin layer. The first line patterns are formed on the first insulating film and are parallel to one another. The second line patterns intersect with the first line patterns and are parallel to one another. The light-emitting element is connected to any two of a plurality of the mesh patterns. The resin layer holds the light-emitting element to the first insulating film. A first mesh pattern and a second mesh pattern adjacent to one another among the plurality of mesh patterns have a boundary. Line patterns projecting from the first mesh pattern to the boundary and line patterns projecting from the second mesh pattern to the boundary are collocated along the boundary in a state of being adjacent to one another.