Provided are a substrate used for an LED encapsulation, a three-dimensional LED encapsulation comprising the substrate, a bulb comprising the three-dimensional LED encapsulation and a manufacturing method therefor. The substrate is spiral lines in shape, at least one of the ends of the substrate is provided with an electrode lead wire, the electrode lead wire is connected with the substrate by a connective component and/or connective materials, the spiral lines of the substrate comprise gaps between each other, and a smooth curve and/or a plurality of polylines end to end is formed at least partly at the edge of the substrate. The three-dimensional LED encapsulation and the bulb comprising the three-dimensional LED encapsulation comprise the substrate, multiple LED chips in series and/or parallel are arranged on the substrate, the multiple LED chips are let out by the electrode lead wire of one end of the substrate and the other end of the substrate as the other electrode lead wire. All-dimensional and three-dimensional and multilayer light-emitting of the bulb may be realized, moreover, the heat is easy to dissipate, the structure is simple to manufacture, and the cost is low.

A vehicle roof element is specified, including a glass pane having an exterior side and an interior side, and a transparent sealing compound which is fastened to the glass pane on the inside, at least one LED and at least one electrical line by means of which the LED is adapted to be contacted being embedded in the sealing compound. The at least one LED and the at least one electrical line are arranged on a flexible foil to which the sealing compound is integrally injection-molded.

A LED module (14) including a circuit board (20) provided with electrical conductors and defining opposed circuit board first and second surfaces (61 and 62); a power input (40) electrically coupled to the electrical conductors; LEDs (22) provided on the circuit board first surface (61), each LED (22) defining a light emitting surface (23) facing substantially away from the circuit board (20), the LEDs (22) being electrically coupled to the electrical conductors for being powered when the power input is powered; an encapsulation layer (50) having an encapsulation layer index of refraction and covering the circuit board first surface (61) and the LEDs (22); a CCT correcting layer (48) having a CCT correcting layer index of refraction and coating at least part of at least one of the light emitting surfaces (23) and provided between the at least part of the at least one of the light emitting surfaces (23) and the encapsulation layer (50). The CCT correcting layer and encapsulation layer indices of refraction differ from each other.

Provided is a light-emitting device in which a light-emitting region is increased in size without decreasing the yield. This light-emitting device includes a central light-emitting unit, and a plurality of peripheral light-emitting units arranged to fill a periphery of the central light-emitting unit, wherein each of the central light-emitting unit and the peripheral light-emitting units includes a substrate and light-emitting elements mounted on the substrate, and an area of the light-emitting region of each of the peripheral light-emitting units is equal to or smaller than an area of the light-emitting region of the central light-emitting unit.

A dual-color light string comprising a first insulated electrical wire cord, a second insulated electrical wire, two light-emitting diode devices (LED devices) and transparent glue. The first insulated electrical wire is partially exposed to form a first soldering section. The second insulated electrical wire is partially exposed to form a second soldering section. The two LED devices are respectively electrically connected to the first soldering section and the second soldering section, and the directions of bias of the two LED devices from the first soldering section to the second soldering section are opposite to each other; The transparent glue covers the two LED devices, the first soldering section and the soldering section, extends to partially cover a first insulating layer of the first insulated electrical wire and a second insulating layer of the second insulated electrical wire.

An LED light fixture with at least two sets of LED light sources, at least three subcircuits for a respective one of the at least two sets of LED light sources and for a combination of at least two of the sets of LED light sourceswherein the correlated color temperature differs for each of the at least two sets of LED light sources and the combination of at least two of the sets of LED light sources.

An LED light fixture with at least two sets of LED light sources, at least three subcircuits for respective one of the at least two sets of LED light sources and for a combination of at least two of the sets of LED light sourceswherein the correlated color temperature differs for each of the at least three subcircuits and the combination of at least two of the sets of LED light sources.

In various embodiments, a lighting device is provided. The lighting device may include at least one first part and at least one second part, fastened to the first part, which first and second parts are interconnected by a potting compound, the parts being positively interconnected by the potting compound.

A lens structure is pre-formed with features that facilitate accurate alignment of a light emitting chip within the lens structure. To ease manufacturing, the features include tapered walls that allow for easy insertion of the light emitting chip into the lens structure, the taper serving to accurately align the light emitting chip when the chip is fully inserted. The taper may include linearly sloped or curved walls, including complex shapes. An adhesive may be used to secure the light emitting chip to the lens structure. The light emitting chips may be picked-and-placed into an array of lens structures, or picked-and-placed onto a substrate that may be overlaid by the array of lens structures.

A light emitting device includes a light emitting element with first and second electrodes formed on the same surface side; a base with first and second conductive members, each including a wide part facing the an electrode and a narrow part extending away from the wide part; first and second bonding members each electrically connecting a corresponding electrode with a conductive member, and continuously covering the wide and narrow parts of a corresponding conductive member; and one or more light reflecting members at least partially covering the conductive members.